Change Language
PCBTok’s Brilliantly Crafted Red PCB
Due to the meticulous handling it received during the production process, PCBTok’s Red PCB has been performing its duties flawlessly.
- Whenever you need it, we’re here to help with specialized PCBs.
- We have over twelve years of experience in the field.
- Offering IPC Class 2 or 3 for all PCBs.
- We provide sample pieces prior to your bulk purchases.
- Prior to commencing our transaction, we accept factory inspections and audits coming from external agencies.
Particularly Notable Red PCB Products by PCBTok
PCBTok’s Red PCB has satisfied thousands of customers already because of its excellence; it has been serving well its purposes.
This has been made possible due to the unending hard work of PCBTok’s expert team to continuously develop and improve the products for customer satisfaction.
We are always doing our best to only serve you the Red PCB that is long-lasting and will cost you less in the long run of using the product.
Our mission in PCBTok is to fulfill your PCB needs flawlessly.
To provide unparalleled customer service and products, PCBTok continuously modernizes its production process to the best extent feasible and improves the abilities of every member of its professional staff.
Red PCB By Feature
The Double Layer PCB has been widely utilized in medical devices, industrial machinery, lighting, automotive, and aerospace industry because of its increased circuit density, relatively inexpensive cost, flexibility, and compact size board.
The Single Layer PCB has various types; however, it has somewhat similar benefits when deployed. Some of its advantages are its capability to be installed easily, it can be easily designed, fairly easy to drill, and easy to install electrical components.
The Multilayer PCB is frequently used in computers, heart monitors, fire alarms, satellite systems, and industrial controls. It is because of its wide array of benefits such as its increased functionality and capabilities, and its light size design.
The Rigid PCB is one of the most commonly utilized types of the board in the market. It is commonly found in GPS devices, computers, mobile phones, tablets, and many other electronic devices that require a sturdy and reliable foundation.
The High-Frequency PCB is famous for its exceptional signal integrity; it reduces the occurrences of signal loss. In addition, it has commendable thermal management and stability. It is frequently used in communications systems.
The Impedance Control PCB assists in providing an outstanding signal performance without any interference. This greatly affects the overall performance of the relationship between the power and the electrical components present on the board.
Red PCB By Base Material (5)
-
The FR4 PCB base material is known to have an exceptional dielectric strength; thus, it became the most widely used material among all others. This is known to be moisture resistant and it can perform well with various temperature conditions.
-
The Copper Red PCB is popular among consumers because of its excellent thermal management, heat dissipation, and outstanding electrical characteristics. It is widely used in the communications industry because it has excellent signal transmission.
-
The Aluminum PCB is known for its high durability and stability even when exposed to certain heat conditions that even ceramic and fiberglass materials cannot provide. They are commonly used in the lighting industry since it emits a high volume of heat.
-
The CEM-3 PCB is recognized for its extraordinary mechanical and electrical properties; thus, they are widely deployed in most medium to heavy applications including photocopying and fax machines, automotive electronics, and household appliances.
-
The CEM-1 PCB has good tolerance to punching processes. Just like the CEM-3, it also offers exceptional mechanical and electrical properties. It is highly popular in the mass assembly since it reduces the overall costs of manufacturing.
Red PCB By Layer (5)
-
The 2-Layer Red PCB is the second least number count of layers you can acquire. It is widely used by consumers since both sides of the board can be utilized and soldered. If seeking an inexpensive buy, and faster lead-time, this is the ideal option to take.
-
The 4-Layer Red PCB is widely used in automotive, consumer electronics, and many other heavy electronic applications. One of its advantages is its capability to produce exceptional signal integrity and enhanced thermal properties.
-
The 10-Layer Red PCB is widely deployed in heavy applications such as military, automotive, aerospace, and industrial processing. One of its advantages is its compact size and lightweight despite its many layers, exceptional durability, and improved power.
-
The 16-Layer Red PCB is known to be very powerful because of its high-speed and high-density characteristics. Due to this, it has become popular in satellite systems, communications systems, and many other applications that require a powerful board.
Strengths of PCBTok’s Red PCB
We have the following several advantages of PCBTok’s Red PCB:
- Manufacturing Time – Through the help of advanced technologies we have, Red PCB can be quick to build because of its suitability to those.
- Maintenance – It is recognized to be easy to maintain because of its labels.
- Cost – Most PCB designs utilize computerized systems and Red PCB isn’t an exemption; thus, using of the same design is possible.
- Electronic Noise – No occurrences of noise disturbance is present in a Red PCB.
If you wish to know more about the capabilities and strengths of a Red PCB, you can just send us a message and we’ll respond to you right away.
Physical Factors to Asses in a Red PCB
In order to have Red PCB that is reliable and functional, there are some physical properties you might want to look at. Here are a few of them:
- Strength – It should be able to withstand excessive force to prevent damage if the board might fall.
- High Quality – This will determine the overall functionality of your Red PCB; proper inspections should be conducted.
- Thickness – Assess its capability to withstand heavy components attached.
- Vias – To prevent dust build-up, it should have no empty vias.
For a comprehensive explanation of these properties, kindly inbox us.
PCBTok’s Red PCB Electrical Properties
Similar to its physical characteristics, a Red PCB should take into account the following electrical characteristics to maximize its performance.
- Electrical Strength – It should be able to withstand electrical breakdown; it has a typical value of 800 V/mil to 1500 V/mil.
- Volume Resistivity – Standard value should be 10 MW to be efficient.
- Surface Resistivity – To ensure that your board is capable of resisting insulation and electricity.
- Dielectric Constant – A value of between 3.5 and 5.5 to be efficient.
Just inbox us for further information about these properties.
PCBTok’s Edge in Producing High-Quality Red PCB
Red PCB from PCBTok has built a solid name for more than ten years, serving and gratifying thousands of clients thanks to its superior quality and outstanding performance in application.
All of our Red PCB and other PCB items are made to go through numerous checks and examinations in order to determine their optimum performance.
Additionally, PCBTok has adhered to the required accreditations to ensure that all of our Red PCB goods meet the established international standards. All of our PCB products are also guaranteed to be IPC Class 2 or 3 approved.
We have been constantly producing quality Red PCB efficient products, and we are highly motivated to continue it for further growth.
Red PCB Fabrication
All of the colored PCBs undergo a somewhat similar manufacturing process, and the Red PCB from PCBTok isn’t an exemption from that.
Nevertheless, PCBTok utilizes the most advanced and up-to-standard production method to produce a premium and superb Red PCB.
The basic process of making a Red PCB is cleaning, coating with ink, pre-hardening, development, and final hardening.
After the said stages, we will subject it to various testing to further solidify its performance and then send it again to professionals for assessment.
We are available 24/7; just send us any inquiry you have with regard to this.
There are a lot of surface finishes you can choose from for your Red PCB; however, we want to share with you the most efficient among all.
We offer all kinds of surface finishes; HASL, OSP, Immersion Silver, Immersion Tin, ENIG, ENEPIG, Hard Gold, and Wire Bondable Sold.
Among all of these, we highly recommend the ENIG due to its inexpensive cost and it doesn’t negatively react to components.
Moreover, it has lots of benefits incorporated. Also, it has been proven that ENIG is fairly easy to solder due to its excellent surface flatness.
Depending on your purpose, we can suggest the most suitable finish; just inbox us.
OEM & ODM Red PCB Applications
Due to the capability of a Red PCB to reduce electronic noise occurrences, they are a highly preferred board in the communications industry.
Most consumer electronics have the same design concepts and are produced in bulk; a Red PCB is capable of doing those in a quick manner.
Some of the medical instruments require regular maintenance both seasonal and annual; thus, they should use a board that is easy to maintain such as Red PCB.
One of the advantages of a Red PCB is its convenient portability, it can incorporate electronic components in the panel; hence, it is suitable for computer units.
Just like how the medical instruments require constant maintenance, almost all military devices need regular maintenance; a Red PCB is ideal for this.
Red PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Red PCB – The Ultimate FAQ Guide
In terms of PCB design, red boards stand out the most. The color helps distinguish the components on the board when magnification is required. On the other hand, blackboards are the most complex and difficult to track without tilting the board and projecting a beam of light. Fortunately, there are a few things you can do to improve the experience and make it more enjoyable and efficient.
The first question is, what exactly is a red solder mask layer? It makes sense to use a red solder mask if the boards are soldered together. Because the color is widely accepted, the price is reasonable. While the green soldermask is cheaper, it serves the same purpose of covering the component. Aesthetic appeal is also an important factor for some customers. However, if you plan to use see-through PCB components, this is a secondary consideration.