Make Advancements Using RF PCB by PCBTok
Nowadays, business moves at a breakneck pace.
- We respond quickly to any questions concerning PCBs and other high-performance Multilayer PCBs.
- If you need a quick quote for another RF PCB device, you get one in a matter of minutes.
- Our sales team has received extensive training, in English too.
- You’ll like our payment and affordability alternatives as well.
We will remain always affordable for the RF PCB option for you.
Placing Your RF PCB Needs First
As your PCB producer, we provide a complete and comprehensive solution for RF PCBs.
We can also serve as your EMS, providing you A-plus quality products at the lowest possible price.
This RF PCB line is a specialty product line—
We only release the items once testing, installation inspections, and PCB routing safety standards have been completed.
We prioritize your RF PCB requirements.
We will never sell you short.
RF PCB By Feature
RF PCB By Material (5)
RF PCB By Function (6)
Never Shortchange Your RF PCB Needs
With our RF PCB manufacturing and PCBA service, we help you get a competitive advantage.
A quick-turn PCB solution is provided for customers in a rush to expedite the product roll-out process.
We accept RF PCB prototype as well as other types of PCB prototyping.
We ensure that we have enough raw materials on hand to fulfill your orders.
We Manufacture All RF PCB Possibilities
Please do inquire about any RF PCB ideas you think of!
Our sales team is always happy to help you with your custom PCBs.
Because we appreciate your time, we monitor your local working hours.
We provide quotes based on your timeframe and timeline.
We are trained to speak in English as well as other important European languages.
We guarantee a high-quality RF PCB, at a low-cost.
Doing RF PCB Products Right
We consider helping you with RF PCB design requirements as our job.
We may expedite your RF PCB order after we receive your Gerber file.
However, we welcome too your requests for assistance in PCB design.
Kindly reach us, and we will assign skilled PCB engineers to assist you.
Please contact us contact us if you require any other RF PCB reverse engineering queries.
We’re here to help.
Multilayer RF PCB Expertise
PCBTok is well-known for its competence in RF PCB.
As a professional, you have the skills required to design your PCB from the ground up.
However, if you require further professional assistance to carry out your targeted ideas, we are here to assist you every step of the way.
We will never get in the way of your original RF PCB goals.
We will accompany your success in PCB business objectives.
RF PCB Fabrication
We understand that the cost of an RF PCB increases as the heat conductivity increases.
Our goods have a longer life due to our IS0-accredited Quality Control.
We design to keep your RF PCB OEM part from degrading.
But we guarantee that our price is the lowest—
Even as the product is mass-produced.
In RF PCBs, mounting sophisticated PCB components are possible.
These PCBs are mostly utilized in amplifiers, telecom (industry-grade), network applications, and other similar applications.
You should also keep in mind that RF PCB design is restrictive:
In that it necessitates knowledge of linear design, which must also be, at the same time passive. For these considerations, you want a competent manufacturer like PCBTok.
OEM & ODM RF PCB Applications
RF PCB Production Details As Following Up
|1||Layer Count||1-20 layers||22-40 layer|
|2||Base Material||KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)|
|3||PCB Type||Rigid PCB/FPC/Flex-Rigid||Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.|
|4||Lamination type||Blind&buried via type||Mechanical blind&burried vias with less than 3 times laminating||Mechanical blind&burried vias with less than 2 times laminating|
|HDI PCB||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating|
|5||Finished Board Thickness||0.2-3.2mm||3.4-7mm|
|6||Minimum Core Thickness||0.15mm(6mil)||0.1mm(4mil)|
|7||Copper Thickness||Min. 1/2 OZ, Max. 4 OZ||Min. 1/3 OZ, Max. 10 OZ|
|9||Maximum Board Size||500*600mm(19”*23”)||1100*500mm(43”*19”)|
|10||Hole||Min laser drilling size||4mil||4mil|
|Max laser drilling size||6mil||6mil|
|Max aspect ratio for Hole plate||10:1（hole diameter＞8mil）||20:1|
|Max aspect ratio for laser via filling plating||0.9:1(Depth included copper thickness)||1:1(Depth included copper thickness)|
|Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
|0.8:1(drilling tool size≥10mil)||1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)|
|Min. depth of Mechanical depth-control(back drill)||8mil||8mil|
|Min gap between hole wall and
conductor (None blind and buried via PCB)
|Min gap between hole wall conductor (Blind and buried via PCB)||8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)||7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)|
|Min gab between hole wall conductor(Laser blind hole buried via PCB)||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）|
|Min space between laser holes and conductor||6mil||5mil|
|Min space between hole walls in different net||10mil||10mil|
|Min space between hole walls in the same net||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)|
|Min space bwteen NPTH hole walls||8mil||8mil|
|Hole location tolerance||±2mil||±2mil|
|Pressfit holes tolerance||±2mil||±2mil|
|Countersink depth tolerance||±6mil||±6mil|
|Countersink hole size tolerance||±6mil||±6mil|
|11||Pad(ring)||Min Pad size for laser drillings||10mil(for 4mil laser via),11mil(for 5mil laser via)||10mil(for 4mil laser via),11mil(for 5mil laser via)|
|Min Pad size for mechanical drillings||16mil(8mil drillings)||16mil(8mil drillings)|
|Min BGA pad size||HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold)||HASL:10mil, LF HASL:12mil, other surface technics are 7mi|
|Pad size tolerance(BGA)||±1.5mil(pad size≤10mil);±15%(pad size>10mil)||±1.2mil(pad size≤12mil);±10%(pad size≥12mil)|
|1OZ: 3/4mil||1OZ: 3/4mil|
|2OZ: 4/5.5mil||2OZ: 4/5mil|
|3OZ: 5/8mil||3OZ: 5/8mil|
|4OZ: 6/11mil||4OZ: 6/11mil|
|5OZ: 7/14mil||5OZ: 7/13.5mil|
|6OZ: 8/16mil||6OZ: 8/15mil|
|7OZ: 9/19mil||7OZ: 9/18mil|
|8OZ: 10/22mil||8OZ: 10/21mil|
|9OZ: 11/25mil||9OZ: 11/24mil|
|10OZ: 12/28mil||10OZ: 12/27mil|
|1OZ: 4.8/5mil||1OZ: 4.5/5mil|
|1.43OZ（negative ）:5/8||1.43OZ（negative ）:5/7|
|2OZ: 6/8mil||2OZ: 6/7mil|
|3OZ: 6/12mil||3OZ: 6/10mil|
|4OZ: 7.5/15mil||4OZ: 7.5/13mil|
|5OZ: 9/18mil||5OZ: 9/16mil|
|6OZ: 10/21mil||6OZ: 10/19mil|
|7OZ: 11/25mil||7OZ: 11/22mil|
|8OZ: 12/29mil||8OZ: 12/26mil|
|9OZ: 13/33mil||9OZ: 13/30mil|
|10OZ: 14/38mil||10OZ: 14/35mil|
|13||Dimension Tolerance||Hole Position||0.08 ( 3 mils)|
|Conductor Width(W)||20% Deviation of Master
|1mil Deviation of Master
|Outline Dimension||0.15 mm ( 6 mils)||0.10 mm ( 4 mils)|
|Conductors & Outline
( C – O )
|0.15 mm ( 6 mils)||0.13 mm ( 5 mils)|
|Warp and Twist||0.75%||0.50%|
|14||Solder Mask||Max drilling tool size for via filled with Soldermask (single side)||35.4mil||35.4mil|
|Soldermask color||Green, Black, Blue, Red, White, Yellow,Purple matte/glossy|
|Silkscreen color||White, Black,Blue,Yellow|
|Max hole size for via filled with Blue glue aluminium||197mil||197mil|
|Finish hole size for via filled with resin||4-25.4mil||4-25.4mil|
|Max aspect ratio for via filled with resin board||8:1||12:1|
|Min width of soldermask bridge||Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)|
|Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
|Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)|
|Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)|
|Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)|
|15||Surface Treatment||Lead free||Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge|
|Aspect ratio||10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)|
|Max finished size||HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″；|
|Min finished size||HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″；|
|PCB thickness||HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm|
|Max high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mil|
|16||V-Cutting||Panel Size||500mm X 622 mm ( max. )||500mm X 800 mm ( max. )|
|Board Thickness||0.50 mm (20mil) min.||0.30 mm (12mil) min.|
|Remain Thickness||1/3 board thickness||0.40 +/-0.10mm( 16+/-4 mil )|
|Tolerance||±0.13 mm(5mil)||±0.1 mm(4mil)|
|Groove Width||0.50 mm (20mil) max.||0.38 mm (15mil) max.|
|Groove to Groove||20 mm (787mil) min.||10 mm (394mil) min.|
|Groove to Trace||0.45 mm(18mil) min.||0.38 mm(15mil) min.|
|17||Slot||Slot size tol.L≥2W||PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil)||PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil)|
|NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil)||NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil)|
|18||Min Spacing from hole edge to hole edge||0.30-1.60 (Hole Diameter)||0.15mm(6mil)||0.10mm(4mil)|
|1.61-6.50 (Hole Diameter)||0.15mm(6mil)||0.13mm(5mil)|
|19||Min spacing between hole edge to circuitry pattern||PTH hole: 0.20mm(8mil)||PTH hole: 0.13mm(5mil)|
|NPTH hole: 0.18mm(7mil)||NPTH hole: 0.10mm(4mil)|
|20||Image transfer Registration tol||Circuit pattern vs.index hole||0.10(4mil)||0.08(3mil)|
|Circuit pattern vs.2nd drill hole||0.15(6mil)||0.10(4mil)|
|21||Registration tolerance of front/back image||0.075mm(3mil)||0.05mm(2mil)|
|22||Multilayers||Layer-layer misregistration||4layers:||0.15mm(6mil)max.||4layers:||0.10mm(4mil) max.|
|Min. Spacing from Hole Edge to Innerlayer Pattern||0.225mm(9mil)||0.15mm(6mil)|
|Min.Spacing from Outline to Innerlayer Pattern||0.38mm(15mil)||0.225mm(9mil)|
|Min. board thickness||4layers:0.30mm(12mil)||4layers:0.20mm(8mil)|
|Board thickness tolerance||4layers:+/-0.13mm(5mil)||4layers:+/-0.10mm(4mil)|
|8-12 layers:+/-0.20mm (8mil)||8-12 layers:+/-0.15mm (6mil)|
|26||Impedance control||±5ohm(＜50ohm), ±10%(≥50ohm)|
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
“PCBTok responded quickly to my enquiry and was able to accommodate my PCB prototyping request the same day. The staff responded quickly to my enquiry and provided me with a speedy quote, which helped us decide to hire them because the price seemed reasonable. Very competent, highly recommended, and reasonably priced. Thank you very much.”Ishmael Garg, PCB Designer Engineer from Orlando, Florida, United States
“Professional and easy to work with. As a result, the original strategy was followed to a tee. My RF PCB design was executed flawlessly. We highly recommend PCBTok and will use them for all of our future outsourced OEM PCB needs. They are the only Experts who are willing to work with my hectic work schedule. That means a lot to me and my company.”Rémi Faver, Logistics Supervisor from France
“This company means a lot to me. We’ll keep looking for you when we need good PCB again. In preparation for future PCB and wiring tasks. When I requested detailed explanations, they supplied me videos of the precise things. They were quite knowledgeable, and what most struck me was that they went out of their way to offer to speak with competent component vendors for my PCB construction idea.”Eric Tschiggerl, PCB Layout Engineer from Austria
RF PCB – The Ultimate FAQ Guide
If you are new to the field of RF PCB, you may be wondering where to start. If this is your first time working on a circuit like this, the Ultimate FAQ Guide will be your best resource. With so many questions, it can be hard to know where to start. However, with PCBTok’s experience in technical customer service, you will be able to make the best decisions for your specific requirements.
When designing an RF PCB, you need to know how to create a multilayer design. This is because the materials used for the layers must meet strict specifications, including electrical and thermal properties. This is not the only consideration. You must also consider cost and ease of manufacturing. So, what materials should you bring? Here are some tips.
The grounding layer is an important part of the RF PCB design. The strength of the electromagnetic field is determined by the space around the alignment. The presence of conductors around the interconnect helps define the return path of the signal. Therefore, the top through-hole spacing must be greater than one-twentieth of the signal wavelength. For example, if you plan to use a single-layer design for RF, make sure the ground layer is close to the alignment.
Another requirement for RF PCB design is that the transmission lines have controlled impedance. The characteristic impedance of a PCB is determined by the dielectric type and thickness. The characteristic impedance is usually between 50 and 75 ohms. Ribbon wires are typically used for the inner layer. Prepreg laminates are used for the outer layers. A coplanar waveguide is the most efficient way to achieve maximum isolation.
When designing a board, both the size of the RF PCB and the density of its components must be considered. For example, the CTE values of multi-layer RF PCBs will vary because the lower layers will grow faster than the upper layers. This will have an impact on alignment issues. Or, you can choose a low CTE material that can withstand the physical stresses of assembly and drilling.
The design and layout of RF PCBs require specific domain knowledge and extensive PCB manufacturing experience. Design, assembly, safety, and PCB fabrication guidelines are provided. It also includes the involvement of PCB assembly suppliers, which is necessary to launch high-performance RF PCBs. Technical customer service, RF PCB manufacturing, and design are all areas of expertise for the authors. As such, he is an invaluable asset to anyone wishing to design, build, or fabricate RF PCBs.
Rogers RF PCB
The design of RF PCBs is more complex than typical analog or digital circuits. Because RF circuits use high-frequency analog signals, they are susceptible to the effects of noise. Therefore, RF PCBs must adhere to strict guidelines, which include minimizing high-frequency interference. The substrate material is also important because it affects the final design, thickness, and circuit layout. In the end, the functionality of the final product will be determined by the RF PCB.
Multi-layer RF PCBs need to be surface treated. Avoid aggressive surface treatment techniques that can deform soft materials. If the material deforms beyond a certain point, the material will not align properly. In addition, an incorrect surface finish may affect adhesion, leading to expensive replacements and delays. All of these elements are necessary for the successful production of RF PCBs.
The RF PCB design process is a complex one that requires a thorough understanding of RF circuits and extensive PCB manufacturing experience. This guide outlines the key design, assembly, and safety considerations, as well as PCB assembly vendor considerations. For high-performance RF PCB assembly, the involvement of the PCB assembly supplier is critical. PCBTok’s extensive experience in design and technical customer service is noteworthy.
Before designing an RF board, you should determine the impedance of the circuit. For example, an FR-4 PCB has a dielectric constant of 4.2, while the outer laminate has a dielectric constant of 3.8. These values can be used to calculate the impedance of an RF PCB, but be careful when entering values for the outer laminate. The dielectric constant of the external laminate is usually lower than that of the core layer, so an ER value of 3.8 for FR-4 is not sufficient. Use the shortest possible alignment lengths to get the best results.
When it comes to RF PCB design, materials are critical. Since RF PCBs often have more than one layer, a different material must be used for each layer. One of the most common approaches is to use different materials depending on the required electrical performance, thermal performance, and cost. For example, Rogers high-performance laminates can be used for the outer layers, while less expensive epoxy glass layers can be used for the inner layers.
RF microwave boards can be constructed using two types of traces: microstrip and metalized. Because they are easier to fabricate and assemble, microstrip lines are better suited for RF applications, while metalized lines are better suited for EMI/RFI. Finally, because they do not require vias and can be fabricated with a single layer, microstrip lines are cheaper than metalized lines.
Strip line PCBs require fewer layers of material, but their circuit density is lower than microstrip lines. Although the microstrip line is a low-cost option, it is not always suitable for RF microwave circuit boards due to performance limitations. Although microstrip lines are more expensive than metallic lines, the benefits far outweigh the drawbacks.
Microstrip line characteristics are determined by the type of metal used and the amount of solder required. This determines how much metal is required for metallization. The outer layer of the microstrip board affects the characteristic impedance of the board. External shielding is useful for RF applications, but not required. External shielding allows for higher power output.
Microwave Circuit Board
In fact, the asymmetric ribbon line structure is the best design choice because it allows signal lines to be closely coupled. It consists of two signal lines separated by a dielectric on different surfaces. Because crossed lines are not possible in high-frequency circuit designs, microstrip line structures are more efficient. It can also be made using protective alignments and copper castings.
What exactly is an RF PCB application? is the first thought that comes to many people’s minds. But how does the technology used to manufacture these boards differ from traditional methods? This article will teach you more about the various types of RF circuit boards. After all, what are these circuits and what do they do? We will discuss the materials used to make them. We will discuss the differences between these materials and the circuits that use them.
RF circuit board design has several requirements and is more complex than standard circuit design. The main difference between RF and conventional circuits is the presence of parasitic components (such as inductors and resistors) in the physical circuit. In addition, active components, such as transistors, have inherent characteristics. The input impedance of these devices varies greatly with frequency. Therefore, it is critical to carefully design RF circuit boards to minimize these problems.
Environmental variations must be considered when designing RF circuits. For example, the operating environment may vary depending on the room temperature. In this process, it is critical to ensure that the materials used in the RF circuit board are resistant to these fluctuations. It is also important to consider the dielectric constant of materials, which refers to their ability to conserve energy in an electric field. In the end, this knowledge will help designers choose the right materials for their projects.
RF PCB Applications