Rigid-Flex PCB Specialist – PCBTok
Have you ever wondered how we make our high-grade Rigid-Flex PCB in Shenzhen?
- We always follow global regulatory requirements.
- Compliant with ISO 1400:2015 and ISO 9001:2015.
- 100% guarantee of on-time delivery
- If you require a Work-in-Progress Report, we can provide it.
- The finest Rigid-Flex PCB materials for you.
High-Value Rigid-Flex PCB Products
We always determine your needed PCB thickness and PCB materials to protect the value of all your Rigid-Flex PCB goods.
Trust us to give you the parts and components you need.
We are uncompromising when it comes to product testing.
We rigorously follow international standards for PCB production.
PCBTok’s wide production capabilities enable it to provide the most competitive price for your Rigid-Flex PCB requirements. We show you the products on this page.
Flexible PCB By Feature
Rigid-Flex PCB By Copper Thickness (6)
Rigid-Flex PCB By Color (6)
Rigid-Flex PCB Benefits
PCBTok can offer different language support, so you don’t worry about communication, no matter where you are from or which position you are in.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
How Is PCBTok Rigid-Flex PCB a Good Product?
Rigid-Flex PCB is currently required due to the versatility of applications. We have excellent choices for you because:
- PCB stack-up choices range from 2, 3 to 40 layers, even for Multilayer Flex PCB.
- We even manufacture 3 Layer PCBs.
- Any customized PCB or Prototype Rigid-Flex accepted
- High-current, high-power requirements are easily met.
- Environmental Safety is secured as we comply with global eco standards.
Rigid-Flex PCB Applications
What are the applications that take advantage of Rigid-Flex PCBs?
The real response is that this device can outfit a variety of modern applications.
Customers choose from the military sector, outer space industry, and heavy power industry for us.
Rigid-Flex PCBs are popular in medical devices such as CT scans, those used in nonclinical environments, and health monitoring.
For sure, you can count on us to produce world-class products for you, as we are PCB experts since 2008.
Rigid-Flex PCB Quality Testing
In our facility, Flexible-Rigid PCB products are subjected to stringent quality control procedures. Rigid-Flex PCB Quality Testing processes are at the heart of this. We are capable of:
- Fixture Test
- Impedance Test
- In-Circuit Testing
- Microscope or Micro-section analysis
- As well as AOI and Functional testing
Choose a Renown Rigid-Flex PCB Maker
Call PCBTok today for any PCB assembly component you require!
We have the full advantages of a world-class Rigid-Flex PCB without the steep price.
We are like no other because we put our customers first.
We strive to build positive client relationships by keeping our promises to you.
In fact, before you make your first major order, you can request a free sample.
Give PCBTok Rigid-Flex PCB a try!
Rigid-Flex PCB Fabrication
In terms of Rigid-Flex PCB components, we are considering giving you Advanced Materials alternatives.
We can utilize a variety of materials for the rigid component, such as Taconic and Arlon, although most customers will prefer Rogers goods.
Rogers 4350B, and 4003C, are just two examples.
Polyimide is commonly used for the Flex portion because it can resist high temperatures of up to 250 degrees Celsius.
You can rely on us to work ethically and provide you with the quality PCB that you deserve.
PCBTok has been fabricating PCBs and associated products for over 12 years.
We are professionals in Rigid-Flex PCB design, prototype, and bulk manufacture.
We use the right layering process for producing Multilayer PCBs. The PCB Core, Substrate Layer, Copper Layer, and soldermask Layer are all created in accordance with standard procedures.
OEM & ODM Rigid-Flex PCB Applications
Rigid-Flex PCB Production Details As Following Up
|1||Layer Count||1-20 layers||22-40 layer|
|2||Base Material||KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)|
|3||PCB Type||Rigid PCB/FPC/Flex-Rigid||Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.|
|4||Lamination type||Blind&buried via type||Mechanical blind&burried vias with less than 3 times laminating||Mechanical blind&burried vias with less than 2 times laminating|
|HDI PCB||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating|
|5||Finished Board Thickness||0.2-3.2mm||3.4-7mm|
|6||Minimum Core Thickness||0.15mm(6mil)||0.1mm(4mil)|
|7||Copper Thickness||Min. 1/2 OZ, Max. 4 OZ||Min. 1/3 OZ, Max. 10 OZ|
|9||Maximum Board Size||500*600mm(19”*23”)||1100*500mm(43”*19”)|
|10||Hole||Min laser drilling size||4mil||4mil|
|Max laser drilling size||6mil||6mil|
|Max aspect ratio for Hole plate||10:1（hole diameter＞8mil）||20:1|
|Max aspect ratio for laser via filling plating||0.9:1(Depth included copper thickness)||1:1(Depth included copper thickness)|
|Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
|0.8:1(drilling tool size≥10mil)||1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)|
|Min. depth of Mechanical depth-control(back drill)||8mil||8mil|
|Min gap between hole wall and
conductor (None blind and buried via PCB)
|Min gap between hole wall conductor (Blind and buried via PCB)||8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)||7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)|
|Min gab between hole wall conductor(Laser blind hole buried via PCB)||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）|
|Min space between laser holes and conductor||6mil||5mil|
|Min space between hole walls in different net||10mil||10mil|
|Min space between hole walls in the same net||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)|
|Min space bwteen NPTH hole walls||8mil||8mil|
|Hole location tolerance||±2mil||±2mil|
|Pressfit holes tolerance||±2mil||±2mil|
|Countersink depth tolerance||±6mil||±6mil|
|Countersink hole size tolerance||±6mil||±6mil|
|11||Pad(ring)||Min Pad size for laser drillings||10mil(for 4mil laser via),11mil(for 5mil laser via)||10mil(for 4mil laser via),11mil(for 5mil laser via)|
|Min Pad size for mechanical drillings||16mil(8mil drillings)||16mil(8mil drillings)|
|Min BGA pad size||HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold)||HASL:10mil, LF HASL:12mil, other surface technics are 7mi|
|Pad size tolerance(BGA)||±1.5mil(pad size≤10mil);±15%(pad size>10mil)||±1.2mil(pad size≤12mil);±10%(pad size≥12mil)|
|1OZ: 3/4mil||1OZ: 3/4mil|
|2OZ: 4/5.5mil||2OZ: 4/5mil|
|3OZ: 5/8mil||3OZ: 5/8mil|
|4OZ: 6/11mil||4OZ: 6/11mil|
|5OZ: 7/14mil||5OZ: 7/13.5mil|
|6OZ: 8/16mil||6OZ: 8/15mil|
|7OZ: 9/19mil||7OZ: 9/18mil|
|8OZ: 10/22mil||8OZ: 10/21mil|
|9OZ: 11/25mil||9OZ: 11/24mil|
|10OZ: 12/28mil||10OZ: 12/27mil|
|1OZ: 4.8/5mil||1OZ: 4.5/5mil|
|1.43OZ（negative ）:5/8||1.43OZ（negative ）:5/7|
|2OZ: 6/8mil||2OZ: 6/7mil|
|3OZ: 6/12mil||3OZ: 6/10mil|
|4OZ: 7.5/15mil||4OZ: 7.5/13mil|
|5OZ: 9/18mil||5OZ: 9/16mil|
|6OZ: 10/21mil||6OZ: 10/19mil|
|7OZ: 11/25mil||7OZ: 11/22mil|
|8OZ: 12/29mil||8OZ: 12/26mil|
|9OZ: 13/33mil||9OZ: 13/30mil|
|10OZ: 14/38mil||10OZ: 14/35mil|
|13||Dimension Tolerance||Hole Position||0.08 ( 3 mils)|
|Conductor Width(W)||20% Deviation of Master
|1mil Deviation of Master
|Outline Dimension||0.15 mm ( 6 mils)||0.10 mm ( 4 mils)|
|Conductors & Outline
( C – O )
|0.15 mm ( 6 mils)||0.13 mm ( 5 mils)|
|Warp and Twist||0.75%||0.50%|
|14||Solder Mask||Max drilling tool size for via filled with Soldermask (single side)||35.4mil||35.4mil|
|Soldermask color||Green, Black, Blue, Red, White, Yellow,Purple matte/glossy|
|Silkscreen color||White, Black,Blue,Yellow|
|Max hole size for via filled with Blue glue aluminium||197mil||197mil|
|Finish hole size for via filled with resin||4-25.4mil||4-25.4mil|
|Max aspect ratio for via filled with resin board||8:1||12:1|
|Min width of soldermask bridge||Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)|
|Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
|Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)|
|Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)|
|Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)|
|15||Surface Treatment||Lead free||Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge|
|Aspect ratio||10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)|
|Max finished size||HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″；|
|Min finished size||HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″；|
|PCB thickness||HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm|
|Max high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mil|
|16||V-Cutting||Panel Size||500mm X 622 mm ( max. )||500mm X 800 mm ( max. )|
|Board Thickness||0.50 mm (20mil) min.||0.30 mm (12mil) min.|
|Remain Thickness||1/3 board thickness||0.40 +/-0.10mm( 16+/-4 mil )|
|Tolerance||±0.13 mm(5mil)||±0.1 mm(4mil)|
|Groove Width||0.50 mm (20mil) max.||0.38 mm (15mil) max.|
|Groove to Groove||20 mm (787mil) min.||10 mm (394mil) min.|
|Groove to Trace||0.45 mm(18mil) min.||0.38 mm(15mil) min.|
|17||Slot||Slot size tol.L≥2W||PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil)||PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil)|
|NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil)||NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil)|
|18||Min Spacing from hole edge to hole edge||0.30-1.60 (Hole Diameter)||0.15mm(6mil)||0.10mm(4mil)|
|1.61-6.50 (Hole Diameter)||0.15mm(6mil)||0.13mm(5mil)|
|19||Min spacing between hole edge to circuitry pattern||PTH hole: 0.20mm(8mil)||PTH hole: 0.13mm(5mil)|
|NPTH hole: 0.18mm(7mil)||NPTH hole: 0.10mm(4mil)|
|20||Image transfer Registration tol||Circuit pattern vs.index hole||0.10(4mil)||0.08(3mil)|
|Circuit pattern vs.2nd drill hole||0.15(6mil)||0.10(4mil)|
|21||Registration tolerance of front/back image||0.075mm(3mil)||0.05mm(2mil)|
|22||Multilayers||Layer-layer misregistration||4layers:||0.15mm(6mil)max.||4layers:||0.10mm(4mil) max.|
|Min. Spacing from Hole Edge to Innerlayer Pattern||0.225mm(9mil)||0.15mm(6mil)|
|Min.Spacing from Outline to Innerlayer Pattern||0.38mm(15mil)||0.225mm(9mil)|
|Min. board thickness||4layers:0.30mm(12mil)||4layers:0.20mm(8mil)|
|Board thickness tolerance||4layers:+/-0.13mm(5mil)||4layers:+/-0.10mm(4mil)|
|8-12 layers:+/-0.20mm (8mil)||8-12 layers:+/-0.15mm (6mil)|
|26||Impedance control||±5ohm(＜50ohm), ±10%(≥50ohm)|
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
“They created a PCB for my drone, which I believe was initially impossible. However, their successful initiative gave me hope. Other things are achievable with PCBTok’s assistance. This organization was professional in their communication with me regarding the cost, what needed to be done, and what they could do in a timely manner.”Marley Elorpe, PCB Assembler from California, USA
“I’ve been satisfied with the prices every time I’ve gone there for parts. They don’t stonewall my questions, even if I keep repeating myself sometimes. To my amazement, there is no language barrier because the guys are trained to speak in good, conversational English. It’s just a terrific group of individuals who want to change the way service is delivered in the industry, this PCBTok. I hope they continue to gain clients so that we may have more businesses like this.”Derek Hall, Strategic Sourcing Director from Birmingham, UK
“I can only speak well of the quality of their work, and I have a strong view about how trustworthy their business procedures are. I believe they are comparable to European manufacturers, but at a far lower cost. And, given the current state of the planet, they are unquestionably the best PCB manufacturer of the future.”Guillaume Mercer, PCB Layout Engineer Product Development from France
Rigid-Flex PCB – The Completed FAQ Guide
If you have the right tools and resources, rigid-flex PCB design isn’t an intimidating process for designers. With tools that include integrated 3D design features, designing rigid-flex PCBs is a breeze. Altium Designer unifies these features into a single platform and interface. You’ll learn everything you need to know about designing a rigid-flex PCB and getting started on your project right here.
Rigid-flex PCBs are an excellent choice for designing and manufacturing electronic products for a variety of reasons. They are adaptable, support multiple signal layers, and can improve reliability.
They also make assembly easier and save money. Foldable and bendable electronics can monitor vital signs, act as conformal heating elements, and do other things. Rigid-flex PCBs can also help to streamline the development process and reduce costs.
Depending on the application, rigid-flex printed circuit boards can be single, double, or even four layers thick. The number of layers is proportional to the size and shape of the object. Essentially, layers are like ingredients in a great recipe: each one contributes to the overall flavor.
Multilayer Rigid-Flex PCB
The process of stacking layers, on the other hand, is relatively simple and should be aided by a visual aid. A 3-D model of a rigid-flex PCB, for example, allows designers to more precisely define the bending region.
The copper coil must be cleaned before the rigid-flex PCB manufacturing process can begin. The anti-rust layer prevents oxidation, which would otherwise impede the rigid-flex PCB manufacturing process. To prevent oxidation, copper foil is usually treated with a sodium persulfate or acid solution after cleaning.
Finally, it is coated with an appropriate oxidant. If you need to design a Rigid-Flex PCB with a copper foil layer, use OrCAD PCB Designer, which is optimized for this type of design.
Another advantage of rigid-flex PCBs is their small size. Rigid-flex PCBs are intended to fit more components into a smaller space, lowering the cost per unit.
They also have fewer interconnects, which makes automated testing easier. They are also ideal for prototyping. These benefits make rigid-flex PCBs an excellent choice for a wide range of industries.
When designing a flexible circuit board, rigid-flex PCBs offer several advantages. They enable manufacturers to create circuit boards that precisely fit a device, reducing package size and weight. Furthermore, they facilitate the automation of test and verification processes, preventing costly errors or material waste.
Some of the advantages of rigid-flex PCBs are listed below. Check out this guide if you’re looking for a low-cost way to improve the design of your product.
They are often used in electronic products, which require a small footprint. They fit into a variety of electronic devices due to their small size. Furthermore, because these boards are lighter, they are an excellent choice for miniature electronic devices.
They are also bendable, allowing them to fit into smaller devices. As a result, they make a product much smaller and easier to transport.
Advantages of Rigid Flex PCBs
Rigid-flex PCBs are flexible and bendable to some extent. However, the bend area must be carefully designed to avoid mechanical stress destroying the pads. Traces should be routed perpendicular to the bend line to reduce mechanical stress on pads in the bend area.
Dummy traces can be placed in the flex area to strengthen it if possible. Finally, for the flex area, a hatched-polygon ground plane should be used. OrCAD PCB Designer is an excellent PCB design software tool for rigid-flex designs.
Rigid-flex boards are generally less expensive to manufacture than traditional printed circuit boards, which is an important consideration if you need a small, compact device.
Furthermore, rigid-flex PCBs require fewer interconnects and can withstand harsh conditions when compared to wired PCBs. They’re also simple to test, which is ideal for prototyping.
How to Create a Rigid-Flex PCB will provide answers to these and other questions. Flex PCB construction is IPC 2223C compliant and has many advantages, including long-term reliability and lower design costs. Engineers can place components on flexible areas without sacrificing structural integrity on rigid-flex PCBs, which are typically multilayer.
Rigid-Flex PCB Structure
Another option is an asymmetrical design, which is frequently driven by complex impedance requirements. These designs improve manufacturability and reduce blindness through aspect ratio.
It is critical to avoid stress and weak points when designing a flex circuit. Traces placed at right angles to corners should be avoided because they will cause strains on the copper traces.
However, there are some design considerations that will necessitate bending at corners. To accomplish this, bend the copper traces with a conical radius. Aside from that, avoid excessively sharp bends, as these will put more strain on copper traces.
Please see this video:
An 8-layer rigid-flex PCB, for example, would have 6 layers of rigid components and 2 layers of flex components. The flex layer would be shifted toward the bottom of the structure rather than to the center.
With no major manufacturing issues, this configuration would still be a viable manufacturable configuration. If you’re not sure how to design the Rigid-Flex PCB, consult with a PCBTok.
Asymmetrical Rigid-Flex PCB construction is standard. This is because it reduces stress points and makes manufacturing easier. Rigid-flex PCBs typically have 20 layers or less but can have up to 40 layers if necessary.
The overall thickness of these boards is typically the same. A design with varying layer counts is more difficult to manufacture.
In addition to the manufacturer’s technical expertise, you should ensure that the Rigid-Flex PCB supplier can produce quality products on the first try. Some important characteristics to look for in a dependable rigid-flex PCB supplier include the ability to produce high-quality, precision-made products and the use of high-quality materials.
The trace on a rigid-flex PCB determines the board’s speed and voltage. A solder mask protects the board from corrosion on a high-quality rigid-flex PCB. If the solder mask is applied incorrectly, the circuit board may crack or corrode.
While rigid-flex PCBs require high-end equipment and specialized software to manufacture, these boards are available from a variety of PCB manufacturers.
When selecting a supplier, look for one with extensive experience in rigid-flex PCB manufacturing. Not all manufacturers have the resources or experience required to produce these boards, so choosing a manufacturer with sufficient expertise is critical.
Experience is another important consideration when choosing a rigid-flex PCB supplier. Rigid-Flex PCBs are more expensive than rigid-flex circuits, but they use higher-quality components.
Rigid-Flex PCBs are frequently constructed from special raw materials such as adhesives and flexible laminates. Furthermore, specialized components, such as thicker flex dielectrics in the impedance layers, are used in their design.