Delicately Crafted RO4450F by PCBTok

Simply defined, RO4450F is a dielectric material that has been utilized in conjunction with FR-4 cores and prepreg as a way to enhance the efficacy of FR-4 multilayer designs.

PCBTok has full possession of UL accreditation in the US and Canada. Also, we don’t require a minimum order quantity for new purchases.

Other than that, we offer 24/7 sales, technical, and engineering support. Moreover, we’re always accessible to support your bespoke PCBs and have a flexible payment term.

Kindly send your RO4450F requirements today; we’ll be glad to work on that for you!

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Devoted to Delivering RO4450F of the Excellent Caliber

We can be your go-to place if you search for remarkable quality RO4450F. It is all due to our significant experience in the industry; we are capable of meeting your needs.

We are strict in terms of quality; hence, we strictly follow the established international guidelines and meticulously perform quality control.

In addition, this particular board material can suffice high-frequency applications, including in the communications industry and 5G networks.

We fully possess all the PCBs you may need; inquire today!

Involving the construction of the RO4450f PCB, PCBTok is relatively transparent. If required, ask for a third-party inspection or a Certificate of Conformity; we’ll swiftly deliver it.

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RO4450F By Thickness and Panel

20 mil Thickness

The 20 mil Thickness that we integrate into this laminated board has been considered a standard density in the industry; it can hold an almost average type of components. In addition, they can be ideal for compact radio devices.

40 mil Thickness

The 40 mil Thickness that we incorporate in this laminated board is still part of the standard density in the industry; however, it is already capable of withstanding almost heavy components. Thus, they are used in the industrial sector.


The 16″ X 18″ (406 X 457mm) panel size that we integrate into this laminated board can be ideal for small to medium average-size devices, including automotive, wearables, and medical apparatus; it is commonly partnered with multilayer board type.


The 24″ X 18″ (610 X 457mm) panel size that we incorporate in this laminated board is suitable for applications that are on average size devices. In addition, you can pair this size into different thicknesses depending on the purpose.


The 24.5″ X 18.5″ (622 X 470mm) panel size that we integrate into this laminated board is highly compatible with almost large-size devices, including aircraft and marine controls. In addition, it can be paired with different thicknesses.


The 24″ X 36″ (610 X 915 mm) panel size that we incorporate in this laminated board can support large-size devices, such as aerospace and other industrial equipment. Similar to the different sizes mentioned previously, it is suitable for any thickness.

What is RO4450F?

As mentioned previously, the Rogers RO4450F falls under a dielectric material that is combined with FR4 cores and prepreg that acts as a way to enhance the quality and performance of the traditional FR4 multilayered design.

Additionally, glass-reinforced hydrocarbon/ceramic laminates from the same line of dielectrics have been employed in layers where RF, microwave frequency, dielectric constant (DK), or high-speed signal demands call for superior materials. In less essential signal layers, FR-4 cores and prepreg are still frequently employed.

Contact us through our socials if you’re still confused about this laminate. Besides, kindly call us if you seek quicker assistance; we’re always available.

What is RO4450F?
Primary Features of RO4450F

Primary Features of RO4450F

The RO4450F has a broad range of capabilities in terms of usage; however, depending on your application, it can vary. In this article, we’d like to disclose the characteristics of this laminated board; we’d like to be as transparent as possible with our clients.

Below are some key features of a RO4450F:

  • Considering RO4000 series core materials, there are many prepreg classes.
  • It has low thermal expansion along the z-axis, between 43 and 60 ppm/°C.
  • It can laminate sequentially.
  • It is suitable for manufacturing lead-free solder.
  • It has FR-4 bond temperatures suitable for high-frequency thermoset prepreg.
  • It holds high-performance through-hole plating.

Different Properties of RO4450F

RO4450F prepreg has shown improved lateral flow capacity. We want to give you the distinct properties of this material in this section.

  • Physical Properties – It has a density of 1.83 g/cc, moisture absorption of 0.090% at equilibrium, and thickness of 102 microns.
  • Mechanical Properties – It has a peel strength value of 0.701 kN/m.
  • Thermal Properties – It has a thermal conductivity of 0.650 W/m-K at 80°C, a TG value of ≥ 280°C, and a decomposition temperature of 390°C.
  • Electrical Properties – It has a volume resistivity value of 8.9314 Ω-cm, a dielectric constant of 3.47 to 3.57, a dielectric strength of 39.4 kV/mm, and a dissipation factor of 0.0040.
Different Properties of RO4450F

Go for PCBTok's Enhanced Quality RO4450F

Go for PCBTok's Enhanced Quality RO4450F
Go for PCBTok's Enhanced Quality RO4450F

Our former consumers have widely deployed PCBTok’s RO4450F in complex applications since they can perform in such areas.

This demonstrates that our products are indeed made of sophisticated materials and technologies. Additionally, we always guarantee that you’ll receive a defect-free item.

Our products adhere to RoHS regulations; thus, they can be ideal for countless operations, including backhaul radio. Furthermore, it is safe to operate since it has UL 94 V-0 flame retardant properties and is highly compatible with FR4 processing.

Apart from that, we conduct a series of inspections to ensure its quality and performance at a highly reasonable rate. We guarantee a long-lasting product with us.

Grab your RO4450F PCBs with us today!

RO4450F Fabrication

How is RO4450F Manufactured?

Since we are a company that values integrity and transparency with our consumers, we’d like to share with you the manufacturing process of RO4450F.

The first phase is to create a PCB Layout; we suggest arranging the design copies in order. Second, manufacture the core board. Then, etch the inner core plate.

After that, we punch and inspect the copper plate. They were followed by laminating phase through the use of prepreg. Then, perform PCB drilling for the layers.

Finally, we perform precipitation of pore walls; it is conducted through the assistance of a unique machine that is capable of addressing a 25-micron size copper film.

If you’d like a detailed process, contact us, and we’ll provide you with a clip!

Benefits of RO4450F

One of the essential aspects not to overlook in purchasing any product are the benefits it can offer to your applications; hence, we’d like to discuss it in this section.

As for its primary advantage, it is highly suitable in multi-layer board designs with RO4003C, RO4350B, RO4835, RO4360G2, or RO4000 LoPro laminates.

Secondly, it is considered to be CAF-resistant. Additionally, its high-frequency thermoset prepreg is effectively ideal for FR4 bond temperatures.

Ultimately, it offers exceptional reliability in terms of plated through-hole. Overall, it provides fewer benefits but can significantly contribute to various uses.

Obtain your RO4450F with us today, and enjoy our best offers!

OEM & ODM RO4450F Applications

Backhaul Radios

Due to the capability of this laminated board to support sequential lamination, it is highly preferred in backhaul radios wherein it requires such a feature.

Communications Systems

Since this laminated board possesses low z-axis CTE, it is widely utilized in communications systems for such reasons.

Power Amplifiers

One of the capabilities of this laminated board is its high-frequency thermoset prepreg that is suitable for FR4; thus, they are deployed in power amplifiers.

Small Cells/DAS

Due to the reliability of this laminated board with plated through-hole component placement, they are frequently preferred in small cells/DAS usage.

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PCBTok | RO4450F's Transparent Supplier in China

Our entire line of boards has surpassed stringent quality inspection.

We continuously strive to offer the finest products to our consumers.

RO4450F Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
1mil Deviation of Master
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.


2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.


3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.


4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.


5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

Quick Quote
  • “Deciding on the right manufacturer is the hardest decision I have made thus far in this industry. Thankfully, I met PCBTok and went to transact with them; it was simple and quick. I didn’t encounter any troubles while conducting business with them. In short, they are highly professional and trained in this field; you can surely see the passion and dedication of their personnel to deliver their customers quality service and outputs. I can highly recommend them for your circuit board needs.”

    Norman Washington, Procurement Component Manager from Tampa, Florida
  • “It can be overwhelming to choose a great supplier in this day and age wherein sales are much more a top priority than the quality of the products. However, PCBTok is the complete opposite of that stigma. Even though it needs extra effort and sweat to follow up on the customers’ needs constantly, they still conduct it to ensure that they are in line with the client’s specifications. It is evident that they are willing to go above and beyond to meet the standards and expectations of their client, which is a great approach! I am one of those who experienced this treatment with them; hence, I can surely recommend them as your producer of circuit boards.”

    Shannon Cooper, Senior Staff Engineer from Chandler, Arizona
  • “Premised on my interactions with PCBTok, I can say that they are straightforward to work with; the procedure I underwent was really straightforward. As they are comprehensive and work effectively for their purposes, the goods were produced to a very high standard. The competence and compassion of their staff really stood out to me when it came to the service they gave me. I can feel their commitment to their consumers, and I am impressed with how well-trained and kind their staff performs. In engaging with commercial transactions, PCBTok is the best option if you want this kind of treatment.”

    Marcus Fletcher, Electronics Technician from Fayetteville, North Carolina
What are the Features of RO4835?

The main features of this prepreg + laminate are as follows:

  • Dielectric constant: 3.48 +/- 0.05
  • Flame retardant: Rated UL 94 V-0
  • Glass Transition Temperature: >280°C
  • Rated by IPC as conforming to the 4103 standard
  • Used only in Rigid PCB types
  • Can be used for Lead-free boards and compatible with Lead-free processing

Customers can specify ED Copper or LoPro Copper material when ordering. Standard panel size applies, with 0.5 oz to 1 oz copper thickness.


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