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PCBTok’s Exceptionally Made Rogers 3006
Rogers 3006 can be built by PCBTok to your specifications and applications; we can meet all of your needs precisely and on time.
- We have received complete UL accreditation in the US and Canada.
- Fully satisfy your PCB requirements with no delays.
- Depending on the order, payment arrangements differ.
- Each PCB satisfies the requirements of IPC Class 2 or 3.
- Our 24-hour turnaround service is available for your prototype PCB.
Extremely Reliable Rogers 3006 Products from PCBTok
We have already pleased more than a thousand customers thanks to our commitment to giving them first-rate Rogers 3006s, and this has earned us praise worldwide.
PCBTok’s more than a decade of experience in the industry has made a much more solid foundation of our knowledge in terms of Rogers 3006.
Our skilled staff members are continually receiving the necessary experience and training to ensure that they are able to produce high-quality items.
Your appreciation of Roger 3006 motivates us to keep improving.
Without following the rules set forth by the guidelines of the international standard, we would not be able to offer you a Rogers 3006 product that is so incredibly trustworthy.
Rogers 3006 By Feature
The Rigid Rogers 3006 PCB is the most common type of board utilized by many consumers because of its wide array of benefits. It includes its dynamic stability and increased reliability of the circuit.
The HDI Rogers 3006 PCB is recognized for its higher circuitry density if compared to other types of boards. This type of board is highly reliable due to its stacked vias that act as a shield to extreme temperatures.
The Multilayer Rogers 3006 PCB is ideal for complex projects since you are able to expand the board through layer integrations. However, if it experiences a huge problem, it can be complicated to repair.
The High TG Rogers 3006 PCB offers good resistance to heat, and exceptional chemical and mechanical stability. This type of board is capable of tolerating high power density designs since it can withstand high temperatures.
The High-Frequency Rogers 3006 PCB utilizes a material to maintain the signal transmission of data, and stability of the transmission operation. In addition, it is highly used in cellular systems and GPS antennas.
The Microwave Rogers 3006 PCB provides high stability; it can operate up to 40 GHz. It is relatively inexpensive and has optimal performance. In addition, it is widely deployed in various applications such as automotive, industrial, and medical devices.
Rogers 3006 By Thickness (5)
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The 10 mil Rogers 3006 has the equivalent thickness to a 2-Layer board. In PCBTok, we are capable of customizing the Rogers 3006 thickness depending on your specifications and applications.
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The 20 mil Rogers 3006 is equivalent to a thickness value of 0.50 mm which can be ideal if you’re planning to incorporate it on a V-Cutting board; we are equipped with customizing this for your operations.
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The 30 mil Rogers 3006 has the equivalent thickness to an 8-Layer board that has the measurement of 0.75 mm. They are ideal if you’re planning to integrate your Rogers 3006 into a multilayer type of board.
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The 40 mils Rogers 3006 in certain cases, can also be identical to the 8-Layer board that has a measurement of 1.0 mm. It is quite similar to the 30 mils; it can be integrated into a multilayer type of board.
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The 50 mil Rogers 3006 is not one of the most common thicknesses of boards; however, with PCBTok services and capabilities, we can customize this thickness according to your application’s demand and specifications.
Rogers 3006 By Layer (5)
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The 4-Layer Rogers 3006 PCB can easily integrate additional complex devices on its board including BGA components that has a maximum connection of 200. It is widely used in GPS technology and file servers.
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The 6-Layer Rogers 3006 PCB is ideal for numerous applications such as in devices that support multiple high-speed interfaces, and radar modules. It has a wide array of benefits including its enhanced EMI and durability.
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The 8-Layer Rogers 3006 PCB has lesser electromagnetic interference. It has a way more complex structure, but it has way more outstanding functionality and quality. Also, radiation emission is reduced on this board.
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The 12-Layer Rogers 3006 PCB’s primary benefit is its exceptional durability over other less-layer count boards since it is composed of several layers that are subjected to massive pressure while merging its layers together.
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The 14-Layer Rogers 3006 PCB is the most ideal option if you’re planning to incorporate it in premium data systems because it has way more enhanced functionality compared to the less-layer count boards.
Rogers 3006 Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Features of PCBTok’s Rogers 3006
Here are some of the features you can find in PCBTok’s Rogers 3006:
- Dissipation Factor – It has an estimated value of up to 0.002 at 10 GHz.
- Dielectric Constant – It has a typical value that ranges from 6.2 to 40 GHz.
- Thermal Conductivity – The most crucial aspect to look at in material; it will determine its capability to transfer and conduct heat throughout the board. The Rogers 3006 has a grade of low in terms of this.
- Moisture Absorption – It has a value of 0.002 which is suitable for humid environments.
If you have further questions about these features, you can just ping us directly.
International Standard Guidelines for Rogers 3006
These are the required quality standard certifications we have at PCBTok:
- ISO-9001 – This means that the product has passed the Quality Management System (QMS); PCBTok is consistent in providing regulatory products.
- ISO 14001 – This means that the management has passed the Environmental Management System; we have the necessary facilities in producing quality items.
- UL Standard – This inspects the product’s safety; it should adhere to the Standard for Safety guidelines.
All of these quality standard accreditations are useful in determining the overall performance of your Rogers 3006; hence, we have complied with all of them.
Perks of PCBTok's Rogers 3006
Here are some of the primary perks of PCBTok’s Rogers 3006:
- It is capable of working in humid environments due to its low absorption feature.
- Since the Rogers 3006 have minimal value for thickness level, its materials in manufacturing can be easily fabricated.
- In terms of impedance control, the Rogers 3006 has a substantial value on it.
- Between the layers, heat is conserved.
- It partakes in reducing the occurrences of outgassing in aerospace applications.
These are some of the advantages you can get from a Roger 3006. However, it has more to offer than what you could imagine. To learn more, just message us.
PCBTok's Expertise is Supplying Durable and Reliable Rogers 3006
One of the first things to look at prior to placing an order for a Rogers 3006 product; is crucial to research the manufacturer’s experience in the industry to check whether they are capable of producing you a top-notch performing product.
Since PCBTok has been offering top-notch services and reliable Rogers 3006 products for more than twelve (12) years, we are well-versed in quality producing them.
Along with having produced high-quality Rogers 3006 for over ten years, we also offer full technical support throughout your transaction with us. Additionally, we exclusively use premium raw materials in your product to provide a high-quality result.
We take all of these steps to ensure that your requirements are met without a problem and that you may use the product for a longer duration.
Rogers 3006 Fabrication
It is important for the consumers to know the manufacturing procedure of their Rogers 3006 to evaluate its reliability. Here is the process that we take in PCBTok:
The process goes through PCB Layout, Core Board Manufacturing, Inner Core PCB Etching, Punching and Inspecting the Copper Plate, and Lamination.
After the Lamination phase, it undergoes PCB Drilling, Precipitate the Pore Walls, and finally, it will be subjected to thorough testing and evaluation to assess its performance.
These phases should always be present in the manufacturing process of your Rogers 3006 to ensure that they will perform accordingly without any errors.
If you want to have a detailed explanation of each phase, just send an inquiry.
Another thing to look at in your Rogers 3006 is its materials used during the manufacturing. This will give you an idea of the composition of your product.
The following are the primary materials we deploy in your Rogers 3006; resistive foil, electro-deposited reverse treated materials, and ceramic PTFE bond ply.
We also incorporate woven glass, prepreg laminates, hydrocarbon, PTFE glass fiber, PTFE ceramic, TECA film, and woven glass-reinforced modified epoxy IMS.
All of these have their own unique importance why we choose to integrate them into your Rogers 3006; we at PCBTok want you to experience only the finest product.
You can just hit the inquire button for further information about these materials.
OEM & ODM Rogers 3006 Applications
One of the advantages of a Rogers 3006 is its exceptional dimensional stability; thus, they are becoming preferred in most military equipment.
Due to Rogers 3006’s substantial impedance control and steady performance, it has been widely deployed in automotive industry devices.
In RF Engineering Technology, it requires highly efficient frequency performance in their devices; and, the Rogers 3006 is capable of providing that.
Since Rogers 3006 is capable of reducing the occurrences of outgases, they are deployed in most of the aviation devices in which this is highly likely to occur.
Most of the time, these applications are susceptible to various weather conditions; a Rogers 3006 has stable dimensions and thermal expansions despite the temperature conditions.
Rogers 3006 Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
