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PCBTok’s Skillfully Fabricated Rogers 3010
Our hardworking engineers expertly construct our Rogers 3010 to ensure a product that can run for a very long period and function at its highest point.
- Prior to production, CAM carefully examines all files.
- We provide a variety of PCB Layer selections, ranging from 1 to 40.
- Offer a complimentary sample prior to making a significant buy.
- If you need assistance with your customized PCBs, we are always accessible.
- We provide a wide variety of payment options.
Leading Top-Notch Rogers 3010 Products from PCBTok
After more than 12 years in the business, we are still among the top and leading manufacturers of Rogers 3010, and other PCB products in the industry.
We have received this recognition thus far because of our enthusiasm for providing our consumers with the best Rogers 3010 products available in the market.
PCBTok continuously pledges to offer top-notch Rogers 3010 products, and we aim to consistently provide customers with the most extraordinary experience with us possible.
It has always been our mission to serve you with full integrity and total satisfaction.
We wouldn’t achieve all of these praises and commendations across the globe without the hands of our skilled personnel, and your satisfaction with our products and services.
Rogers 3010 By Feature
The High-Frequency Rogers 3010 PCB is ideal for high-speed signal applications since it is capable of offering frequency that ranges from 500 MHz to 2 GHz; it has improved signals.
The Multilayer Rogers 3010 PCB is widely used in signal transmission since it can incorporate numerous components on its board without compromising its performance, but instead, it greatly improves it to its optimum level.
The High TG Rogers 3010 PCB offers great resistance to heat; hence, they are widely preferred for applications wherein it is greatly exposed to extreme temperature conditions. Also, it has enhanced thermal stress resistance.
The Rigid Rogers 3010 PCB is the most widely used type of board in the market due to its versatility and many other offered benefits. In addition, they are commonly deployed in antenna systems, GPS equipment, and communications.
The Heavy Copper Rogers 3010 PCB has been widely deployed in most power applications such as solar power converters and power supplies. It has better endurance to thermal and excellent current carrying capacity.
The Prototype Rogers 3010 PCB is the perfect alternative if you plan to purchase in bulk the same kind of design; this will assist you in spotting errors and design flaws in your laminate prior to mass manufacturing. Hence, you can easily correct it.
Rogers 3010 By Thickness (5)
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The 0.128 mm Rogers 3010 is the least value for the standard thickness in this type of laminate as per the standard guidelines. We are capable of producing you a Rogers 3010 laminate of this thickness.
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The 0.13 mm Rogers 3010 thickness is ideal for not-so-heavy applications; this is considered to be a standard value for this laminate. Our team can customize your laminate as per this thickness depending on your purpose.
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The 0.5 mm Rogers 3010 is considered to be the average thickness of your laminate; this can be utilized in light to minimal heaviness. Depending on your application, we can custom-build this thickness for your laminate.
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The 0.64 mm Rogers 3010 is also considered to be the standard value for the thickness of this laminate as per international standards. We can incorporate this into your laminate depending on your application’s demand.
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The 20 mm Rogers 3010 is the highest thickness we can offer based on the standard guidelines for laminate thickness. Our experts can always look for efficient ways to integrate this into any of your applications.
Rogers 3010 By Metal Coating (5)
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The ENIG Rogers 3010 PCB is considered to be the most popular finish for this type of laminate since it offers great durability that can balance well with the capabilities of this laminate. Additionally, it has a wide array of benefits including longer shelf life.
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The Hard Gold Rogers 3010 PCB is ideal to incorporate if you’re planning to utilize this laminate that is prone to contact force and wear. In addition, this coating is economical since it doesn’t utilize any lead on it, and it is halogen-free.
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The Immersion Tin Rogers 3010 PCB is the perfect alternative if you’re seeking to incorporate small components in this type of laminate. Moreover, it is fairly priced despite the numerous benefits it offers.
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The Lead-Free HASL Rogers 3010 PCB can be your ideal option to take if you’re looking for a coating that complies with RoHS since it doesn’t use any lead. Also, it has excellent solderability and cost-efficient option.
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The Immersion Silver Rogers 3010 PCB’s greatest benefit is its capability to be re-work; thus, you can save a lot of money in the long run because of this feature. However, they’re not ideal that use peelable masks.
Rogers 3010 Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Properties of PCBTok’s Rogers 3010
Prior to buying Rogers 3010 items or any other PCB products, it’s crucial to research their properties in order to assess their performance.
- Dielectric Constant – It has a value of 11.2 at 40 GHz.
- Dissipation Factor – Approximately 0.0022.
- Decomposition Temperature – The value is about 500°
- Approximate Weight of the Laminate – 305×457 mm up to 610×457 mm.
- Thermal Coefficient – 11 PPM/Degree Celsius.
You can directly contact us for more information about the properties of the Rogers 3010 laminate beyond the previously mentioned features.
Mechanical Characteristics of Rogers 3010
The mechanical characteristics of a Rogers 3010 laminate can dictate its durability and reliability during use; thus, it is vital for you to have an insight into this.
- Tensile Modulus (Strength) – The standard value is about 1902 up to 1934.
- Surface Resistivity – It has a recommended value of 105 for excellent output.
- Dimensional Stability – This laminate has a value of 0.5 mm/n.
- Moisture Absorption – We have the standard value of 0.05.
- Peel Strength – It has the standard value of about 9.4 lb/in.
We at PCBTok continually ensure that your Rogers 3010 laminate will work even in the most demanding and sophisticated applications. Send us a message to learn more.
Advantages of PCBTok's Rogers 3010
Finding out a product’s capabilities is a critical consideration before buying Rogers 3010 laminate or other PCB products. The benefits of this lamination include the following:
- Applications – It is possible to deploy this material at a frequency of about 77 GHz.
- Dielectric – Due to its low value for dielectric loss, it makes it very stable.
- Quality – Our Rogers 3010 in PCBTok has acquired ISO 9001 certification.
- Stability – It possesses exceptional electrical, chemical, and mechanical properties making it highly stable for various applications.
PCBTok’s Rogers 3010 has more to offer in your application than these mentioned benefits; you can just message us for more information about its strengths.
PCBTok's Area of Expertise is Supplying Exceptional Rogers 3010
Ever wondered where you can acquire premium Rogers 3010 laminate and products? Look no further because PCBTok is capable of producing top-notch Rogers 3010 products by using our high-grade raw materials and sophisticated technology.
In addition, PCBTok has complied with all of the necessary certifications required in this industry to produce the highest-quality Rogers 3010 in the market.
Our more than a decade of experience in the industry has brought us the necessary knowledge to continuously supply special Rogers 3010 to our beloved consumers. Furthermore, we are capable of fulfilling your Rogers 3010 demands flawlessly.
We have a dedicated expert team to work out your Rogers 3010 laminate and products to perfection; they are constantly monitoring it to guarantee a no-error product.
Rogers 3010 Fabrication
Whenever selecting Rogers 3010, its thermal conductivity; the degree, to which heat can pass through it, is among the most crucial factors to consider.
The thermal conductivity of a laminate can greatly affect its mechanical, chemical, and electrical properties; thus, compromising its performance.
Our Rogers 3010 laminate possesses the standard value of 0.79 W/mk. However, this value can vary depending on the environmental situation.
Nevertheless, this value of Rogers 3010 thermal conductivity is already the best for standard configurations. We can adjust it depending on the application’s demand.
You can message us directly to inquire about concerns about this matter.
The dielectric constant of a Rogers 3010 laminate can greatly affect the capability of the material to store energy in a certain electrical field. Thus, it is vital to know its accepted value.
In addition, not passing the standard value for the dielectric constant can potentially affect the working performance of the Rogers 3010.
In PCBTok, we abide by the recommended value for the dielectric constant of a Rogers 3010; it has a value of about 11.2 at room temperature.
Hence, it is essential that the dielectric constant of your Rogers 3010 should be of standard value because it can contribute to the product’s overall efficiency.
If you have any concerns or questions regarding this matter, contact us directly.
OEM & ODM Rogers 3010 Applications
Most Antenna Systems require higher tolerance of frequencies; a Rogers 3010 laminate is capable of withstanding frequency value of up to 77 GHz.
Due to Rogers’s 3010s capability to bond perfectly in terms of multilayer design boards, they are widely deployed in communication systems where they often use this type of board.
Since Rogers 3010 has exceptional dimensional stability that it is able to incorporate SMT assemblies; they are preferred in most power applications.
Most Wi-Fi and Handheld Device Cellular Antenna require exceptional reliability since they are transmitting high-speed signals; as Rogers 3010 is capable of doing that.
Rogers 3010 Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Rogers 3010 – The Ultimate FAQ Guide
If you are looking for a comprehensive FAQ guide for Rogers 3010, then you have come to the right place. Rogers 3010 laminate has a dielectric constant of 11.2 at 40 GHz, a dissipation factor of 0.0022, and a decomposition temperature of 500 degrees Celsius. It measures approximately 305×457 mm to 610×457 mm and has a thickness range of 0.015 to 0.050 inches. Peel strength is an impressive 9.4 lbs/in.
What exactly is Rogers 3010? Rogers 3010 laminate is used in a variety of microwave power amplifiers. It performs well in microwave power amplifiers due to its high thermal conductivity. This material is highly resistant to temperature gradient degradation and is suitable for RF and telecom applications. As a result, Rogers 3010 is one of the most widely used materials in power amplifiers.
This laminate works best in microwave and RF applications. It is also used in RF equipment and multilayer printed circuit boards. Voltage-controlled antennas and phased arrays utilize it. It has a dielectric constant of 11.2 at room temperature and has excellent mechanical properties. View the Ultimate Rogers 3010 FAQ guide for more information. It will help you make an informed decision and select the right product.
If you want your PCB to be effective and durable, you must choose the right PCB material. If you need a high-performance PCB that won’t break the bank, FR-4 is a good choice. In addition, if you need to work at high frequencies and handle high humidity, Rogers 3010 is a good choice.