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PCBTok’s Expertly Designed Rogers 3035
We are a highly committed manufacturer that strives to deliver only the most excellent Rogers 3035 products in the market; we aim to make it perform in any conditions and purposes.
- CAM analyzes each file meticulously before construction.
- We offer a selection of PCB Layers ranging from 1 to 40.
- A range of payment methods is available from us.
- Before making a large purchase, we provide a product sample.
- We are always ready if you require support with your personalized PCBs.
Best-In-Class Rogers 3035 Products from PCBTok
Our more than twelve (12) years of industry experience have greatly enhanced our knowledge in providing top-notch Rogers 3035 products in the market.
We’re doing our best to provide you with a product that can operate efficiently under any circumstances without experiencing any errors and issues.
All of these are made possible because of our professional staff that works very hard to satisfy all your demands and specifications for this product.
We constantly strive to quench the needs of our consumers.
PCBTok’s primary motivation is the satisfaction of our customers with our products; hence, we are continuously increasing its quality to a great extent.
Rogers 3035 By Feature
The High-Frequency PCB with this kind of laminate can be ideal for applications requiring particular signal transmission between two devices because it can offer reliable transmission of signals without any issues.
The Microwave PCB with this kind of laminate offers exceptional stability, high-speed design, and cost-efficient. They are widely deployed in communications systems such as satellites, radars, and navigational equipment.
The Radio Frequency (RF) PCB that possesses this type of laminate has quite similarities with the microwave board; however, they differ in their frequency ranges. This board has a range frequency of 3 kHz to 300 GHz.
The HDI PCB with this kind of laminate is widely recognized worldwide because of its wide array of benefits in various applications, such as its phenomenal versatility, compact design board, and exceptional signal integrity.
The High TG PCB with this type of Rogers laminate is ideally suited for the harsh environment prone to shock and vibrations. They are ideal for extreme temperature conditions and chemical situations.
The Customized PCB that possesses this kind of laminate is ideal for your special and unique applications wherein it will require you to incorporate additional components than the required count and personalized board designs.
Rogers 3035 By Type of Board (5)
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The Single-Sided PCB with a Rogers laminate can be ideal for not-so-demanding applications, including simple purposes such as radio equipment, camera systems, and many other electronic devices.
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The Double-Sided PCB with this kind of laminate is just a little upgrade from the single-sided one; however, it can offer more to your applications. They can be ideal for power amplifiers and automotive dashboards.
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The Rigid PCB with this type of laminate is one of the most popular types of the board in the market because it can be deployed in various applications; industrial, aerospace equipment, and even medical instruments.
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The Rigid-Flex PCB that has this laminate is widely used in radar equipment, wireless communication systems, industrial automation systems, and solar power systems due to its versatility and extreme reliability.
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The Multilayer PCB with Rogers laminates is another type of board popular among consumers because it can be deployed in various applications due to its flexibility, power, durability, quality, size, and connection point.
Rogers 3035 By Thickness (5)
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The 5 mil Thickness for this type of laminated board is considered up-to-standard. It can be deployed for light kinds of purposes requiring minimal components integration. We are capable of customizing this thickness for you.
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The 10 mil Thickness for this type of laminated board is still incapable of withstanding heavy components on it; hence, we recommend choosing this type of thickness for lightweight applications and purposes only.
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Depending on our design and purpose, the 20 mil Thickness for this type of laminated board can already tolerate light to the average variety of components. We suggest inquiring with us to attain a flawless and error-free output.
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The 30 mil Thickness for this type of laminated board can already integrate the average kind of components. However, it will still depend on the purpose and application you’d like to deploy since it has some cons.
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The 60 mil Thickness for this laminated board is the most recommended if you’re planning to integrate a heavy component. However, we do not recommend using this thickness in lightweight components.
Features of a Rogers 3035
The Rogers 3035’s essential features are as follows:
- Low Loss Tangent – It has a value of 0.0015 at 10 GHz frequency.
- Dielectric Constant – It has a value of 3.5005.
- Thermal Coefficient at Z-Axis – It is about -45 ppm per degree Celcius.
- Thermal Conductivity – It has a value of 0.5 W/mk
- Decomposition Temperature – It is regarded to be relatively high; 500°
- Copper Peel Strength – It has a value of 10.2 lb/in.
- CTE of X, Y, and Z is 17, 17, and 24 ppm/°C, respectively; considered low.
Factors that can Affect Rogers 3035 Performance
The performance of a Rogers 3035 can depend on various factors, and sometimes it can depend on its innate feature and environment. Here are some of the factors:
- The value of its dissipation factor (Df).
- The type of surface finish, solder mask, and silkscreen utilized.
- The thickness of the laminate and copper.
- The dielectric constant’s thermal coefficient value.
- Thermal management efficiency.
- The type of cladding deployed.
All of these are the factors that a Rogers 3035 performance can depend on.
Advantages of Rogers 3035
A Rogers 3035 offers tremendous benefits; the following are some of them:
- Operating Temperature – It can efficiently operate at various temperature conditions; hence, you can apply it to temperature-sensitive usages.
- Economical – It is halogen-free and lead-free.
- Reliability – It is incredibly durable because of its dielectric strength value; thus, you can apply it to a microstrip patch antenna.
- Compatibility – Due to its low dissipation factor, it can be deployed in high-frequency operations.
- Signal Transmission – An exceptional dielectric constant offers good impedance stability and effective noise-free transmission.
PCBTok Specializes in Providing Remarkable Rogers 3035
PCBTok is one of China’s most recognized PCB Manufacturers; we have mainly focused on our consumers’ needs and specifications relating to any PCB and PCBA services for over a decade. We can satisfy all of your Rogers 3035 requirements.
Furthermore, we offer a variety of PCBs that can perfectly suit your needs at a very friendly cost. Moreover, we will only deploy top-notch raw resources to your board.
Our Rogers 3035 can be ideal in any environment setting, including low and high-temperature conditions. Additionally, it can operate in 30 GHz to 40 GHz of frequency. Before shipping your orders, we meticulously test them to guarantee their quality.
We do not deliver products that don’t satisfy ISO, RoHS, and UL certifications that meet IP Standards. Thus, you can guarantee a high-quality Rogers 3035.
Message us today to get our best deals!
Rogers 3035 Fabrication
In PCBTok, we seek to perform a lead-free process in manufacturing your Rogers 3035. Hence, we deploy the following phases to achieve it.
Firstly, we ensure that the surface treatment we use for your board is free from lead, such as ENIG, HASL, OSP, and lead-free finishes.
Then, we only incorporate pure tin substance. We are doing this to prevent any occurrences of unwanted etching on the finished PCB product.
Finally, we utilize IR ovens instead of traditional ones. Also, we conduct temperature control on the laminate and integrate inert gas temperature for soldering.
If you have any questions related to this, message us directly. We will be more than happy to assist you with your concerns.
There will always be drawbacks to every product’s advantage; a Rogers 3035 isn’t an exemption. Thus, it is crucial to know its limitations.
Nevertheless, there is no need to worry if a product has cons because it is normal. In this product, there are only two (2) drawbacks.
In terms of humid conditions, this product can be prone to occurrences of oxidation and corrosion, especially in extreme thermal states.
However, in PCBTok, we can manufacture your Rogers 3035 at an affordable cost. Also, we only deploy quality materials to prevent corrosion and oxidation.
Now, the cost of this product can be extremely high. Nonetheless, it offers a longer shelf lifespan, is reliable, and has many advantages.
OEM & ODM Rogers 3035 Applications
Most Antenna Systems require excellent reliability in high-frequency situations because it deals with such; hence, they utilize this type of board laminate in their PCBs.
They are preferred in communications systems due to Rogers 3035’s ability to offer efficient noise-free signal transmission because of its dielectric constant value.
One of the advantages of utilizing this laminated PCB is its extreme durability and reliability, which is highly needed in Power Amplifiers; hence, they use it.
Since Rogers 3035 can be outstandingly ecologically friendly, they are used in consumer electronics, requiring this type of feature in a board.
Most devices in the aviation industry require a laminated PCB with exceptional thermal management; thus, they prefer this kind of board.
Rogers 3035 Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
