Strikingly Superior Rogers 3203 PCB

Rogers 3203 in a PCB is increasingly used in industrial applications.

Particularly, the laminate is for Microwave Frequency and High Frequency applications, RF devices, and semiconductors.

Because it is made of Quality Checked material, our PCBs using the 3203 has excellent electrical conductivity performance.

The mechanically stable characteristic is optimized in this multifaceted board.

The various components we used on it are well placed.

In addition, the component positioning is done well in accordance with updated plans.

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Capable of Handling Your Data

A large volume of data at a high frequency is the norm now for IT solutions.

Because of this, you need the Rogers 3203 material to cope with the demands.

Our PCBs produced have been operating at peak efficiency.

For over twelve years, we have already met many of the needs of our thousands of customers all over the world.

Please be one of our new converts. We promise you satisfaction.

Our specialties are PCB and PCB assembly.

On this page, we show you what we have to offer at competitive prices.

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Rogers 3203 By Feature

High Frequency PCB

High-Frequency PCB is used in various mobile devices, and we use advanced materials such as the RO3000 series to ensure long-term operation.

Rogers 3203 Laminate

The Rogers 3203 laminate is created by layering the Rogers material. Glass epoxy laminate is common, but this one contains ceramic.

Ceramic-Filled PCB

This product can withstand heat because it is a Ceramic-Filled PCB. As is the case, its preferred application is high power. The ultimate result is low thermal conductivity.

Copper Foil PCB

As a standard, this material is outfitted with electrodeposited copper foil. However, other cladding weights, including Reverse Treated is available.

Microwave PCB

Microwave frequency items, like the others in the series, are an appropriate partner for this Rogers material (namely RO3206 and RO3210).


RF type of devices can rely on this type of PCB because it requires a lower temperature during the lamination process. It can also be used in mobile applications.

Rogers 3203 By Thickness (5)

Rogers 3203 By Usage (5)

Dedicated to High Frequency Performance

PCBTok’s Rogers 3203 PCBs are an excellent choice for your next project. We have numerous variations to choose from, so there is something for every project.

PCBTok has a fantastic team of skilled, experienced, and professional PCB workers who supply you the  high-quality, low-cost relay PCB you need, specifically for high frequency use.

We have been manufacturing PCBs for many years and have extensive experience.

Furthermore, we can provide customized PCBs based on your specifications.

When you shop at PCBTok, be sure to check out our large selection of other low-cost products.

Dedicated to High Frequency Performance
Production Using the Rogers 3203

Production Using the Rogers 3203

Since we are keen to be the best in using this high-end laminate, we use strict quality control measures as dictated by the ISO standards.

It follows that we detect and correct errors quickly for better and more accurate results.

It is critical not to waste this material, which is precisely what we avoid

So, you see, it is possible to keep costs low while maintaining excellence with the use of  PCBTok’s products and services.

Choose the Top Laminate for Enterprise

It is critical to select the right PCB supplier.

You want to be confident that your project will be completed on time, correctly, and safely.

PCBTok is your answer if you need the Rogers 3203 laminate used in your boards.

Before being accepted as a supplier for our high-quality products, we go through your rigorous evaluation process.

We will pay close attention to every detail from start to finish to ensure that you receive the best service possible.

Choose the Top Laminate for Enterprise

Prized for Mechanical Stability

Prized for Mechanical Stability
Prized for Mechanical Stability 2

The correct specifications are used in products for RF, Microwave, and Stripline.

This is a non-negotiable matter, as it is for all High Frequency, Multilayer boards.

The Rogers 3000 series has other items, not just the 3203.

But the Rogers 3203 differentiates itself because of mechanical stability.

Even if it is a sophisticated line of products that end up using this laminate, we assure you that when you hand us your order, it will be completed.

Rogers 3203 PCB Fabrication

PCB Properties of Rogers 3203

The primary reason for using high-frequency is to maximize the functionality of the multilayer board. It is then deemed critical that the PCBA be installed correctly.

  • Main feature of this laminate is Dk of 3.02, with a low level of dielectric loss
  • Outstanding performance in terms of SMD
  • PCB etching can be done using finer lines
  • Very mechanically stable

With PCBTok on your side, your product is guaranteed to work.

Advantages of Our Rogers 3203

You need to make sure that this material is wisely used.

PCBTok outshines the competition because of the following advantages:

  • We perform PCB routing and layout calibration
  • We do extensive AOI and E-testing
  • Quality Management System is evenly employed.
  • We provide expert CAD assistance id needed.

Lastly, we positively implement advanced PCBA knowledge when using the material.

OEM & ODM Rogers 3203 PCB Applications

for Mobile

High Frequency materials like this are used in a variety of mobile devices due to their versatility. If you don’t like the Rogers line, you can use other laminates.

Broadband & Internet

This material is also used in broadband connections that use point-to-point or multipoint connections because it prevents signal loss to the greatest extent possible.


The most common application is with an RFID antenna or transponder. However, other ground antennas also used the Rogers 3203 material.

Wireless Applications

Wireless applications cover a wide range of applications. Bluetooth and Smart Technology applications are both possible.

Automotive Uses

This board is typically used in automotive applications when the vehicle has GPS. It can be enhanced with Sensor PCBs.

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Recognized Rogers 3203 PCB Supplier

We deliver the optimum solution for your High Frequency boards—

By using only genuine Rogers line of materials.

Rogers 3203 PCB Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
1mil Deviation of Master
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.


2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.


3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.


4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.


5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

Quick Quote
  • “Excellent, friendly customer service. Initially, we hired PCBTok for prototyping and low-volume PCB production. The work they did was excellent, making the rest of the construction process a breeze. If you’re looking for a reliable and professional PCB supplier in China, look no further. By far the friendliest and most dedicated workforce I’ve ever worked with! I’m looking forward to having them work on more projects!”

    George Daniel, Purchasing Agent from Greater Sydney Area, Australia
  • “PCBTok responded quickly to our request for PCB assembly services, charged a reasonable fee, was knowledgeable, worked quickly and cleanly, and was friendly, kind, and courteous. We will definitely use them again for any PCB needs and would highly recommend them to our PCB enthusiast friends. We’ve used them several times and they’re fantastic!! I must recommend him to friends who require his expertise. Their employees are communicative, punctual, and do excellent work in a timely manner.”

    Jeremy Wood, Layout Engineer from Moorgate, England, United Kingdom
  • “We’ve hired the PCBTok team twice now and have found them to be dependable, professional and courteous. The sales girl was a good communicator, and an expert at what she does! The team as a whole has completed the following tasks for us: Reverse engineering, cloning and PCBA. We are very much satisfied, and we will be return customers. My impression is that they are professional, punctual, reasonably priced, and a joy to work with!”

    Þorgnýr Olafsdottir, Strategic Sourcing Director from Grindavik, Iceland
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