Excellent Mechanical and Electrical Properties | Rogers 6002 PCBTok
With PCBTok’s Rogers 6002 PCB, you can produce high-grade circuit materials that meet the demands of high-reliability designs in our world today. This is the first laminate with a low dielectric constant (Dk) that has excellent mechanical and electrical properties needed to build microwave structures.
- Reliable end products and circuit boards.
- No minimum order quantity for your new order
- Accepts third-party assessment on our manufacturing process.
- Provides continuous update on your orders.
- Free prototype circuit boards before your mass production
Remarkable Rogers 6002 PCBs of PCBTok
Rogers 6002 laminates are known to produce microwave structures that are electrically stable and mechanically reliable. These laminates were introduced and this changed what microwave engineers used for circuit board materials.
With Rogers 6002, you can design a circuit board with high-frequency circuits on it and know that it will not deform or melt at high temperatures. The same can be said for mechanical stresses as well. This is a big deal for engineers who want to build a product that will last over time without having to worry about replacing parts every few months because they failed due to wear and tear.
If you’re looking for a material that will give your designs the best chance of success, it’s time to start using Rogers 6002 laminates. These PCB laminates are known to produce microwave structures that are electrically stable and mechanically reliable.
Rogers 6002 PCB By Type
Rogers 6002 PCB By Thickness (6)
Rogers 6002 By Feature (6)
Finely Fabricated Rogers 6002 PCB | PCBTok
Finely fabricated Rogers 6002 PCBs are designed to meet the needs of your project and your customers. We take great pride in the quality of our services, and we are proud to provide our customers with the best PCB fabrication service available.
With our state-of-the-art equipment and highly skilled employees, we can manufacture any type of PCB, including fine-line, double-sided boards. Our Rogers 6002 PCBs are made from high-quality materials that ensure durability and longevity. We also offer optional features such as leaded finishes, solder masks, silk screening, plating and more!
We understand that every project is different, so we will work closely with you to ensure that each customer gets exactly what they need at an affordable price.
Design and Manufacturing Process of Rogers 6002 PCB | PCBTok
The manufacturing process of a printed circuit board is a critical aspect that can make or break the quality of your final product. It is important to understand how the process works and what areas need the most attention.
Creating an electronic schematic or circuit diagram that describes how all components are connected together on the board. The design must also include information about any special requirements, such as whether they need to be positioned near each other or kept apart due to electrostatic discharge concerns (ESD).
A professional designer can assist with this process by creating schematics using software like Eagle Cadsoft Eagle , which supports both 2D and 3D drawing features for creating multi-layer boards with complex layouts. However, if you’re just looking for something simple then there are many online tools available from companies like [website name]. These allow users without much experience in electronics design to create simple layouts without too much trouble!
Industry’s Most Dependable Rogers 6002 PCB from PCBTok
Rogers 6002 is the industry’s most dependable PCB material, and PCBTok has you covered.
It’s used in a wide range of applications, from consumer electronics to power transmission and distribution. It’s a great option for high-power and high-frequency circuits because it has a higher breakdown voltage than other materials, which means it can withstand more energy before failing. It also offers excellent thermal conductivity, making it a good choice for high-power circuits subjected to high temperatures.
What’s more, it has a low dielectric constant, which means that it requires less voltage to achieve the same effect as other materials. So if you’re looking for an alternative to FR4 or other available options, Rogers 6002 is a great place to start!
Faster Signal Transmission of Rogers 6002 PCB
The Rogers 6002 PCB has a copper layer that is typically used for signal transmission, as well as for providing power to the components of the PCB. The copper layer has a number of different layers that make up its composition, but it starts with a top coat that provides protection from oxidation and corrosion. This top coat is followed by annealing, which is done to ensure that no cracks form in the copper during the manufacturing process.
The final step in making the Rogers 6002 PCB’s copper layer is plating. Plating involves placing a thin layer of nickel on top of the annealed copper and then covering it with another layer of nickel. This helps prevent further oxidation during manufacturing and also improves signal transmission capabilities so signals can travel between points faster than before!
Rogers 6002 PCB Fabrication
The Rogers 6002 PCB has a low dielectric constant, which means that it is a good material for use in high-frequency circuits.
The dielectric constant is defined as the ratio of the electric displacement field to the electric field strength in a vacuum. It is a measure of a material’s ability to store electrical energy as potential (voltage) and to transport it as current, or vice versa. A high dielectric constant indicates that a material will have low losses, which makes it ideal for use in high-frequency applications.
In addition to being ideal for use in high-frequency applications, Rogers 6002 PCB is also manufactured using automated processes.
The low loss tangent is a measure of how much the impedance of a material changes as its frequency increases.
The lower the loss tangent, the less impedance change occurs over a wide range of frequencies. The Rogers 6002 PCB has a low loss tangent, which means that you can use it for microwave applications without worrying about impedance changes in your circuit design.
The Rogers 6002 PCB has a very low level of attenuation for high-frequency electromagnetic waves. This is important because it allows for a high degree of signal integrity and minimal signal degradation over long distances.
OEM & ODM Rogers 6002 PCB Applications
The Rogers 6002 PCB for Power Backplanes is a surface mount chip that offers a simple solution to the growing need for high power density and lightweight, low-cost backplanes. It also has a UL 94 V-0 flammability rating, which makes it highly durable.
Rogers 6002 PCB Production Details As Following Up
|1||Layer Count||1-20 layers||22-40 layer|
|2||Base Material||KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)|
|3||PCB Type||Rigid PCB/FPC/Flex-Rigid||Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.|
|4||Lamination type||Blind&buried via type||Mechanical blind&burried vias with less than 3 times laminating||Mechanical blind&burried vias with less than 2 times laminating|
|HDI PCB||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating|
|5||Finished Board Thickness||0.2-3.2mm||3.4-7mm|
|6||Minimum Core Thickness||0.15mm(6mil)||0.1mm(4mil)|
|7||Copper Thickness||Min. 1/2 OZ, Max. 4 OZ||Min. 1/3 OZ, Max. 10 OZ|
|9||Maximum Board Size||500*600mm(19”*23”)||1100*500mm(43”*19”)|
|10||Hole||Min laser drilling size||4mil||4mil|
|Max laser drilling size||6mil||6mil|
|Max aspect ratio for Hole plate||10:1（hole diameter＞8mil）||20:1|
|Max aspect ratio for laser via filling plating||0.9:1(Depth included copper thickness)||1:1(Depth included copper thickness)|
|Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
|0.8:1(drilling tool size≥10mil)||1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)|
|Min. depth of Mechanical depth-control(back drill)||8mil||8mil|
|Min gap between hole wall and
conductor (None blind and buried via PCB)
|Min gap between hole wall conductor (Blind and buried via PCB)||8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)||7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)|
|Min gab between hole wall conductor(Laser blind hole buried via PCB)||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）|
|Min space between laser holes and conductor||6mil||5mil|
|Min space between hole walls in different net||10mil||10mil|
|Min space between hole walls in the same net||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)|
|Min space bwteen NPTH hole walls||8mil||8mil|
|Hole location tolerance||±2mil||±2mil|
|Pressfit holes tolerance||±2mil||±2mil|
|Countersink depth tolerance||±6mil||±6mil|
|Countersink hole size tolerance||±6mil||±6mil|
|11||Pad(ring)||Min Pad size for laser drillings||10mil(for 4mil laser via),11mil(for 5mil laser via)||10mil(for 4mil laser via),11mil(for 5mil laser via)|
|Min Pad size for mechanical drillings||16mil(8mil drillings)||16mil(8mil drillings)|
|Min BGA pad size||HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold)||HASL:10mil, LF HASL:12mil, other surface technics are 7mi|
|Pad size tolerance(BGA)||±1.5mil(pad size≤10mil);±15%(pad size>10mil)||±1.2mil(pad size≤12mil);±10%(pad size≥12mil)|
|1OZ: 3/4mil||1OZ: 3/4mil|
|2OZ: 4/5.5mil||2OZ: 4/5mil|
|3OZ: 5/8mil||3OZ: 5/8mil|
|4OZ: 6/11mil||4OZ: 6/11mil|
|5OZ: 7/14mil||5OZ: 7/13.5mil|
|6OZ: 8/16mil||6OZ: 8/15mil|
|7OZ: 9/19mil||7OZ: 9/18mil|
|8OZ: 10/22mil||8OZ: 10/21mil|
|9OZ: 11/25mil||9OZ: 11/24mil|
|10OZ: 12/28mil||10OZ: 12/27mil|
|1OZ: 4.8/5mil||1OZ: 4.5/5mil|
|1.43OZ（negative ）:5/8||1.43OZ（negative ）:5/7|
|2OZ: 6/8mil||2OZ: 6/7mil|
|3OZ: 6/12mil||3OZ: 6/10mil|
|4OZ: 7.5/15mil||4OZ: 7.5/13mil|
|5OZ: 9/18mil||5OZ: 9/16mil|
|6OZ: 10/21mil||6OZ: 10/19mil|
|7OZ: 11/25mil||7OZ: 11/22mil|
|8OZ: 12/29mil||8OZ: 12/26mil|
|9OZ: 13/33mil||9OZ: 13/30mil|
|10OZ: 14/38mil||10OZ: 14/35mil|
|13||Dimension Tolerance||Hole Position||0.08 ( 3 mils)|
|Conductor Width(W)||20% Deviation of Master
|1mil Deviation of Master
|Outline Dimension||0.15 mm ( 6 mils)||0.10 mm ( 4 mils)|
|Conductors & Outline
( C – O )
|0.15 mm ( 6 mils)||0.13 mm ( 5 mils)|
|Warp and Twist||0.75%||0.50%|
|14||Solder Mask||Max drilling tool size for via filled with Soldermask (single side)||35.4mil||35.4mil|
|Soldermask color||Green, Black, Blue, Red, White, Yellow,Purple matte/glossy|
|Silkscreen color||White, Black,Blue,Yellow|
|Max hole size for via filled with Blue glue aluminium||197mil||197mil|
|Finish hole size for via filled with resin||4-25.4mil||4-25.4mil|
|Max aspect ratio for via filled with resin board||8:1||12:1|
|Min width of soldermask bridge||Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)|
|Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
|Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)|
|Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)|
|Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)|
|15||Surface Treatment||Lead free||Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge|
|Aspect ratio||10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)|
|Max finished size||HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″；|
|Min finished size||HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″；|
|PCB thickness||HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm|
|Max high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mil|
|16||V-Cutting||Panel Size||500mm X 622 mm ( max. )||500mm X 800 mm ( max. )|
|Board Thickness||0.50 mm (20mil) min.||0.30 mm (12mil) min.|
|Remain Thickness||1/3 board thickness||0.40 +/-0.10mm( 16+/-4 mil )|
|Tolerance||±0.13 mm(5mil)||±0.1 mm(4mil)|
|Groove Width||0.50 mm (20mil) max.||0.38 mm (15mil) max.|
|Groove to Groove||20 mm (787mil) min.||10 mm (394mil) min.|
|Groove to Trace||0.45 mm(18mil) min.||0.38 mm(15mil) min.|
|17||Slot||Slot size tol.L≥2W||PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil)||PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil)|
|NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil)||NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil)|
|18||Min Spacing from hole edge to hole edge||0.30-1.60 (Hole Diameter)||0.15mm(6mil)||0.10mm(4mil)|
|1.61-6.50 (Hole Diameter)||0.15mm(6mil)||0.13mm(5mil)|
|19||Min spacing between hole edge to circuitry pattern||PTH hole: 0.20mm(8mil)||PTH hole: 0.13mm(5mil)|
|NPTH hole: 0.18mm(7mil)||NPTH hole: 0.10mm(4mil)|
|20||Image transfer Registration tol||Circuit pattern vs.index hole||0.10(4mil)||0.08(3mil)|
|Circuit pattern vs.2nd drill hole||0.15(6mil)||0.10(4mil)|
|21||Registration tolerance of front/back image||0.075mm(3mil)||0.05mm(2mil)|
|22||Multilayers||Layer-layer misregistration||4layers:||0.15mm(6mil)max.||4layers:||0.10mm(4mil) max.|
|Min. Spacing from Hole Edge to Innerlayer Pattern||0.225mm(9mil)||0.15mm(6mil)|
|Min.Spacing from Outline to Innerlayer Pattern||0.38mm(15mil)||0.225mm(9mil)|
|Min. board thickness||4layers:0.30mm(12mil)||4layers:0.20mm(8mil)|
|Board thickness tolerance||4layers:+/-0.13mm(5mil)||4layers:+/-0.10mm(4mil)|
|8-12 layers:+/-0.20mm (8mil)||8-12 layers:+/-0.15mm (6mil)|
|26||Impedance control||±5ohm(＜50ohm), ±10%(≥50ohm)|
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of our customers.
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of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
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Please contact your sales representative for shipping solutions.
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