Excellent Mechanical and Electrical Properties | Rogers 6002 PCBTok

With PCBTok’s Rogers 6002 PCB, you can produce high-grade circuit materials that meet the demands of high-reliability designs in our world today. This is the first laminate with a low dielectric constant (Dk) that has excellent mechanical and electrical properties needed to build microwave structures.

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Remarkable Rogers 6002 PCBs of PCBTok

Rogers 6002 laminates are known to produce microwave structures that are electrically stable and mechanically reliable. These laminates were introduced and this changed what microwave engineers used for circuit board materials.

With Rogers 6002, you can design a circuit board with high-frequency circuits on it and know that it will not deform or melt at high temperatures. The same can be said for mechanical stresses as well. This is a big deal for engineers who want to build a product that will last over time without having to worry about replacing parts every few months because they failed due to wear and tear.

If you’re looking for a material that will give your designs the best chance of success, it’s time to start using Rogers 6002 laminates. These PCB laminates are known to produce microwave structures that are electrically stable and mechanically reliable.

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Rogers 6002 PCB By Type

Single-Sided PCB

Single Sided Rogers 6002 PCB is the simplest low cost PCB. These types of PCB have only one single layer of the base substrate. This simply means that there are no traces on the back side of the PCB.

Double-Sided PCB

Double-sided Rogers 6002 PCBs has a layer of insulator on both sides of the board. They are used to protect against electrical interference, provide a stable foundation for components, and enhance electrical performance.

Multilayer PCB

Multilayer PCB Rogers 6002 has more than two conductive layers of material, all multilayer PCBs must have at least three layers of conductive material which are buried in the center of the material.

Microwave PCB

Rogers 6002 Microwave PCB boards offer the benefits of smaller size, lower weight, and greater reliability over traditional vacuum tube equipment. Used in applications such as radar, telecommunication and electron microscopy.

Rigid PCB

A Rigid Rogers 6002 PCB is suitable for applications that require a greater level of rigidity, such as through-hole circuit boards and machine boards. Rigid Rogers 6002 PCBs are commonly used in industrial applications

High-Frequency PCB

High frequency printed circuits, as the name suggests, are considered as having a high frequency. They offer faster signal flow rates and a frequency range, for industrial applications such as power distribution.

Rogers 6002 PCB By Thickness (6)

  • 5mil Thickness

    5mil thickness is the most common thickness of Rogers 6002 printed circuit board. Thicker boards generally mean more layers and closer spacing, while thinner boards have less layers and wider spaces between traces.

  • 10mil Thickness

    10mil Thickness of Rogers 6002 is recommended for all kinds of applications. High-thermal and chemical resistance, excellent rigidity, dimensional stability and its melting point is higher than the solder material.

  • 20mil Thickness

    20mil thick, Rogers 6002 is the best choice for high power and heat dissipation. It has excellent thermal conductivity and electrical insulation properties so that there are no problems with their performance.

  • 30mil Thickness

    With a thickness of 30 mils, Rogers 6002 is a robust and reliable material. It has high thermal conductivity and is flame resistant, making it an ideal choice for industrial applications where heat issues can arise.

  • 60mil Thickness

    The 60mil thickness of Rogers 6002 printed circuit board makes it ideal for a wide range of applications including power products, lighting, acoustics and more. It is suitable for automatic assembly machines as well as hand soldering.

  • 120mil Thickness

    Rogers 6002 with 120 mils and is used for outdoor applications. Rogers 6002 PCBs include copper foil, a diffusion barrier layer and a phenolic resin laminate to provide excellent thermal and electrical properties.

Rogers 6002 By Feature (6)

  • Plated Through Hole PCB

    Our Rogers 6002 Plated Through Hole PCB is designed and manufactured with the highest quality materials, and they are perfect for projects that require simple fabrication.

  • CAF Resistant PCB

    The CAF Resistant Rogers 6002 for safe and reliable high-speed signal transmission. The signal path is made of copper, which has excellent electrical and thermal conductivity.

  • Low Loss PCB

    Low Loss Rogers 6002 for a typical broadband millimeter-wave band. For short range wireless communications, microwave and millimeter-wave communication links.

  • UL 94 V-0 PCB

    UL 94 V-0 Rogers 6002 is listed a flame resistant material, used in high temperature applications where the need to control through a non-combustible surface.

  • Impendance Control PCB

    Rogers 6002 Impendance Control PCB helps to control the impedance of the product. It helps in protecting the system from surges, overvoltage and under voltage current.

  • Radio Frequency PCB

    Radio Frequency Rogers 6002 performance characteristics are modified by electronic components such as resistors, capacitors, inductors and anti-parallel diodes.

Finely Fabricated Rogers 6002 PCB | PCBTok

Finely fabricated Rogers 6002 PCBs are designed to meet the needs of your project and your customers. We take great pride in the quality of our services, and we are proud to provide our customers with the best PCB fabrication service available.

With our state-of-the-art equipment and highly skilled employees, we can manufacture any type of PCB, including fine-line, double-sided boards. Our Rogers 6002 PCBs are made from high-quality materials that ensure durability and longevity. We also offer optional features such as leaded finishes, solder masks, silk screening, plating and more!

We understand that every project is different, so we will work closely with you to ensure that each customer gets exactly what they need at an affordable price.

Finely Fabricated Rogers 6002 PCB PCBTok
Finely Fabricated Rogers 6002 PCB PCBTok (1)

Design and Manufacturing Process of Rogers 6002 PCB | PCBTok

The manufacturing process of a printed circuit board is a critical aspect that can make or break the quality of your final product. It is important to understand how the process works and what areas need the most attention.

Creating an electronic schematic or circuit diagram that describes how all components are connected together on the board. The design must also include information about any special requirements, such as whether they need to be positioned near each other or kept apart due to electrostatic discharge concerns (ESD).

A professional designer can assist with this process by creating schematics using software like Eagle Cadsoft Eagle , which supports both 2D and 3D drawing features for creating multi-layer boards with complex layouts. However, if you’re just looking for something simple then there are many online tools available from companies like [website name]. These allow users without much experience in electronics design to create simple layouts without too much trouble!

Industry’s Most Dependable Rogers 6002 PCB from PCBTok

Rogers 6002 is the industry’s most dependable PCB material, and PCBTok has you covered.

It’s used in a wide range of applications, from consumer electronics to power transmission and distribution. It’s a great option for high-power and high-frequency circuits because it has a higher breakdown voltage than other materials, which means it can withstand more energy before failing. It also offers excellent thermal conductivity, making it a good choice for high-power circuits subjected to high temperatures.

What’s more, it has a low dielectric constant, which means that it requires less voltage to achieve the same effect as other materials. So if you’re looking for an alternative to FR4 or other available options, Rogers 6002 is a great place to start!

Industry’s Most Dependable Rogers 6002 PCB from PCBTok

Faster Signal Transmission of Rogers 6002 PCB

Faster Signal Transmission of Rogers 6002 PCB
Faster Signal Transmission of Rogers 6002 PCB (1)

The Rogers 6002 PCB has a copper layer that is typically used for signal transmission, as well as for providing power to the components of the PCB. The copper layer has a number of different layers that make up its composition, but it starts with a top coat that provides protection from oxidation and corrosion. This top coat is followed by annealing, which is done to ensure that no cracks form in the copper during the manufacturing process.

The final step in making the Rogers 6002 PCB’s copper layer is plating. Plating involves placing a thin layer of nickel on top of the annealed copper and then covering it with another layer of nickel. This helps prevent further oxidation during manufacturing and also improves signal transmission capabilities so signals can travel between points faster than before!

Rogers 6002 PCB Fabrication

Low Dielectric Constant of the Rogers 6002 PCB

The Rogers 6002 PCB has a low dielectric constant, which means that it is a good material for use in high-frequency circuits.

The dielectric constant is defined as the ratio of the electric displacement field to the electric field strength in a vacuum. It is a measure of a material’s ability to store electrical energy as potential (voltage) and to transport it as current, or vice versa. A high dielectric constant indicates that a material will have low losses, which makes it ideal for use in high-frequency applications.

In addition to being ideal for use in high-frequency applications, Rogers 6002 PCB is also manufactured using automated processes.

Low Loss Tangent of the Rogers 6002 PCB

The low loss tangent is a measure of how much the impedance of a material changes as its frequency increases.

The lower the loss tangent, the less impedance change occurs over a wide range of frequencies. The Rogers 6002 PCB has a low loss tangent, which means that you can use it for microwave applications without worrying about impedance changes in your circuit design.

The Rogers 6002 PCB has a very low level of attenuation for high-frequency electromagnetic waves. This is important because it allows for a high degree of signal integrity and minimal signal degradation over long distances.

OEM & ODM Rogers 6002 PCB Applications

Phased Array Antennas

The Rogers 6002 PCB is a highly efficient, single or multilayer unbalanced Phased Array antenna. Designed for applications with tight size constraints, it can be used in applications where larger phased arrays are impractical.

Radar Systems

Rogers 6002 PCB is the best choice for Radar Systems. The board enables your project to provide the right protection, in a way that minimizes weight and size made to increase the strength of the material while eliminating unnecessary components.

Global Positioning System Antennas

High quality, low profile, compact and cost-effective panel mount GPS antennas. Rogers 6002 PCB for Global Positioning System Antennas are designed to meet the most demanding requirements of your high power applications.

Power Backplanes

The Rogers 6002 PCB for Power Backplanes is a surface mount chip that offers a simple solution to the growing need for high power density and lightweight, low-cost backplanes. It also has a UL 94 V-0 flammability rating, which makes it highly durable.

Beam Forming Networks

The Rogers 6002 PCB is a chip scale device that incorporates our latest technology to deliver high performance and high integration wireless solutions for Beam Forming Networks with speed and precision.

Low Dielectric Constant of the Rogers 6002 PCB
Low Loss Low Dielectric Rogers 6002 PCB | PCBTok

Excellent thermal stability and low dielectric constant. Rogers 6002 PCB has low thermal conductivity, high stability and low dielectric impedance.

Inquire about Rogers 6002 PCB from PCBTok today!

Rogers 6002 PCB Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
1mil Deviation of Master
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

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