High-Performance Mid TG S1000H

S1000H optimized for higher performance compared with conventional thermoplastics in printed circuit board. It’s a versatile, very high-performance specifically formulated for engineering applications requiring high stiffness and toughness at elevated temperatures and stability.

When you’re looking for S1000H, you’ll want to find the best place to purchase it, and that is PCBTok. That way, you know that the price is fair, and the quality is high. Call and inquire at PCBTok now.

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Ensuring S1000H’s Quality and Durability | PCBTok

PCBTok is a leading manufacturer of S1000H in China. We provide our customers with high-quality S1000H at low prices. When you buy from us, you can be confident that your S1000H will arrive quickly, on time, and ready to be used in your product.

We are committed to providing our customers with the best service possible. That’s why we go above and beyond traditional manufacturing practices when it comes to ensuring the quality and durability of our S1000H.

As one of the world’s most reliable PCB providers, PCBTok is dedicated to making sure all of our products are up to standards, which is why we’ve put so much effort into creating our S1000H. S1000H is manufactured with durability in mind. We want you to be able to rely on it for years to come.

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S1000H By Glass Fabric Type

106 1037

Glass Fabric type with 73-78% resin content, 0.050mm – 0.063mm cured thickness, and 1.260m×150m standard thickness can withstand a great deal of heat when exposed to high temperatures.

1080 1078

A high-quality S1000H with 1080/1078 glass type. This S1000H has a resin content of 65-70%, a 0.072mm -0.087mm cured thickness and a standard 1.260m×300m sheet size of the printed circuit board.


The S1000H with 2313 glass fabric type is a heat-strengthened glass with 57% resin content and an average thickness of 0.100mm. The length of this product is 1.260 meters × 300 meters as a standard measurement.


S1000H has 2116 Glass Fabric types with 55-58% resin content, 0.120mm – 0.130mm cured thickness and a standard thickness of 1.260m×300m delivering homogeneous thermal insulation.


2313 Glass Fabric is a transparent grade of our S1000H designed with high-strength glass fabric, having a resin content of 48% by volume. The cured thickness of this glass fabric is 0.160mm.


S1000H with 7628 Glass Fabric type with 46%- 52% resin content, 0.225mm cured thickness and 1.260m×150m standard thickness is specially designed for high strength to weight ratio, low and high temperature applications.

Complete Introduction to S1000H

S1000H is a lead-free, anti-CAF compliant, low water absorption epoxy board that has excellent thermal reliability and through-hole reliability. It is also suitable for use in instruments, computer and NB consumer electronics, automotive electronics, power suppliers, and industrial applications.

S1000H boards are designed to meet the demands of today’s high-reliability applications. The S1000H provides a low dielectric constant and high dielectric strength that helps ensure the reliable operation of the circuit under high voltage stress or in the presence of high-temperature environments. This board has superior solderability and good mechanical properties. As a result, it offers excellent moisture absorption resistance as well as good thermal stability under long-term exposure to elevated temperatures.

Complete Introduction to S1000H
Lead Free Compatible FR-4 S1000H

Lead Free Compatible FR-4 S1000H

The lead-free compatible FR-4 S1000H printed circuit board is a high-quality alternative to FR-4. The use of lead in electronics has been widely debated for some time now, and many people are pushing for its removal from products. For this reason, there are many alternatives to lead-based FR-4 PCBs that can be used instead.

One of these options is the lead-free compatible FR-4 S1000H printed circuit board. This type of PCB has similar characteristics as traditional FR-4 boards, but they are made without using lead or any other heavy metals. This makes them an ideal choice for anyone who wants to make sure their products won’t harm the environment or human health when they’re disposed of at the end of their life span.

S1000H Best Thermal Reliability

Thermal reliability is an important part of the design and manufacturing process of printed circuit boards. The S1000H standard defines the requirements for PCBs that are used in a lot of applications. These requirements address the most important thermal aspects of PCBs, such as thermal resistance and thermal cycling stability.

The S1000H PCB is optimized for high-power density, which means it can withstand higher power loads than other PCBs. This is especially important when you’re working with high-powered electronics such as laptops and servers. The result is a powerful and dependable solution that will keep your electronics safe from damage caused by overheating.

S1000H Best Thermal Reliability

PCBTok | Shengyi's Mid TG S1000H

PCBTok Shengyi's Mid TG S1000H
PCBTok Shengyi's Mid TG S1000H (1)

PCBTok has been manufacturing Mid TG S1000H printed circuit board, made of advanced materials, and it has been designed with the most advanced technology.

PCBTok uses advanced materials to ensure that S1000H can last long and be used in many different environments. PCBTok’s S1000H also has a very low failure rate, which means that your product will work as intended without any problems.

S1000H is made from a combination of copper and other metals, which makes it extremely durable and resistant to corrosion. This means that you don’t have to worry about your product breaking down over time or after being exposed to harsh weather conditions like rain or snow for an extended period of time.

S1000H Fabrication

Reliable Anti-CAF and IST Performance

The S1000H is a lead-free PCB has been widely used in the automotive industry. With its reliable performance and long lifetime, this board has become the most widely used printed circuit board design in the world.

In addition to its excellent anti-corrosion performance, this board also provides reliable anti-CAF performance through its high resistance to corrosion and sulfidation.

It has reliable IST performance by preventing cracks from forming on solder joints during harsh conditions such as high and low temperatures.

Low Water Absorption Capability

The low water absorption capability of S1000H is an important factor to consider when choosing this option. The low water absorption capability is a key characteristic of the S1000H that makes it superior to other options on the market.

The main reason why this is an important characteristic is because it means that the board will not be affected by moisture, which can cause damage. This means that even if your product gets wet, it will still be able to function properly, and you won’t have to worry about replacing parts or even replacing entire boards.

OEM & ODM S1000H Applications


S1000H is a common component in the manufacturing of computers. It’s used for a variety of purposes, but most commonly to connect the system’s CPU to its memory and storage devices.

Medical Instruments

Designed for manufacturing instruments. It is used in the production of devices that measure, monitor, and control physical processes such as pressure, voltage, flow rate, temperature, etc.

ENIG PCB for Automotive Electronics

Designed to be used with safety-related electronic control units which are responsible for controlling various functions in cars and trucks. The S1000H applies to safety-related functions of a car.

Consumer Electronics

Designed as an alternative to traditional PCBs. The S1000H board features fiberglass and glass substrate, making it more durable and less expensive than traditional PCBs.

Industrial Control

S1000H features high reliability, excellent heat resistance and good solderability. It can be used for the manufacture of power supply units, as well as other industrial products.

Mid TG and High Heat Resistance S1000H from PCBTok
Mid TG and High Heat Resistance S1000H from PCBTok

S1000H from PCBTok is a mid TG and high heat resistance glass fiber reinforced epoxy resin PCB. Used in both high-temperature and low-temperature applications, depending on your needs.

S1000H Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
1mil Deviation of Master
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.


2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.


3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.


4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.


5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

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  • “Sometimes buying a few PCBs for your project is not enough, you need to order more than that. And if you are just starting a new business and don’t have sufficient funding, it may be hard for you to order from other providers. But I was lucky to stumble upon PCBTok as they offered me low-cost PCBs that I could use in my prototype product. I’m very pleased working with PCBTok. They have the best customer service I have ever encountered, and I am really grateful for their help. Thank you, guys!”

    Werner Heisenberg, Owner of a Mobile Repair Shop from Bavaria, West Germany
  • “A friend of mine recommended PCBtok to me. I wasn’t certain about the site because it was my first time buying a custom PCB. But when it arrived and was exactly what I ordered, I was thrilled! PCBTok does fab work and I have been nothing but impressed. After working with them, my board is now in production, and I cannot wait to get it to market. The staff is friendly and helpful, and you can design your own PCB and have it delivered right to your door.”

    Alfred Kastler, Electronics Technician from Bandol, France
  • “I am an electronic engineer and I have been in the PCB industry for over a decade. I have a lot of experience with PCB manufacturing, but when I first used PCBTok, I was really impressed with their service. They offer the best PCB purchasing services at an affordable price and they will always put your concerns into priority. They produce the best quality boards. Also, their customer service is amazing! They respond quickly to any question I have.”

    David MacMillan, Computer Electronic Engineer from Scotland, United Kingdom
What is the Difference Between S1000H and S1000-2?

The difference between S1000H and S1000-2 is the glass transition temperature, when a the printed circuit board transitions from a stiff, glass-like solid to a more malleable, rubbery material.

S1000-2 is a low CTE (coefficient of thermal expansion), high TG and excellent thermal resistance, making it perfect for high aspect ratio and high-layer PCBs. It has excellent thermal resistance, making it ideal for use in harsh environments.

S1000H, on the other hand, is a high-performance material with mid TG, lead-free, and good reliability performance of 8L CAF test. This material has been chosen by many customers as it has excellent performance in both processing and product quality with a wide range of applications.

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