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Introduction
Simply put, an S1150G is one of the laminates that a customer can opt for in their desired applications; it is produced by one of the famous companies in China, Shengyi Technology.
Almost all technical people in this industry know laminate’s importance in various applications since they are responsible for maintaining the layers glued all together.
In this article, we will share our knowledge about S1150G as one of the leading and experienced manufacturers in the industry. All of the information shared will be related to its definition, features, applications, properties, parameters, and other technical details.
At the end of this article, we anticipate that the reader will be equipped with adequate information relating to S1150G that will eventually help them in their decision-making process.
Introduction to S1150G
What is S1150G?
As mentioned, S1150G is a kind of laminate produced by the famous company in China, Shengyi Technology, that is recognized to be composed of Halogen-Free components.
In addition, it has a TD value of 325°C up to 365°C and a TG value of approximately 140°C to 150°C at a frequency rate of 0 to 0.1 GHz. Based on its TG value, it is regarded that an S1150G falls under the Mid-TG category. If one’s application requires a laminate that can tolerate higher than the TG value of an S1150G, this isn’t the right option for that usage.
Apart from being free from the presence of halogen, it doesn’t possess toxic substances and hazardous residues. Furthermore, the S1150G laminate is well-known for its lead-free, mechanical process compatibility and exceptional thermal resistance. Thus, making this laminate RoHS compliant and other environment-related certifications.
It can be applied in various applications and different board types; we’ll share some of the boards that are compatible with this laminate. We have lead-free, halogen-free smartphones, Xbox, automotive, and laptop circuit boards.
Nevertheless, the board class doesn’t solely include the mentioned ones; it can also be integrated into other panels. We suggest contacting an experienced manufacturer like PCBTok for quicker assistance and professional opinion.
Understanding the Definition of S1150G
Features and Applications of S1150G
In order to thoroughly understand the concept of an S1150G, we will be discussing its features and possible applications of this laminate. In that way, one can easily understand the principle, purpose, and usage of the S1150G.
Features
- It possesses Anti-CAF functionality.
- It is lead-free compliant.
- It has a remarkable capacity to perform mechanical activities.
- As mentioned, they are free from the presence of halogens, antimony, and red phosphorous.
Applications
- Smartphone, Tablet, and Notebook (Mini Laptop)
- LEDs
- Game Stations
- Automotive Electronics
- Telecommunications Equipment
General Properties of S1150G
All of the information below are the general properties of S1150G based on the provided material of the Shengyi Technology Company; all of these are for reference purposes only. Furthermore, all of the values mentioned are aligned with the specimen size of 1.6 mm; the results may vary depending on its size. Hence, it is highly recommended to contact the chosen manufacturer to have the values that are related to the desired dimensions of the laminate.
| TEST ITEM | TEST METHOD | TEST CONDITION | UNIT | TYPICAL VALUE | |
| TG | IPC-TM-650 2.4.25D | DSC | °C | 155 | |
| TD | IPC-TM-650 2.4.24.6 | TGA (5% W.L) | °C | 355 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | Min | 45 | |
| T260 | IPC-TM-650 2.4.24.1 | TMA | Min | > 60 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | > 100 | |
| CTE (Z-Axis) | IPC-TM-650 2.4.24 | Before TG | Ppm/°C | 40 | |
| IPC-TM-650 2.4.24 | After TG | Ppm/°C | 230 | ||
| IPC-TM-650 2.4.24 | 50-260℃ | % | 2.8 | ||
| Permittivity (1 GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | – | 4.5 | |
| Loss Tangent (1 GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | – | 0.011 | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ-cm | 1.15×108 | |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 9.61×106 | |
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-0.5/23 | s | 178 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-0.5/23 | kV | > 45 | |
| Peel Strength (1 oz) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm | 1.5 | |
| Flexural Strength (LW/CW) | IPC-TM-650 2.4.4 | A | MPa | 630/480 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.10 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
|
Halogen Content |
Br |
EN 14582 |
A |
ppm |
≤ 900 |
| Cl | |||||
| Br + Cl | |||||
Prepreg Parameters of S1150G
Similar to its properties, the prepreg parameter values listed below are for reference only. If planning to specify the fabric type and other factors, we recommend reaching out to a trusted and experienced manufacturer for an accurate professional opinion regarding this matter. Furthermore, its resin content and size can be customized depending on the desired purpose of the laminate. Hence, it is essential to communicate with the producer themselves.
| Glass Fabric Type | Resin Content (%) | Cured Thickness (mm) | Standard Size (Roll Type) |
| 106/1037 | 73 | 0.050 | 1.260 mm by 150 m |
| 75 | 0.056 | ||
| 1080/1078 | 63 | 0.071 |
1.260 mm by 300 m |
| 66 | 0.078 | ||
| 68 | 0.084 | ||
| 2313 | 55 | 0.096 | |
| 57 | 0.101 | ||
| 2116 | 54 | 0.119 | 1.260 mm by 250 m |
| 57 | 0.130 | ||
| 1506 | 45 | 0.152 |
1.260 mm by 150 m |
| 48 | 0.163 | ||
| 7628 | 43 | 0.185 | |
| 45 | 0.195 | ||
| 48 | 0.210 | ||
| 50 | 0.220 |
Hot Pressing Cycle and Storage Condition of S1150G
In order to fully understand the principle and functionality of an S1150G, we will share its hot-pressing cycle procedure and the storage condition of S1150G depending on the months it is desired to store since it may vary from time to time. Thus, it is essential to have adequate knowledge of it to avoid unnecessary events to the laminate and its device.
Hot Pressing Cycle
- The Multilayer PCB’s composition or the underlying copper influences the pace of heat-up.
- Its treatment is roughly 45 minutes or more from 180°C to 190°C.
- If you require deeper in-depth insights, please contact us; we have qualified and seasoned professionals ready to address your questions.
Hot Pressing the Laminate
Storage Condition
- Three (3) months if kept at temperatures below 23°C and humidity levels below 50%.
- While six (6) months if kept at or below 5°C. At least 4 hours should pass for stabilization prior to application.
- Keep things protected in damp-proof cloth at all times, and be wary of wetness since the prepreg might absorb moisture while being maintained routinely, reducing the adhesion properties.
- Stay out of direct sunlight and UV radiation.
Conclusion
In conclusion, S1150G is among the choices that one can select as their laminate produced by Shengyi Technology; it has a wide array of applications but with a limited purpose due to its properties and values. Nevertheless, if the desired application wasn’t mentioned in the article but clearly fits its capability, it can be suitable for such purposes.
In such instances, we suggest reaching out to a reliable manufacturer with over a decade of experience, such as PCBTok, for their professional advice regarding the application. We are providing our customers with a hundred percent customer satisfaction with our offers and services.
If you’re curious to learn more about S1150G and are planning to acquire high-quality products, we suggest contacting us directly; we’ll be delighted to assist you.