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Your Professional Shengyi PCB Manufacturer
PCBTOK is a professional PCB and PCBA manufacturer. We utilize high performance Shengyi series copper-clad laminates. We could produce a wide range of high quality PCBs to meet your quality and needs.
- ShengyiPCB’s 30 years of industry experience ensures leading technology and product stability.
- PCBTOK team over 18 years experences provides you with professional technical support and service.
- Our source factory’s excellent production capacity can take high volume production and meet your delivery date.
Just choose PCBTOK as your first choice for Shengyi PCB project’s needs!
Shengyi PCB Solutions Manufactured by PCBTOK
Shengyi PCB materials are manufactured by Shengyi Technology. The top copper-clad laminates manufacturer in the world.
Due to their excellent electrical properties, good heat resistance, and eco-friendly and halogen-free. Shengyi PCBs are used for a great variety of electronic devices.
At PCBtok, we use Shengyi PCB series materials to produce high quality circuit boards. We are able to meet your needs for quality, reliability, and environmental friendliness.
Whether you need small prototyping volumes or large-volume production, we can work with your project needs. Please don’t wait to contact us and let us work on your project!
Shengyi PCB By Feature
Series such as S1141 are designed for rigid PCB, and provide great mechanical strength and stability. Rigid circuit boards design can sustain higher current loads for consumer electronics. Meet your strict needs for high mechanical strength and long-term reliability.
Materials such as SF325 are designed for applications with high dynamic bending and hot environments. These materials provide great flexibility, electrical properties and thermal stability. It ensures your board stability in tight spaces and high stress environments.
Such as ST110G, specially designed for high power applications. These materials provide excellent thermal management performance for PCB, and greatly reduce temperatures. Meet your needs for efficient heat dissipation and long term stable operation of the board.
Materials such as S7045G and S7040G series are designed for high speed signal transmission. These materials are low dielectric constant and low dissipation . It can ensure rapid signal transmission and stability. Meet your high speed and high frequency requirements.
These materials are low dielectric constants and good electrical capabilities. Make sure the signal transmission is stable. Broadly use in wireless communication, radar system and millimeter wave equipment. Fit your high-frequency signal transmission requirements
Their good electrical performance, thermal stability and mechanical strength guarantee dependable operation in complex applications. And with low signal decay and good anti-interference performance can suit your high demand for signal integrity and stability.
Common FR4 Shenyi PCB (5)
Shengyi S1141 lead-free laminate offers high heat resistance and low water absorption. Its thermal properties are better suited to FR-4 material. S1141 is easy to process and is applicable to different kinds of high-performance electronic products. It is ideal for enhancing PCB reliability and stability.
S1000H is a medium TG lead-free FR-4 copper clad laminate. Its great through hole reliability and 3.0% Z-CTE enable it to be well adapted for multilayer and high-frequency boards. Also, S1000H with good CAF resistance, application in various electronic products.
Shengyi S1000-2 is high TG and high heat resistance material. Its high electrical performance and anti-CAF features can make the PCB stable for a long time. S1000-2 is fit for multilayer PCB, with ISO, UL and RoHS certificates, and can be used in harsh environments.
S1600L is a high CTI lead-free FR-4 copper-clad board. Great anti-CAF capability and low Z-axis CTE improve the board’s long-term stability. Its tracking voltage resistance (CTI≥600V) and UL94 flame retardant provide PCB safety. With UV resistant compatible and good PCB processability.
S1170 is a high TG lead-free FR-4 copper clad laminate. It features a high glass transition temperature of 170°C, excellent thermal stability and low Z-axis CTE. And is eco-friendly, good CAF resistance and compatible with UV resistance and AOI. S1170 PCBs are best-in-class in stability and reliability.
PCBTok’s Shengyi PCB Supply Excellent Perfomance
PCBTok’s Shengyi PCB use advanced manufacturing techniques and high quality raw materials. We aim to provide you with the best boards in both performance and reliability. Also, Shengyi PCB’s lead-free feature fulfills global environmental standards, making production eco-friendly and safe.
Moreover, Shengyi PCB are ideal in thermal resistance and electrical efficiency to meet your needs of high-frequency, high-speed and high-reliability applications.
Regardless of the complexity of the situation, Shengyi PCB always provides the durability and stability you need. To ensure the best performance of your circuit boards. PCBTOK’s Shengyi PCB must be your first & best choice.
PCBTOK Offers Quality-Certified Shengyi PCB
PCBTok’s Shengyi PCB, meets IPC-A-610 assembly standards with UL certification. This guarantees the boards we manufacture can meet worldwide electrical safety requirements.
Such certifications ensure circuit boards reach the high standards of safety, reliability and performance. Giving our clients more confidence in our PCBTOK’s PCB quality.
With all of these standards and certifications, PCBTok’s Shengyi PCB can give your quality assurance in circuit boards. It can help you achieve the best performance in all kinds of demanding projects.
Shengyi PCB Fabrication
At PCBTok, our factory is equipped with high-precision machinery and equipment, including the latest drilling, laminating and testing equipment.
We strictly control every stage of production to ensure that we produce the highest standards of Shengyi PCBs.
We always use premium materials from Shengyi technology.
Such as S1170 and S1000H, can make sure our Shengyi PCB is reliable in harsh environments.
Our PCBTOK never compromises on quality while we offer competitive pricing. PCBTOK’s professional engineering team will closely help you customize the Shengyi PCBs to match your particular application needs.
Our 24-hour quick-response sales team service and professional technical support can resolve all your inquiries and needs in a timely manner.
As a source manufacturer of PCB and PCBA, we have the confidence to make Shengyi PCBs for your projects. And to provide you with considerate services.
OEM & ODM Shengyi PCB Applications
Shengyi PCB are widely used in consumer electronics. Including smart phones, desktop computers, smart watches, headphones, TVs, game consoles, and so on.
Shengyi PCB support high speed data transmission and greater bandwidth requirements. It is critical for communication equipment. Such as 5G base stations, routers, switches, and wireless communication modules.
Shengyi PCBs also find a wide range of applications in the industrial control field. Particularly in the automation equipment, robots, the control panel, power systems and sensors and other products.
Shengyi PCBs are often applied in the automotive industry. This covers the fields of automotive electronics, in-vehicle entertainment systems, and battery management systems (BMS), autonomous driving technology, and in-vehicle communication modules.
Shengyi PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) | 0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) | 7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W | 1mil Deviation of Master A/W | ||||||
| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) | 0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area | ||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Shengyi PCB: The Completed FAQ Guide
If you are a designer or developer looking for a reliable source of Shengyi PCBs, then China is the right place for you. The country is home to many of the world’s largest PCB manufacturers, as well as numerous large factories that produce high-quality raw materials for Sheng Yi printed circuit boards.
If you need a reliable source of Shengyi PCBs, PCBTok is the company to contact.
Shengyi PCB refers to PCB manufactured with Shengyi Technology’s copper-clad and semi-cured sheets. Shengyi Technology is a global leading supplier of PCB materials. Their materials are well known for their high performance, featuring excellent heat resistance, low dielectric constant and outstanding mechanical strength.
Shengyi PCB has lots of materials. including FR-4, high-frequency, high-speed, RF & microwave, and lead-free solutions. They are commonly used in the communications, automotive, consumer electronics, and industrial control industries. Due to the reliability and compliance with UL, IPC and other standards, make the Shengyi copper clad laminate is the first choice material for advanced PCB applications.
Shengyi HDI PCB
- Standard FR-4 copper-clad laminates: for common PCB applications.
- High performance FR-4 laminates: meet the higher thermal and mechanical stability requirements.
- High Tg Copper Clad Laminate: For multilayer PCB designs that need high temperatures.
- BT Epoxy Copper Clad Laminate: Suitable for high frequency applications with a low dielectric constant and low loss.
- Polyimide copper-clad laminates: For high temperature application, commonly for aerospace and military applications.
- Copper Clad Laminate (CCL): For most PCBs and provid the base conductive layer.
- Teflon (PTFE) Copper Clad Laminate: Excellent electrical properties let it commonly used in RF and microwave applications.
Shengyi Laminate
Above Shengyi laminate types are used in lots of industries, including telecommunications, automotive, consumer electronics and industrial control systems.
You will find the datasheet of some Shengyi laminates as follows:
| Product Name | Product Description | Tg | Td | CTE |
| S1000H | Low CTE, Mid-Tg Material | 155 | 348 | 2.80% |
| S1000-2 | Low CTE, high thermal resistance, high Tg laminate | 180 | 345 | 2.80% |
| S1000-2M | Low CTE, High Thermal Resistance, High Tg Material | 180 | 355 | 2.40% |
| S1600L | CTI600 | 150 | 355 | 3.20% |
| S1130 | Natural color | 135 | 310 | 4.50% |
| S1141 | UV blocking | 140 | 310 | 4.50% |
| SF305 | Halogen-free flame-resistant type PI film-based flexible copper clad laminate | Dk:3.6 | Df:0.028 |
At PCBTok, we run all of our products through a strict testing program. This to ensure the quality and reliability of ShengYi’s copper clad laminates, including:
- Thermal Performance Test: Evaluates Shengyi laminate’s thermal resistance, thermal conductivity and coefficient of thermal expansion (CTE).
- Electrical Performance Test: Checks Shengyi laminate’s dielectric constant (Dk), dielectric loss factor (Df) and insulation resistance.
- Peel Strength Test: Evaluates Shengyi laminate’s copper foil adhesion strength to the laminate’s surface.
- Flame Resistance Test: Verify Shengyi laminate’s flame retardancy to UL94 standards.
- CAF Resistance Test: Ensures Shengyi laminate’s resistance to anode conductive filament (CAF) buildup, for long-term reliability.
- Environmental testing: Includes evaluation for moisture absorption and UV resistance.
- Dimensional Stability Test: Examines the ability of copper-clad laminates under stress to maintain structural integrity.
These tests help ensure ShengYi’s copper-clad laminates comply with industry standards. Meet your project requirements.
