Advanced Silicon Nitride Substrate from PCBTok

Silicon Nitride, also called Si3N4, is a chemical compound made of silicon and nitrogen. It has great thermal stability, low porosity and is hydrolytic resistance, making it an excellent for printed circuit boards.

PCBTok is one of the most reliable manufacturers of Silicon Nitride Substrate PCB boards. For over ten years, PCBTok has been supplying more than 1, 000 customers throughout Asia, Europe and America.

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Thermal, Mechanical and Electrical Properties of Silicon Nitride Substrate

The thermal, mechanical and electrical properties of silicon nitride substrates are important for the development of electronic devices. Silicon nitride has a high coefficient of thermal expansion (CTE), which means that it expands and contracts at a higher rate than other ceramic.

Silicon nitride also has a low thermal expansion coefficient compared to other materials. This means that silicon nitride will not deform when subjected to high temperatures and stresses. Silicon nitride is also very resistant to corrosion at high temperatures.

PCBTok is the most reliable manufacturer of Silicon Nitride Substrate. We have a team of professional engineers who are dedicated to provide you with the best product. Let us know your requirements and we will manufacture the products for you.

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Silicon Nitride Substrate PCB By Thickness

0.1mm

The Silicon Nitride Substrate with 0.1mm thickness has low thermal conductivity. It is extremely hard and chemically durable and has chemical resistance to acids and alcohols for device’s better stability.

0.25mm

Used in semiconductor industry, microelectronics and other industries applications where its high planar density, excellent corrosion resistance and ultra-low thermal coefficient of expansion.

0.385mm

Features a low-k coating and are compatible with a wide range of electronic devices. A thickness of 0.385mm makes these substrates suitable for almost any application, from high-class wearables to consumer electronics.

0.5mm

Silicon Nitride Substrate with 0.5mm thickness is a very strong, mechanically very tough and durable. It has a good thermal conductivity feature which ensures its good performance over temperature ranges.

0.635mm

Silicon Nitride Substrate with 0.635mm thickness is an excellent material in which to conduct heat studies and other thermal analyses due to its high thermal conductivity, low thermal expansion coefficient.

1.0mm

Silicon Nitride Substrate with 1.0mm thickness. It can be used under high temperature, high voltage and low electric field. It has good chemical stability, radiation resistance and magnetic flux density insulation performance.

Complete Guide to Silicon Nitride Substrate (Si3N4)

Silicon Nitride Substrate (Si3N4) is the most common material used in manufacturing printed circuit boards. The main reason for this is that it is non-conductive and has a high thermal conductivity. This means that it can be used as a substrate to build various types of circuits on without causing any interference with its performance.

In addition, silicon nitride substrates are also known for their high strength and hardness properties which make them ideal for use in industrial applications where they need to withstand high levels of pressure or stress.

The main function of the substrate is to provide a stable surface for mounting electronic components and other components needed for functioning of the PCB. The substrate can be made from different materials such as glass, alumina, polyimide, and so on. Silicon nitride has many advantages over other substrates and hence it is widely used in PCB manufacturing.

Complete Guide to Silicon Nitride Substrate (Si3N4)
PCBTok's Tried and Tested Silicon Nitride Substrate

Silicon Nitride Substrate Features and Characteristics

One of the most important features of silicon nitride substrate materials is their ability to withstand high temperatures without changing their physical form or structure. This makes them perfect for use in environments where high temperatures are common, such as in industrial settings or in electronic devices that require heat to function properly.

Another great feature about these silicon nitride substrates is their low density and lightweight nature, which allows them to be easily handled by workers without causing discomfort or fatigue from carrying heavy loads around all day long (such as when working at an electronics factory). This also means that they can easily be transported from one place to another without requiring much effort on behalf of those who are responsible for making sure everything stays safe during transit.

Silicon Nitride Substrate for Improved Performance

Silicon nitride is a hard material that can be used as a substrate for printed circuit boards. When used as a substrate, it provides excellent thermal stability and improved electrical performance. This makes it an ideal choice for devices that require high-temperature operation and/or high-speed signal transmission.

Silicon nitride substrates are commonly used in the manufacturing process of printed circuit boards. They provide excellent thermal stability and improved electrical performance, making them an ideal choice for high-temperature operation or high-speed signal transmission.

Silicon Nitride Substrate for Improved Performance

PCBTok's Tried and Tested Silicon Nitride Substrate

Why Choose PCBTok as PCB Prepreg Manufacturer
PCBTok's Tried and Tested Silicon Nitride Substrate (1)

PCBTok is a professional manufacturer and supplier of silicon nitride substrate. We provide the best quality silicon nitride substrate with competitive price, good service and fast delivery.

We are committed to providing customers with high quality products and services at competitive prices. We have been working hard to establish long-term cooperation relationship with our customers.

We believe that we can create value together through our commitment to quality and excellence as well as our ability to listen carefully to customer needs.

If you are interested in any of our silicon nitride substrate products or would like to discuss a custom order, please feel free to contact us.

Silicon Nitride Substrate Fabrication

Silicon Nitride Substrate for Improved Performance

The reliability of silicon nitride substrate in manufacturing printed circuit boards is one of the most important factors in determining the quality of the product. The resistance of silicon nitride substrates to various environmental conditions, their high strength and hardness, low thermal expansion coefficient, high temperature resistance make them one of the most popular materials for manufacturing printed circuit boards.

Silicon nitride substrates are used for manufacturing printed circuit boards, as well as for other applications where it is necessary to use a strong, heat-resistant material that does not require thermal processing. Silicon nitride substrate is widely used in the manufacture of electronic equipment: computers, mobile phones, satellites etc.

Silicon Nitride Substrate Vs Other Ceramics

The silicon nitride substrate is a ceramic material that has many advantages over other substrates. One of the most important advantages is that it has a high thermal conductivity, which means that it can dissipate heat better than other materials, such as glass or silicon dioxide. This allows for higher temperatures during processing, which can reduce the time needed to manufacture printed circuit boards.

Another advantage is that silicon nitride has a higher hardness than other ceramics, which makes it more durable. This means there is less risk of damage during handling or shipping, which further reduces costs and increases efficiency. In addition, silicon nitride has good chemical resistance and excellent thermal shock resistance.

Most Dependable Silicon Nitride Substrate for Digital Era

PCBTok’s silicon nitride substrate is known for its high thermal conductivity, high thermal shock resistance, good chemical resistance and low stress-crack sensitivity.

Silicon Nitride Substrate Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
A/W
1mil Deviation of Master
A/W
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.

DHL

2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.

UPS

3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.

TNT

4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.

FedEx

5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

  • “PCBTok has been manufacturing and assembling PCBs for me and my company for several years, and I’ve never been disappointed. I have a high expectation when it comes to delivery dates and quality of work, and they consistently exceed my expectations. They are courteous and flexible with me, and they are open to my need for a PCB designer. I’ve worked with many PCB suppliers, but PCBTok is the best one by far.”

    David John Guetta, Digital Manufacturing Owner from Iowa, USA
  • “There is nothing to complain about this PCB online store. As an electronic hobbyist, I could find many reasonable and affordable products in PCBTok. They have many professional engineers in the team. Now, they also communicate with their customers efficiently, which is very convenient. I would like to recommend this online store to all of you.”

    Pancho Segurra, Electronic Hobbyist, Quito, Ecuador
  • “My business is an engineering consultancy, and PCBTok is the supplier that we rely on for our rigid fiberglass PCBs. Not only do they supply us with a high-quality product at a low price, but they also deliver it to us on time. PCBTok has a great selection of PCB and fast shipping. It was a pleasure working with them. They work hard to meet your deadline and even send out a photo of the finished product before shipping. Thank you PCBTok! We are very happy with them.”

    Jefferson Perez, Engineering Consultancy Manager from Medellin, Colombia
Thermal Property of Silicon Nitride Substrate

Silicon nitride is a ceramic material that has excellent thermal properties. It can withstand high temperatures and has a very low coefficient of thermal expansion, which means it does not expand or contract with changes in temperature. Silicon nitride is often used as a substrate for integrated circuits, because it is resistant to corrosion, oxidation, and chemicals. It is also used in semiconductor manufacturing as an insulator or as part of the wafer bonding process.

Silicon Nitride Substrate is a ceramic material that has been designed for use as a thermal management material. This material has high thermal conductivity and low thermal expansion, making it suitable for use in high-power semiconductor devices.

Electrical Property of Silicon Nitride Substrate

Silicon nitride has a high melting point and is electrically non-conductive and chemically inert, making it an excellent insulator for electrical applications.

Silicon nitride substrates have a low dielectric constant which makes them ideal for use in high-frequency applications such as microwave circuits, RF circuits, and MEMS devices. Silicon nitride substrates are also used in the electronics industry to form sensors and transducers as well as to make semiconductor devices such as diodes, transistors, and integrated circuits.

Mechanical Property of Silicon Nitride Substrate

The mechanical property of silicon nitride substrates is important for several reasons. It has superior strength, hardness and stiffness compared to silicon carbide and similar materials. This makes it ideal for use in applications where high-strength components are required, such as in aerospace or defense applications where large amounts of force are exerted on the parts being machined or manufactured.

The mechanical properties of silicon nitride substrates have been studied extensively, and the results indicate that silicon nitride is a strong and hard material with a high Young’s modulus and elastic limit.

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