Qualified Silkscreen PCB Fabricator
What services can PCBTok provide to you?
- Silkscreen PCB, PCB Quick-turn, and PCB mass production are areas of expertise
- Our engineering group includes senior PCB specialists.
- Since 2008, a global PCB manufacturing company
- Industrial workers are veterans of PCB manufacturing
Give us a call right away to place your PCB order!
The Perfect Silkscreen PCB for You
Once you have tried PCBTok, you will find no other PCB supplier.
For digital connectivity, multilayer PCB and multilayer-Flex PCBs are deployed.
Typically, they’re referred to as Silkscreen PCBs.
We use non-conductive epoxy ink to create the silkscreen on these multipurpose PCBs,
The PCB assemblers use this silkscreen layer to direct the placement of the components. This makes your Silkscreen PCB flawless!
We are able to produce Silkscreen PCB because we have engineers who specialize in PCB design. Discover more about it here!
Silkscreen PCB By Feature
The HDI Silkscreen PCB has several applications. Teflon or Rogers is the most popular material. Despite the fact that most clients utilize a green solder mask for it.
Rogers Silkscreen PCB can be utilized in IC core packaging, semiconductors and chip testing. It is then that you can say that this item is durable.
Hard Gold makes up the terminal end of the Gold Finger Silkscreen PCB. This makes it durable. There is also a full body hard gold plating option, though costlier.
You may also obtain a Digital Silkscreen PCB Gold Fingers. If this is the case, it possesses Hard Gold, a material with exceptional conductivity quality.
This prototype silkscreen PCB can occasionally be quite unique. For instance, thin metal devices, sensors, and other types use this kind of PCB.
Silkscreen PCB By Type (6)
Silkscreen PCB By Surface Finish & Color (6)
Providing the Ideal Silkscreen PCB
Trust only the best.
All of PCBTok’s circuit boards are made with extreme precision.
We guarantee that customers receive the best service, from Silkscreen PCB design to assembly.
We have customer service representatives available
We take your call and assist you with your Multilayer, Double-layer, or Single-layer PCB order. All day, every day.

Manufacturing Silkscreen PCB Expertly
Excellent Silkscreen PCBs are what we do.
You have a trusted business partner in PCBTok, who will help your PCB requirements.
Since 2008, when we first began, we have more than 12 years of experience.
We have already released a large number of Silkscreen PCBs.
We also offer a free sample with large orders. simply ask, and we’ll provide
We manage to give 24/7 IT or sales help service to back up the sale.
You don’t need to think further. Just call!
Ultra Safe Silkscreen PCB Processing
What do we mean by Quality Assurance?
Putting it simply, we roll out the Silkscreen PCB you ordered after it has gone through multiple rounds of checks.
If you’re interested, our facilities can also construct a Prototype PCB for you.
In fact, we have been handling OEM types of Silkscreen PCBs from customers worldwide.
We’ve got 3000 and more clients so far.
Contact PCBTok now!

We Give You Lots of Great Silkscreen PCBs


As your champion in Silkscreen PCB, we assure you:
- Our delivery schedule adapts to your convenience.
- Our PCB assembly and design assistance are complete.
- Our top priority is seeing you happy.
- We convert you to become a loyal customer too!
For timely delivery of your Silkscreen PCB, we only work with reliable couriers.
Don’t worry about delays, we got your back!
Silkscreen PCB Fabrication
Whether you need a circuit board for business, industry, or personal usage, PCBTok may meet all of your requirements.
We provide a flexible product called Arlon PCB. For this type of PCB, high-voltage and high-frequency solutions are available.
We do collaborate with companies that are experts in prepreg and high-performance laminate materials.
Additionally, we produce standard FR4 PCBs as Silkscreen PCBs concurrently.
Inquire right away to ask about your silkscreen PCB!
We are stringent with PCB inspections.
We carry out functional tests and AOI inspections. and occasionally, we perform manual checks too.
Like no other company, on the off chance, if you notice a fault with the Silkscreen PCB, we’ll get right to down to fix it.
We will provide you with a complete 8D report so you can identify the root cause/issue.
Following that, we will continue to assist you with any other wants you have.
OEM & ODM PCB Silkscreen PCB Applications
Silkscreen PCB for Heavy Industries choose specifically for power applications. Simply let us know which type of material you like for these sturdy pieces.
Companies that use it in RF, RFID antennas, ICs, microcontrollers and other products similar to these are referred to as semiconductor and computer applications for Silkscreen PCB.
Silkscreen PCB can now be used for technological vehicle solutions. These are frequently utilized for lighting, passenger comfort, and engine control.
Silkscreen PCB is utilized in commercial applications for a range of factors. When it comes to regulating occupational safety and health regulations, we are strict.
For Silkscreen PCB, low signal loss and low Dk make preferred, especially if these are mobile and telecom applications. These are common place devices for consumers.
Silkscreen PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Method
- Payment Methods
- Send Us Inquiry
NO | Item | Technical Specification | ||||||
Standard | Advanced | |||||||
1 | Layer Count | 1-20 layers | 22-40 layer | |||||
2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
Max laser drilling size | 6mil | 6mil | ||||||
Max aspect ratio for Hole plate | 10:1(hole diameter>8mil) | 20:1 | ||||||
Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(>14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L) | ||||||
Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | ||||||
Min space between laser holes and conductor | 6mil | 5mil | ||||||
Min space between hole walls in different net | 10mil | 10mil | ||||||
Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
Hole location tolerance | ±2mil | ±2mil | ||||||
NPTH tolerance | ±2mil | ±2mil | ||||||
Pressfit holes tolerance | ±2mil | ±2mil | ||||||
Countersink depth tolerance | ±6mil | ±6mil | ||||||
Countersink hole size tolerance | ±6mil | ±6mil | ||||||
11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
12 | Width/Space | Internal Layer | 1/2OZ:3/3mil | 1/2OZ:3/3mil | ||||
1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
External Layer | 1/3OZ:3.5/4mil | 1/3OZ:3/3mil | ||||||
1/2OZ:3.9/4.5mil | 1/2OZ:3.5/3.5mil | |||||||
1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
1.43OZ(positive):4.5/7 | 1.43OZ(positive):4.5/6 | |||||||
1.43OZ(negative ):5/8 | 1.43OZ(negative ):5/7 | |||||||
2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
Warp and Twist | 0.75% | 0.50% | ||||||
14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
Silkscreen color | White, Black,Blue,Yellow | |||||||
Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
Leaded | Leaded HASL | |||||||
Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
Max finished size | HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″; | |||||||
Min finished size | HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″; | |||||||
PCB thickness | HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm | |||||||
Max high to gold finger | 1.5inch | |||||||
Min space between gold fingers | 6mil | |||||||
Min block space to gold fingers | 7.5mil | |||||||
16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
17 | Slot | Slot size tol.L≥2W | PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) | PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil) | ||||
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) | NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil) | |||||||
18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
24 | Conductivity | <50Ω(typical:25Ω) | ||||||
25 | Test voltage | 250V | ||||||
26 | Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Silkscreen PCB: The Completed FAQ Guide
You’ve come to the right place if you’re looking for information on silkscreen PCB. This guide answers a variety of frequently asked questions about the silkscreen PCB process, such as where to find the best font, how to use it, and where to place your design components. Despite its name, the Completed FAQ Guide contains far more information than a few FAQs. As a result, it will assist you in designing and producing high-quality PCBs.
Screen printing on silk fabrics is a traditional method for creating elegant designs. For over a century, manufacturers and merchants all over the world have used this process to print images and designs. This process is ideal for high-quality designs because it is so precise. Continue reading to learn more about the silkscreen printing process! The steps involved in silkscreen printing are detailed below.
To begin, place the silk to be printed on a printing board flat. Then, place a screen over the material and lower it into place. Then, at the top of the screen, add your desired color of ink. Then, using the squeegee, evenly distribute the ink across the screen. The ink carries through the open areas of the stencil as the squeegee presses it across the screen.
Process of Silkscreen Printing
The image will then be printed. Ink is pumped through the stencil openings, transferring it to the substrate. This process generates an impression that follows the matrix’s direction. For each color, the printmaker employs a different stencil. A printmaker must take great care to ensure that each color is correctly registered. The process can take several hours to complete. The number of colors that can be used for a silkscreen print is unlimited.
After that, the silk screen is stretched over a wooden or aluminum frame. A UV-curable emulsion is used to transfer the pattern to the screen. After the dye is applied to the screen, the ink is applied with an appropriate squeegee. Many other industries and products make use of screen printing. In more advanced applications, resistors and conductors are laid down in multi-layer circuits. The method has also been used to create thin ceramic layers.
Silkscreen printing uses two types of fabric: cotton and polyester. Cotton sags with time and the finer the mesh aperture, the less precision, and detail is lost. When stretched, polyester, which is widely used in commercial applications, retains its stability. Polyester is also solvent and ink resistant. The most durable and long-lasting option is stainless steel mesh, but it lacks the flexibility of cotton or polyester.
The silkscreen has been framed. It forms the shape of the design and is large enough to cover the area to be decorated. Steel, aluminum, or wood frames can be used, but they are more expensive and more difficult to repair. Despite its tendency to warp and deform, wood is still used commercially. Some of the most common materials used in silkscreen printing are listed below. Continue reading to find out more.
Silkscreen on PCB
Draw the design in pencil or use a computer program to make a stencil. As stencils, newspapers or plastic canvas can be used. For stencils that will be used more than once, wax paper is preferable. The inside edges of the stencil can be cut with a stencil knife. Cut a piece of sheer fabric several inches larger than the design and place it over the screen to apply the stencil to the fabric. You can create multi-color designs, but keep in mind that each color will require its own stencil.
Another type of silkscreen is created by obstructing certain areas of the screen, such as the design. This produces a stencil that contains the open space on the substrate where the ink will appear. The stencils are reusable and can be used multiple times. If you want to make your own, you can buy a silk screen kit, which includes everything you need to make a stencil. You can print as many times as you want this way.
Silkscreen controls, board layers, and information layers are all part of the CAD system. You can open and close layers, change colors and fill patterns, and perform other operations. Different elements on a layer can be controlled separately in the advanced CAD system. For example, you can change the silkscreen reference indicator independently of the component outline. This allows you to control silkscreen layer colors and fill patterns independently of the board. It may also make sense to include regulatory markings on your PCBA, such as RoHS, FCC, CE, or e-waste disposal.
Direct legend printing is the most accurate method of silkscreen marking a circuit board. This method uses a computer-aided design (CAD) file to apply the acrylic ink to the board. This process is time-consuming, but is optimal for PCBs with registration tolerances of less than 0.005″. However, this method requires a high degree of accuracy and is costly.
The next step is to screen print on the board. The board is attached to the press and the screen printing fabric is moved up and down. The PCB is then placed under the screen printing fabric and the printing process begins. To avoid smearing, the silkscreen fabric should be precisely matched to the PCB. This step is critical to ensure that the printed information can be read by the naked eye.
If you plan to silkscreen your own PCB, you must first learn how to design the artwork using CAD tools. The artwork is an important part of the screen printing process and must be clear and easy to read. Manual silkscreening is not an easy process, so be sure to plan each step carefully. Also, be sure to follow the manufacturer’s instructions before starting the screen printing process.
How important is the silkscreen PCB in the assembly process? This is a valid argument. Many companies use this type of marking to simplify assembly, but silkscreen markings sometimes overlap with the component’s reference markings. In such cases, the designators need to be rearranged for easier reading of component locations. Silkscreen PCBs with reference marks also help with decoupling, impedance matching, and backside readability.
Silkscreen PCBs are printed in two ways. Manual screen printing uses non-conductive epoxy inks to transfer the image to the board. To cure the silkscreen, the liquid photo-imaging epoxy on the stencil is exposed to UV light. This method produces higher quality screening results as well as higher resolution images and text. However, it is costly because each board must be processed separately. It may also require the use of specialized equipment and processes.
Silkscreen from Gerber to PCB
The silkscreen information is contained in the Gerber file. The silkscreen PCB should have standard (no BOM) attributes and be marked as DNP/DNI in the BOM. silkscreen information should be on the top overlay layer of the Gerber file. In addition, the silkscreen PCB must be marked according to its dimensions and the silkscreen must be correctly positioned.
Screen printing is required for PCB assembly. Screen printing helps assembly workers identify component locations, troubleshoot PCBs, and place components. Finally, screen printing is more important for assembly than the components themselves. Customers appreciate the fact that it has the components they need and is clearly marked if clear. This simplifies the customer’s decision-making process for PCB layout.
Screensilkscreen PCBs are an important part of the manufacturing process and should be handled by the contract manufacturer. Doing it yourself can be difficult, and the results may not be as good as those produced by the PCB manufacturer. To create a quality screen print, you must first learn how to use PCB CAD tools and create your artwork. Because artwork is so important in the screen printing process, you should be creative in your creation.
When screen printing PCBs, you should use the correct processing procedures. These procedures should consist of 12 steps. The silkscreen marks should be placed next to the component they are attached to. The silkscreen font should not overlap with the PCB indicators. You should also choose a font based on the type of PCB manufacturer. Some printing packages allow you to use almost any type of silkscreen font, while other manufacturers may offer only a few fonts.
Gold Finger PCB Silkscreen
After completing your PCB design, you should discuss your silkscreening requirements with the manufacturer. Discuss with them the details of your design, such as colors and sizes. Also, be sure to talk about the cost and process of silkscreening. It is critical that the screen printing process is of high quality and meets your expectations. To ensure an efficient screen printing process, you should communicate all your requirements to the PCB manufacturer.