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Exceptionally Made Taconic CER-10 by PCBTok
We at PCBTok have a dedicated process to produce a high-quality Taconic CER-10. This is to ensure that this laminate can tolerate even the most demanding applications.
- You’ll receive our constant support with your custom Taconic CER-10.
- Our company only provides PCBs that are IPC Class 2 or 3 certified.
- 24-Hour availability of professional assistance services.
- We’ll keep you informed frequently about your quote.
- Both E-Test and AOI inspections are performed as required without fail.
First-Class Taconic CER-10 Products from PCBTok
Over a thousand customers have expressed satisfaction with PCBTok’s Taconic CER-10 products globally, and this has been made possible by the fact that we exclusively create high-quality items.
Additionally, we always make sure that Taconic CER-10 will be subjected to rigorous testing and inspections to guarantee that they are reliable when in use.
We are aiming to deliver only the best Taconic CER-10 laminates in the industry by following all of your demands and specifications concerning this.
At PCBTok, you will experience both first-class products and services.
Every time we hear praises sent by our customers, our morale strikes high; hence, resulting in us constantly upgrading our skills and technologies to supply top-notch Taconic CER-10 products.
Taconic CER-10 By Feature
The Ceramic Taconic CER-10 PCB has excellent thermal conductivity, exceptional resistance to chemical erosion, and high thermal expansion and is highly stable. Hence, they are ideal for memory module devices, automotive, heavy machineries, and aerospace applications.
The Microwave Taconic CER-10 PCB offers exceptional speed and stability. In addition, it is regarded to be multifaceted; hence, it is made easy to intricate patterns through the use of low CTE components.
The High-Frequency Taconic CER-10 PCB has lots of advantages, one of which is its capability to produce signals without experiencing any loss or interferences. Also, it has exceptional thermal management.
The Multilayer Taconic CER-10 PCB has increased functionality and capabilities compared to a single-sided board. In addition, they are lightweight. Furthermore, they are widely used and preferred in various professional and medical electronics.
The RF Taconic CER-10 PCB has almost the same performance as the microwave board. However, the RF board can work in very high-frequency and high-speed signal transmission applications in a very short period of time. In addition, it is also cost-efficient.
The Copper Clad Taconic CER-10 PCB is perfectly ideal if you’re planning to incorporate it into powerful applications since this board can handle it. They are widely preferred and deployed in power supply devices.
Taconic CER-10 By Thickness (6)
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The 25 mil Taconic CER-10 is the smallest value thickness that is accepted per the international guidelines. We are capable of incorporating this type of thickness depending on your desired applications.
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The 30 mil Taconic CER-10 is slightly thicker than the 25 mil one; however, in terms of their benefits, they do not differ that much. Similar to the previous thickness, we can integrate this depending on your specifications.
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The 47 mil Taconic CER-10 is considered to be on the average thickness size; it can endure light to medium applications. You can directly inquire us if you’re unsure what thickness to deploy in your devices.
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The 50 mil Taconic CER-10 has almost the same capabilities as the 47 mils. In addition, depending on your specifications and purposes, we can customize this thickness for your application necessitates it.
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The 62 mil Taconic CER-10 can tolerate almost all heavy applications; however, with some limitations on it. We can determine its limitations for you if you just give us the details and demands of your purpose of usage.
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The 75 mil Taconic CER-10 is guaranteed to perform well even in the harshest and heaviest applications. We recommend you to message us for further checking and clarifications about your desired application.
Taconic CER-10 By Sheet Size (5)
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The 12” x 18” Taconic CER-10 is the least sheet size we can offer for this laminate. It is already capable of performing light applications, and it can be incorporated into constrained space applications.
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The 16” x 18” Taconic CER-10 is the second least sheet size we can provide for this type of laminate. It can be deployed in almost any type of application; just inquire us for further recommendations.
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The 18” x 24” Taconic CER-10 can be incorporated in average applications that has ample space in the device. We can customize this sheet size depending on your applications; just tell us your specifications.
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The 16” x 36” Taconic CER-10 is the closest size we can offer next to the 16” by 18”. It has almost the same capabilities as the previous sheet, however, it has some limitations depending on its environment.
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The 24” x 36” Taconic CER-10 is the biggest sheet size we can offer for your applications; it can be deployed in huge equipment such as industrial ones. We can incorporate it on any device; just tell us.
Taconic CER-10 Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
PCBTok’s Taconic CER-10 Characteristics
It’s important to consider the characteristics of Taconic CER-10 products and other PCB items before buying them. Some Taconic CER-10 features are listed below:
- In terms of reinforcements, most Taconic CER-10 uses woven glass.
- If seeking to deploy this laminate in high-volume usage, it is highly suitable.
- About its flexural strength, it is regarded to be exceptional.
- Taconic CER-10 is perfectly ideal for high-frequency operations.
- In terms of its cladding, you can opt for only one side or both sides of the board.
There are a lot more features that a Taconic CER-10 can offer to your applications. If you want to know more about it, you can directly message us.
Considerations Prior to Purchasing Taconic CER-10
Before purchasing Taconic CER-10, keep the following things in mind:
- TG Value – It is important to consider that the Taconic CER-10 can withstand a high amount of temperature because it can soften easily in harsh situations.
- Dielectric Constant – It is essential to consider where you want to deploy your Taconic CER-10; a low Dk value is ideal for high-frequency scenarios.
- Thermal Expansion – This should go hand in hand with its TG value because once the temperature goes beyond it, it could melt.
- Thermal Conductivity – In order for the Taconic CER-10 to conduct heat effectively, we recommend going for copper and aluminum.
Perks of PCBTok’s Taconic CER-10
Some pros of using the Taconic CER-10 by PCBTok include the following:
- It has low moisture absorption.
- It has outstanding dimensional stability; thus, it is highly reliable.
- Its flexural strength has been increased.
- It can be easily incorporated into circuit board miniaturization.
- It possesses a unique interlaminar bond.
- It has a stable dielectric constant despite its frequency.
- It has a low dissipation factor.
You can get more information about its capabilities by getting in touch with us.
Supplying Exceptional Class of Taconic CER-10 is PCBTok's Expertise
One of the strengths of PCBTok is producing high-quality Taconic CER-10 for our valued customers. We have been doing this for more than 12 years, and we are continuing to do so. We are taking this action because we place high importance on the quality of our products and the satisfaction of our customers.
In terms of any customization for your Taconic CER-10, we are more than capable of fulfilling that demand for you without any hassle.
We can produce your specified Taconic CER-10 on time without any delays. Also, we assure you of an error-free product.
PCBTok offers a wide array of options that can benefit you. If this excites you, then what are you waiting for? Contact us today to avail our Taconic CER-10!
Taconic CER-10 Fabrication
One of the most important phases of producing your Taconic CER-10 is applying its solder mask. Hence, we want to share its process.
The process of applying a solder mask to your Taconic CER-10 is simple; it goes through from defining its circuitry pattern and allowing its plated etch panel to rest.
Then before removing its etch, we set up its solder mask application procedure, stripping its copper surface, and leaving enough space for adhesion of the solder mask.
After all of it, we dry it panels; let them cool a room temperature for five (5) to ten (10) minutes, then apply its solder mask afterward, and cure and bake it properly.
Just ping us if you want further information about the procedure.
Every type of Taconic CER-10 PCB goes through a different lamination process; double-sided, multilayer, and sequential lamination.
The lamination process of a Double-Sided Taconic CER-10 PCB is simple; it will be subjected to a dry resist layer that is photosensitive through extreme temperature.
On the other hand, laminating Multilayer Taconic CER-10 PCB is performed by subjecting its inner layer to 375°F, and 275 to 400 psi for its pressure.
Now, Sequential Lamination is applicable for two or more subsets of Taconic CER-10 PCBs. After creating subsets, each pair will experience a dielectric substance.
We recommend selecting the best lamination for your needs based on your purpose.
OEM & ODM Taconic CER-10 Applications
One of the advantages of deploying a Taconic CER-10 is its exceptional solder resistance; hence, they are widely used in Power Amplifiers where this is rampant.
Due to Taconic CER-10’s capability to absorb minimal moisture and increased flexural strength, they are highly preferred in filters and couplers.
Most industrial equipments require a board and laminate that is highly stable and reliable; and, a Taconic CER-10 possesses enhanced dimensional stability.
Since the Taconic CER-10 can greatly contribute to the overall mechanical and thermal properties of a device; it has been greatly preferred in most home electronics.
Another advantage of a Taconic CER-10 is its stable dielectric constant over frequency; it has been widely preferred by most medical equipment because of this.
Taconic CER-10 Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
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Taconic CER-10 – The Ultimate FAQ Guide
The ultimate FAQ guide to help you find answers to frequently asked questions about Taconic CER-10. The most frequently asked questions about this laminate relate to its performance, how it is manufactured, and how it compares to other materials. This guide will cover each of these factors. After all questions are answered, you are ready to start working on your remaining Taconic CER-10 projects.
Multilayer Taconic PCBs are an excellent choice for high-speed, high-capacity, and low-power applications. As a result, it is widely used in consumer electronics and provides excellent signal routing. Taconic PCBs can also withstand high temperatures because they are dimensionally stable. The PCBs are also available in a variety of surface finishes, including gold and silver. Taconic’s Rf-35 PCBs are also available from PCBTok.
Taconic CER-10 is made of ceramic-filled or glass-reinforced PTFE material. The materials used are highly reliable and have excellent electrical properties. They can also be used for RF and high-speed digital applications. In addition, they have a very good surface finish that prevents copper oxidation. Modern design software allows you to run checks at any point in the manufacturing process to catch problems before they become too late. Finally, you should have error-free final ERC and DRC results. They also double-check signal routing and wiring.
Why buy a Taconic CER-10? Depending on the type of PCB, these questions will have different answers. Double-sided PCB panels are usually laminated with a photosensitive dry resist layer at high temperatures. On the other hand, multi-layer PCBs require bonding bracket lamination. Using high pressure, the inner layers are forced to bond together.