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Masterfully Constructed Taconic PCB by PCBTok
Our skilled engineers use the finest materials to develop PCBTok’s Taconic PCB, which is put through a series of production phases to guarantee a perfect product.
- We offer a free trial prior to making a significant purchase.
- Twelve years of experience making PCBs.
- Around-the-clock availability of expert personnel assistance.
- We only use PCBs that are IPC Class 2 or 3 compliant.
- You can anticipate frequent updates from us regarding your quote.
Highly Authentic Taconic PCB Products from PCBTok
We at PCBTok value quality, transparency, and integrity; thus, we continuously improve our way of constantly producing high-class Taconic PCB products.
In addition, our Taconic PCB undergoes strict inspections and evaluations to ensure they can meet heavy operations for your applications.
We want our consumers to make use of our Taconic PCB at its optimum performance that will serve its purpose for a long-time to help you in reducing costs in the long run.
At PCBTok, we exclusively serve our customer’s exceptional experiences.
Your appreciation of our Taconic PCB inspires and motivates us to improve and enhance our capabilities so that we can consistently manufacture PCBs that are pleasing to your operations.
Taconic PCB By Feature
The HDI Taconic PCB is ideal for high-speed application devices requiring a compact board size. It has become popular in the industry because of its capability to incorporate components on both sides of the board.
The High-Frequency Taconic PCB has become preferable to consumers because of its capability to cater to high-density applications with an enhanced signal. Additionally, it can offer a 500 MHz to 2GHz frequency range.
The Microwave Taconic PCB has become preferred by consumers in their applications, requiring high stability in extreme temperature conditions. Also, it has fewer occurrences of signal loss; thus ideal for communications.
The Single-Sided Taconic PCB is perfectly suited for simple low-density designs. However, despite its strengths, it doesn’t offer that much space if you’re planning to integrate numerous components since you can only use one side of the board.
The Double-Sided Taconic PCB has an increased circuit density compared with the single-sided one. It has exceptional heat dissipation. In comparison with the single-sided, you can incorporate more components into it.
The Multilayer Taconic PCB can offer high-speed and high-capacity performance because of its innate electrical properties in a compact size. Due to these board strengths, it has become popular in most of consumer electronics devices.
Taconic PCB By Layer (5)
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The 4-Layer Taconic PCB offers exceptional signal integrity that boards with less layer count. In addition, it has a better EMI shielding because of its four different layers, and it has outstanding thermal control.
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The 6-Layer Taconic PCB offers exceptional routing for low and high-speed signals because of its excellent electrical properties. Also, it is light in weight since it doesn’t require different connectors to link components.
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The 8-Layer Taconic PCB has become popular in modern electronics because of its wide array of benefits including its lesser EMI compared to boards with less layer count. Also, an 8-Layer board is highly durable and reliable.
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The 12-Layer Taconic PCB is ideal in aerospace applications since it has the capability to handle high-pressure situations, and the ability to tolerate extreme temperatures. The 12-Layer board is more compact and powerful.
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The 16-Layer Taconic PCB is more powerful, durable, and stable compared with the 12-Layer board. In addition, they are commonly used in satellite and communication systems, industrial controls, and medical devices.
Taconic PCB By Type (5)
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The Embedded Taconic PCB is the most recommended type if your application is seeking guaranteed efficiency and a high-performance device. It minimizes the appearance of irrelevant wirings on the board.
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The High-Speed Taconic PCB has become popular in wireless applications because it offers faster signal transmission of data. With this, they are frequently preferred in the communications and satellite industries.
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The High Power Taconic PCB is frequently made of heavy copper materials. Also, it can offer much stronger connection points. One of its advantages is its capability to resist extreme temperatures in a certain period.
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The V-Scored Taconic PCB is ideal for you if you’re seeking to reduce cost and save materials along the manufacturing process. This is because it is capable of separating the PCBs after production efficiently.
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The Panelized Taconic PCB is perfectly ideal for mass production of boards since the manufacturing time of this type of board is reduced. It offers safety to the overall board since it can tolerate shock and vibration.
Perks of Deploying Taconic PCB
There are a lot of aspects that a Taconic PCB can offer to your applications. Some of its perks are as follows:
- Cost – It is inexpensive to produce because of its ceramic-filled laminate.
- Dielectric Loss – It features a low value of the dielectric loss.
- Signal Loss – It features minimized to no signal loss occurrences due to the materials utilized in its manufacturing.
- Stability – It is recognized to be dimensionally stable even when exposed to harsh temperature conditions.
If you wish to know more about Taconic PCB’s capabilities, you can just inbox us.
Properties of PCBTok’s Taconic PCB
One of the important aspects to look at if you plan to purchase Taconic PCB is to consider its properties. The following are the characteristics of PCBTok’s Taconic PCB:
- Hole Size – It has a minimum value of 0.1 mm or equivalent to 4 mils.
- Line Width – It has a minimum value of 0.075 mm or equivalent to 3 mils.
- The thickness of Copper – The standard value ranges from 0.5 oz to 12 oz.
- The thickness of the Board – The standard value ranges from 0.2 mm to 6.0 mm.
These are the distinctive properties of PCBTok’s Taconic PCB; if you require any additional details, please send us a direct message.
Different Type of Taconic PCB Laminates
There are several high-frequency laminates that a Taconic PCB can offer depending on your purpose of application. Here is some of it:
- Taconic RF 35 – It has low moisture absorption that is suitable for industrial devices.
- Taconic CER 10 – It features exceptional resistance to solder, outstanding thermal and mechanical properties, and it has efficient electrical properties.
- Taconic TLY 5 – Its dielectric thickness ranges from 0.0050 to 2.20. They are widely used in power amplifiers, automotive radars, and aerospace.
- Taconic TLY 5A – This laminate features a low dissipation factor, low dielectric constant, and low water absorption rate. It is highly useful in hybrid builds.
Producing Highest Quality Taconic PCB is PCBTok's Specialty
PCBTok is one of the leading manufacturers of quality Taconic PCB in China. We have been recognized worldwide because of our products that satisfied thousands of customers across the globe and fulfilled their designated purpose flawlessly.
In terms of high-frequency and high-performance applications, Taconic PCB is the most often utilized board. As a result, it calls for sophisticated raw materials.
We are completely capable of developing a Taconic PCB to meet your needs for your projects and applications because we are experts in the PCB sector. All of our items are ISO certified to assure our clients that they will only receive high-quality output from us.
Along with the aforementioned abilities, we also have enough skilled personnel to create your required Taconic PCB, and they will always ensure that your products are of the highest caliber.
Taconic PCB Fabrication
If you’re seeking a hybrid fabrication of your Taconic PCB, you might want to consider the following features and their mechanical properties.
There are only three aspects for you to look at if you’re planning to take this route; we have the drill parameters, compatible materials, and preparation of the hole wall.
In the drill parameters, you will determine the proper hole formation for your board. While incompatible materials, its materials should match the lamination cycle.
Now, the preparation of the hole wall is the final phase; it should match the overall purpose and materials you’ve deployed in your board to achieve the best results.
Should you have any clarifications about this, you can just inbox us.
Manufacturing your Taconic PCB has almost the same process as the other regular PCBs. Here, you will have an overview of the process.
The production process goes through seven (7) phases we have PCB Etching, Photoengraving, Lamination, PCB Drilling, Solder Mask, Silkscreen, and Testing.
However, prior to producing your Taconic PCB, we will ask for your prepared designs if you have one, but we can just perform that for you depending on your needs.
We are conducting this to evaluate if there’s a need to add another phase in building your Taconic PCB to guarantee that we can produce you the highest-quality product.
You can just message us directly for further information about our services.
OEM & ODM Taconic PCB Applications
One of the advantages of deploying a Taconic PCB is its capability to produce low electrical signal loss; thus, they are widely preferred in the communications industry.
Due to Taconic PCB’s capability to produce a wide array of dielectric constant values depending on the purpose, it has been widely used in consumer electronics.
Most aerospace devices require a high-speed board that can tolerate high-frequency occurrences, it deploys the Taconic PCB and is capable of working on such.
Since Taconic PCB is recognized for its low moisture absorption and low dielectric loss; they have been frequently used in the medical industry.
Another advantage of a Taconic PCB is its exceptional dimensional stability that can withstand even extreme temperature conditions; thus, they’ve become popular in industrial equipment.
Taconic PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Taconic PCB – The Ultimate FAQ Guide
Taconic PCBs are the ideal solution for all doubters. Taconic PCBs can be adapted to most designs and applications because of their wide range of surface finishes. However, if you need to make your design extremely high frequency, the topology of the board must be considered. For example, if you are designing high-frequency RF equipment, consider an RF-30A PCB made from a Plexi-ceramic substrate and reinforced with glass fibers. low-profile copper foil and lead-free dielectric materials ensure a high-quality PCB surface finish and a significantly higher level of PIMD on the board.
They are typically made from glass-reinforced or ceramic-filled PTFE. These materials offer excellent electrical, thermal, and mechanical properties. They are ideal for high-speed digital and RF PCBs as well as aerospace and communications applications. Another important feature of Taconic PCBs is their surface finish, which ensures solderability and prevents copper oxidation.
The final assembly phase of a design project can be difficult. After all, you must double-check your work. Fortunately, modern design software allows you to run checks at any point in the process, which helps identify and correct problems early. The final ERC and DRC results should be error-free, confirming that all signal routing and wiring are correct. If all tests are passed, the PCB can withstand EMI.