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Professionally Designed Taconic RF-35 by PCBTok
PCBTok’s Taconic RF-35 laminate is certainly made with perfection; we are doing this to provide you with a worthy product that can efficiently perform to its highest performance.
- Within 24 hours of the purchase, we provide return services.
- We offer several different payment options.
- Our facility workforce consists of at least 500 people.
- We provide you with a comprehensive CAM before we start manufacturing.
- We keep your quote current by sending you frequent updates.
Exceptional Quality of Taconic RF-35 Laminates from PCBTok
We genuinely care for our consumers in PCBTok; hence, we are always making sure that we are only producing Taconic RF-35 laminates that are up to standards.
Additionally, we constantly monitor the production process of Taconic RF-35 to guarantee that they are free from errors before shipping it to your address.
Our value for integrity has brought us this far; we want our consumers to experience the best possible service and try our products’ outstanding performance.
PCBTok only serves its consumers the most satisfactory service and exceptional products.
In order to produce the best Taconic RF-35 laminates on the market, we regularly make advancements in our technology and consistently enhance the capabilities of our employees.
Taconic RF-35 By Feature
The Microwave Taconic RF-35 PCB offers exceptional stability; it performs well even if subjected to extreme temperatures. Also, it is cost-efficient and highly efficient in delicate pitching components.
The RF Taconic RF-35 PCB has quite similarities with the microwave type of board. However, it has its own dedicated benefits, such as quickly transmitting high-frequency signals with less impedance.
The Ceramic Taconic RF-35 PCB is recognized worldwide for its long service life. In addition, they are preferred by most aerospace applications because of their exceptional stability and reliability.
The High TG Taconic RF-35 is widely deployed in applications wherein it is subjected to various extreme temperature conditions due to its ability to withstand it. They are heat, chemical, and moisture resistant.
Most communication industry devices have widely preferred the High-Frequency Taconic RF-35 PCB because of its capability to transmit signals in a quick manner.
The Multilayer Taconic RF-35 PCB can offer a wide array of benefits to your applications including its capability to incorporate various components on its board in a small footprint, and it is lightweight.
Taconic RF-35 By Panel Sizes (5)
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The 12″ by 18″ Taconic RF-35 sheet size is the smallest type of board we can produce for your laminate. However, it still has numerous benefits on it despite its size. Also, they are ideal for compact design devices.
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The 16″ by 18″ Taconic RF-35 can be perfectly suited to small to medium size of devices; they still able to produce high-frequency signals, but with fewer occurrences of impedance. Also, we can customize it to your liking.
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The 18″ by 24″ Taconic RF-35 is ideal for the average type size of devices. The sheet size for a laminate doesn’t dictate that much to the benefits it can offer to your applications, but rather appropriateness to your device’s size.
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The 16″ by 36″ Taconic RF-35 can also be deployed in average-size devices, similar to the 18” by 24” panel size. However, depending on your application, we can recommend the most suitable size for it.
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The 24″ by 36″ Taconic RF-35 is the highest option we can provide for the sheet size; they are being deployed in huge devices such as industrial equipment. Also, we are capable of customizing this size for you.
Taconic RF-35 By Thickness (5)
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The 5 mil Taconic RF-35 is the least value of thickness we offer for this laminate since it is already considered to be up to standards. It can perform almost the same as other thicknesses but may vary according to your demands.
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The 10 mils Taconic RF-35 is highly preferred by most of our consumers because they are perfectly suited to most commercial applications. This thickness is still considered to be a standard and accepted thickness.
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The 20 mils Taconic RF-35 is the average thickness that our consumers use; they also deploy this in most commercial application devices as an alternative for the 10 mils since they offer almost the same benefits.
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The 30 mils Taconic RF-35 can already withstand medium to the average type of heaviness in terms of application. In addition, it is commonly used in industrial equipment since it can incorporate heavy types of components.
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The 60 mils Taconic RF-35 has quite similarities with the 30 mils. However, this specific thickness can already withstand much more heavy applications. Hence, they are highly preferred by most aerospace applications.
Taconic RF-35 Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Features of PCBTok’s Taconic RF-35
The Taconic RF-35 from PCBTok has the following characteristics:
- It is incredibly stable thanks to its woven reinforced glass.
- It has an outstanding grade for peel strength.
- They can be deployed in low-cost and High-Volume applications.
- One or both sides of the board can have a cladding with electrodeposited copper.
- This laminate can have an exceptionally low moisture absorption rate.
More than just the features listed here, our Taconic RF-35 has a lot to offer; if you’re interested in learning more, please get in touch with us directly.
Considerations to Take Prior to Purchasing Taconic RF-35
Before choosing your Taconic RF-35, you might want to consider these:
- TG Value – It should withstand harsh temperatures because once it reaches its maximum tolerance, it will soften; thus, it will stop performing.
- Thermal Decomposition – It should have a temperature of 300°C to 400°
- Dielectric Constant – We recommend opting for the low value for it to be perfectly suited in high-frequency and high-rate transmissions.
- Thermal Conductivity – We recommend having copper and aluminum in your laminate to conduct much better heat.
Pros of PCBTok’s Taconic RF-35
Our Taconic RF-35 in PCBTok can offer you the following advantages:
- Dissipation – It possesses a low dissipation factor (Df) value.
- Surface – It has a highly smooth and flat surface texture.
- Stability – Due to its woven reinforced glass, it is dimensionally stable.
- Cost – It offers a huge amount of savings if planning to use it for Radio Frequency and Microwave applications; we provide low operational costs.
- Adhesion – It has exceptional bonding to a copper of shallow profile.
- Absorption – It has excellent low moisture absorption.
We are accessible 24/7 if you have any questions about its capabilities.
PCBTok's Expertise: Manufacturing Taconic RF-35 of the Superior Quality
Our ability to consistently ensure that our laminate is appropriate for any activities without experiencing any delays or problems with the product has earned us a reputation as the leading Taconic RF-35 manufacturer worldwide.
Additionally, we are always looking for ways to reduce the cost without compromising the laminate’s quality or any of its numerous benefits.
PCBTok’s Taconic RF-35 is suitable for various high-volume, and low-cost RF and microwave applications. Additionally, we can supply you with a Taconic RF-35 that is RoHS compliant, and provide you with the best deals we can offer.
Choosing PCBTok as your Taconic RF-35 manufacturer ensures that you will have complete support from our skilled professionals at every step of the purchase process. Contact us right away, and we’ll give you the best offer we have!
Taconic RF-35 Fabrication
We want you to experience and use your Taconic RF-35 laminate to its highest performance; thus, we want to share with you the recommended press cycle.
Regarding the lamination of your Taconic RF-35, we advise you to use vacuum lamination and then raise its temperature from 1.5°C to 5.5°C per minute.
Increasing its temperature should be performed until its flow window reaches 80°C to 150°C. Then, maintain its pressure at 73 psi to reach 37°C.
After that, we recommend applying full pressure at 500 psi. Then, cure the components for an hour and the package at full pressure of 3°C/min.
You can get in touch with us if you are confused about this process.
If you’re planning to purchase a quality Taconic RF-35, go for PCBTok since we have acquired all of its required certifications established by international standards.
Moreover, PCBTok has in possession of UL accreditation, RoHS standards, MIL-PRF-31032, and UL certification for both flexible and rigid-flex constructions.
In addition, we are ITAR registered, all of our products are IPC 6013 class 3, IPC-A-600G class 1 and 2, and IPC-A-610 revision D/E class 1.
Finally, we have the ISO9001:2008 and IATF16949 certifications. All these are crucial in determining your laminate’s overall quality and performance.
Send us a mail if you’d like a more thorough explanation of each certification.
OEM & ODM Taconic RF-35 Applications
One of the advantages of deploying a Taconic RF-35 is its exceptional dimensional stability; hence, it has been preferred by most wireless devices nowadays.
Due to Taconic RF-35’s low dissipation factor and excellent adhesion to copper, they are preferred by most commercial application devices.
Most high-power applications require exceptional stability and High TG value for them to withstand extreme temperatures; a Taconic RF-35 is capable of it.
Since Taconic RF-35 is recognized for its low moisture absorption and High TG value of over 315°C they are being deployed in satellite systems that require this.
The Taconic RF-35 is the ideal selection in terms of high-frequency applications; hence, they are widely deployed by most communication industries.
Taconic RF-35 Production Details As Following Up
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| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Taconic RF-35 – The Ultimate FAQ Guide
Taconic RF-35 is a popular low-loss alternative to FR-4. The material is available in a variety of thicknesses and weights. Its dimensional stability and high corrosion resistance make it an excellent choice for a wide range of applications. Taconic RF-35 is compatible with a wide range of hybrid configurations. It is critical to research the various options available before selecting a glass fiber.
Taconic RF-35 is the model of choice for electronics manufacturers. The material offers excellent electrical and thermal properties. The double-sided PCB panel is combined with a dielectric substance in its multi-layer lamination method. Its high temperature and high-pressure lamination process ensure high-quality components and soldering. After the laminate is completed, it must be tested for defects to ensure proper operation.
Taconic RF-35 is an organic ceramic laminate reinforced with glass fibers. It is suitable for a variety of high-performance PCB applications. Due to its low operating costs, it is an excellent choice for many electrical and electronic systems. The material also has a high copper peel strength. These advantages make Taconic RF-35 an excellent choice for high-volume electronic applications. The peel strength of this material makes it an excellent choice for EMI/RFI shielding.
What is the difference between Taconic RF-35 and copper? The difference is due to the dielectric constant of the material. The dielectric constant is the rate at which electrical signals move through a high molecular weight material. At high temperatures, a material with a high dielectric constant will conduct electricity, while a material with a lower dielectric constant will be less conductive.