Well-Developed Taconic TLY-5A by PCBTok
Our Taconic TLY-5A in PCBTok has satisfied more than a thousand customers across the globe and has fulfilled its designated purpose flawlessly.
- We include soldering, micro-section, and COC report samples with every order.
- All Prototype PCB purchases come with a 24-Hour return policy.
- We have the necessary parts on hand to accomplish your demands.
- Each week, we send you a status update on your order.
- Over twelve years of professional experience in the PCB field.
Highly Remarkable Taconic TLY-5A PCB from PCBTok
PCBTok always prioritizes the Taconic TLY-5A’s quality. Therefore, we always ensure that it won’t run into any problems throughout production.
To ensure extraordinary output, we always subject our Taconic TLY-5A to the most stringent inspections outlined by the international guidelines.
We continuously strive to deliver top-notch products that gratify our customers. In addition, we constantly make sure that we use the most cutting-edge methodologies and techniques to build your Taconic TLY-5A.
Our expertise in the field has taught us a lot about how to create high-quality products.
Therefore, choosing a manufacturer with years of experience in this industry is beneficial since they are already fully equipped with the necessary knowledge to produce high-class products.
Taconic TLY-5A By Feature
The PTFE Taconic TLY-5A PCB offers low signal loss and delay occurrences; hence, they are ideal for communication systems. Moreover, it provides a wide frequency range due to its low dielectric constant.
The High-Frequency Taconic TLY-5A PCB is ideal for high-speed designs. They are widely deployed in almost all satellite systems since they can tolerate frequencies up to 100 GHz.
The Multilayer Taconic TLY-5A PCB is ideal if you’re planning to integrate a board that can easily fit into a compact device. Still, you want to incorporate many components without occupying too much space.
The Customized Taconic TLy-5A PCB can be the most excellent alternative if you want more freedom in designing your board. Also, you can incorporate more components into it.
The Microwave Taconic TLY-5A PCB possesses high stability; hence, you can use it in high-temperature conditions. It can also operate even in analog applications of up to 40 GHz.
The Radar Taconic TLY-5A PCB is one of the most widely used board types in this laminate since it is designed explicitly for millimeter wave, missile control, and other military applications.
Taconic TLY-5A By Thickness (7)
Taconic TLY-5A By Sheet Size (5)
Taconic TLY-5A Benefits

PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.

PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.

We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.

PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Properties to Consider in a Taconic TLY-5A
Before buying a Taconic TLY-5A, you should check for the following qualities:
- Transition Temperature – It should be able to withstand extreme conditions; hence, it must possess a High TG value for better performance.
- Thermal Decomposition Temperature needs to be 300°C to 400°C values.
- Dielectric Constant – We recommend the low dielectric constant (Dk) value if you plan to use it on high-frequency and high-rate transmissions.
- RoHS – It should comply with this standard to attain quality items.
- Thermal Conductivity – We recommend deploying aluminum and copper in your Taconic TLY-5A to conduct better and have enough heat throughout the sheet.

Heavy Metal Cladding Selections for Taconic TLY-5A
You may use one of the following heavy metal cladding alternatives in your Taconic TLY-5A laminate:
- Brass Material – It has a specification of 8.5 as its specific gravity, 120 W/mk for its thermal conductivity, and 20 ppm as its thermal expansion value.
- Copper Material – It has a specification of 8.9 as its specific gravity, 390 W/mk for its thermal conductivity, and 17 ppm as its thermal expansion value.
- Aluminum Material – It has a specification of 2.7 as its specific gravity, 180 W/mk for its thermal conductivity, and 24 ppm as its thermal expansion value.
Shoot us an email if you would like additional information.
Advantages of PCBTok’s Taconic TLY-5A
Benefits of PCBTok’s Taconic TLY-5A include the following:
- It has exceptional dimensional stability.
- It has a low dissipation factor (Df) value.
- In terms of moisture absorption, it is low.
- It has a consistent dielectric constant (Dk) value.
- Its copper peel strength is highly exceptional.
- This laminate has exceptional properties both thermally and mechanically.
If you want to know more about the capabilities of PCBTok’s Taconic TLY-5A, you can direct message us. We are available 24/7 to address all of your inquiries and concerns.

Manufacturing Highly Superior Taconic TLY-5A is PCBTok's Expertise


Despite the achievements we have acquired over twelve years in delivering top-notch Taconic TLY-5A, we are still aiming to improve it much better than we usually do. We are doing this to produce only superior products in the market.
Due to this, many customers worldwide have chosen to work with us as their primary supplier for high-quality Taconic TLY-5A laminates.
We recommend you try out PCBTok’s Taconic TLY-5A. We are one of the leading manufacturers of quality Taconic TLY-5A laminates across the globe.
PCBTok has fully complied with the requirements set by the international standards. In addition, we have acquired all of the necessary accreditations to guarantee high-class Taconic TLY-5A products with exceptional performance.
Taconic TLY-5A Fabrication
Applying a solder mask in your Taconic TLY-5A laminate is relatively more straightforward than you think; it only has two phases.
Firstly, the Taconic TLY-5A will undergo what we termed as the PCB Etching process. After it passes through this, it will be subjected to the inspection process.
The inspection process will determine the quality of the laminate; this will measure and evaluate if there’s a need to redo the etching process or if it may now proceed.
After the inspection is verified, we now apply the solder mask. However, the metallic etch must be removed, and it should have enough space for the application.
Consider writing us if you would like a more thorough explanation of this procedure.
We are conducting several tests to ensure that all of the properties that a Taconic TLY-5A possesses will be efficient and error-free.
Testing the product is one of the most crucial phases in manufacturing any PCB items. Now, we’d like to share with our consumers the test we perform for Taconic TLY-5A.
We deploy IPC-650 2.5.5.5 to check its dielectric constant, IPC-650 2.6.2.1 for moisture absorption, and finally, we have the IPC-650 2.5.6 for dielectric breakdown.
Then, ASTM D149 for dielectric strength, IPC-650 2.5.17.1 for surface resistivity, IPC-650 2.4.4 for flexural strength, and UL – 94 to evaluate its flammability rating.
For more in-depth information about these tests, kindly direct message us.
OEM & ODM Taconic TLY-5A Applications
One of the advantages of deploying a Taconic TLY-5A is its exceptional dimensional stability; hence, it has been preferred in most automotive radars.
Since Taconic TLY-5A possess various benefits, including high copper peel strength and stability, they are widely deployed in most power amplifiers.
Most aerospace devices require laminate and a circuit board that has low moisture absorption and is reliable; a Taconic TLY-5A is capable of providing that.
Since Taconic TLY-5A is recognized for its low moisture absorption and low dissipation factor, they have been widely preferred by satellite system devices.
Another advantage of a Taconic TLY-5A is its excellent dimensional stability and capability to process high-speed signals; they are preferred in cellular communications.
Taconic TLY-5A Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
NO | Item | Technical Specification | ||||||
Standard | Advanced | |||||||
1 | Layer Count | 1-20 layers | 22-40 layer | |||||
2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
Max laser drilling size | 6mil | 6mil | ||||||
Max aspect ratio for Hole plate | 10:1(hole diameter>8mil) | 20:1 | ||||||
Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(>14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L) | ||||||
Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | ||||||
Min space between laser holes and conductor | 6mil | 5mil | ||||||
Min space between hole walls in different net | 10mil | 10mil | ||||||
Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
Hole location tolerance | ±2mil | ±2mil | ||||||
NPTH tolerance | ±2mil | ±2mil | ||||||
Pressfit holes tolerance | ±2mil | ±2mil | ||||||
Countersink depth tolerance | ±6mil | ±6mil | ||||||
Countersink hole size tolerance | ±6mil | ±6mil | ||||||
11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
12 | Width/Space | Internal Layer | 1/2OZ:3/3mil | 1/2OZ:3/3mil | ||||
1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
External Layer | 1/3OZ:3.5/4mil | 1/3OZ:3/3mil | ||||||
1/2OZ:3.9/4.5mil | 1/2OZ:3.5/3.5mil | |||||||
1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
1.43OZ(positive):4.5/7 | 1.43OZ(positive):4.5/6 | |||||||
1.43OZ(negative ):5/8 | 1.43OZ(negative ):5/7 | |||||||
2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
Warp and Twist | 0.75% | 0.50% | ||||||
14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
Silkscreen color | White, Black,Blue,Yellow | |||||||
Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
Leaded | Leaded HASL | |||||||
Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
Max finished size | HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″; | |||||||
Min finished size | HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″; | |||||||
PCB thickness | HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm | |||||||
Max high to gold finger | 1.5inch | |||||||
Min space between gold fingers | 6mil | |||||||
Min block space to gold fingers | 7.5mil | |||||||
16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
17 | Slot | Slot size tol.L≥2W | PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) | PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil) | ||||
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) | NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil) | |||||||
18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
24 | Conductivity | <50Ω(typical:25Ω) | ||||||
25 | Test voltage | 250V | ||||||
26 | Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
Taconic Tly-5A – The Ultimate FAQ Guide
If you are considering Taconic tly-5A for your next PCB design project, you may be curious about this high-frequency PCB material. This thick material can be soldered using a solder resist process. Therefore, it is suitable for high-frequency PCB designs. Read on to learn more about the material’s properties.
Taconic tly-5A is made from a thin layer of copper, which is important for high-power applications. The copper foil is used to conduct heat away from the circuit. The type of copper foil used is determined by the power requirements. In high-power applications, a thicker copper foil is used. In low-power applications, a thinner copper foil is used. The thickness of Taconic laminates depends on the number of circuits that must be interconnected.
Taconic tly-5A is the most dimensionally stable Taconic laminate, with the lowest loss factor. Its PTFE film is reinforced with glass fibers. This material is used in power amplifiers, automotive radar, and a variety of other applications. It has a low dielectric constant, making it ideal for hybrid structures. It is an excellent choice for these types of applications due to its low water absorption and low moisture absorption.
Taconic tly-5A PCB is an excellent choice for high-speed digital and RF applications. The material is extremely conductive and has a low signal loss. Another advantage of Taconic PCBs is their low loss factor. As a result, it is an excellent insulator for a wide range of applications. Taconic PCBs are ideal for RF and microwave applications because of their excellent dielectric constant range and low loss factor.