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Skillfully Crafted TC350 by PCBTok
We have adequate knowledge in producing your TC350 that you can rely on even in the heaviest applications; PCBTok is capable of delivering long-lasting products.
- We keep an eye on the local business hours and deliver quotes promptly.
- A variety of payment methods are available.
- Before making significant purchases, product samples are provided.
- Total client satisfaction is maintained.
- We offer constant access to knowledgeable, expert assistance.
Outstanding and Notable TC350 from PCBTok
Every business nowadays requires high-quality products to withstand demanding applications; hence, we always ensure that our TC350 is of premium quality.
It is regarded that a TC350 PCB offers a unique combination of low insertion loss and high thermal conductivity, making it highly reliable in operations.
We at PCBTok guarantee that its capabilities are intact throughout the manufacturing process; we thoroughly test it for better performance of the laminate.
Our primary goal is to deliver you an outstanding performance of TC350.
You may rely on us to fulfill any TC350 laminate needs, and we’ll do it without sacrificing the product’s performance or quality.
TC350 By Feature
The High Power TC350 PCB is the most widely used type of board in this laminate because it possesses enhanced endurance to thermal strains and improved current carrying capacity. However, it can be expensive to fabricate compared with other board types.
The Microwave TC350 PCB has been widely preferred by consumers to be deployed in high-temperature environments because of its stability despite the condition setting. In addition, this can operate at up to 40 GHz of frequency.
The PTFE TC350 PCB offers good insulation; hence, they are preferred in industrial, commercial, and aerospace applications. In addition, they can survive in both extreme and heat scenarios; thus, they are highly durable and reliable.
The Ceramic TC350 PCB is widely deployed in applications requiring high-frequency and exceptional heat resistance. In addition, it has excellent thermal conductivity and is recognized as resistant to chemical substances.
The RF TC350 PCB has quite similarities with the microwave one. However, the microwave board belongs to the category that can surpass 2 GHz RF boards. But, it is ideal for applications that deal with networking signals.
The Multilayer TC350 PCB is one of the most popular types of laminated board in the industry because of its wide array of benefits, including its exceptional capacity and speed in a compact design board and its inexpensive cost.
TC350 By Thickness (6)
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The 10 mil TC350 is already considered a standard thickness for this laminate; it can already operate almost the same as other thicknesses. In addition, we offer specific customization for this type of thickness.
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The 20 mil TC350 can withstand almost medium-weight components. However, the thicknesses of the laminates are just a measurement of what is suitable for your applications; it doesn’t affect its performance.
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The 30 mil TC350 can tolerate almost heavy types of components integrated into it; it’s just a little upgrade for the 20 mil one. Nevertheless, the thickness will always depend on its suitability for your applications.
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The 60 mil TC350 is the highest option available we offer as a thickness for this particular laminate. In addition, it can already withstand heavy components attached to it without compromising its performance.
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The ½ oz TC350 thickness is the smallest size we can offer for your laminate in terms of an ounce. Similar to other thicknesses, the size doesn’t affect the overall performance of the laminate; instead, it dictates the suitability.
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The 1 oz TC350 is the second least size thickness we can offer for your application in terms of an ounce. Also, we can customize this type of thickness according to your needs, specifications, and application.
TC350 By Dielectric (5)
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The Rogers TC350 PCB is the most common dielectric for this laminate. It offers superior reliability even when subjected to extreme temperature conditions. It has a higher thermal conductivity, ideal for high-power usage.
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The FR4 TC350 PCB is one of the most popular laminates in the market because it offers a wide array of benefits, including its relatively inexpensive cost, High TG value that is around 170°C to 180°C, and is halogen-free.
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The Rogers + FR4 has the combined benefits of the mentioned dielectrics. We recommend this dielectric type since it can offer much more than the individual ones. It is highly preferred in most high-power applications too.
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The Isola TC350 PCB offers superior thermal resistance to chemicals, a low coefficient of thermal expansion, and excellent insulation for electrical properties subjected to high temperature and even humidity conditions.
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The Arlon TC350 PCB is among the most famous dielectric for this laminate. It provides exceptional heat dissipation and management, outstanding component attachment reliability, and minimal sensitivity to vibrations.
TC350 Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Features of PCBTok’s TC350
The PCBTok TC350 comes with the following features:
- Dielectric Constant (Dk) – It has a value of 3.5.
- Thermal Conductivity is regarded as high, with a value of 0.72 W/mk.
- Thermal Coefficient of Dielectric Constant (Dk) – It is considered low and has a typical value of -9 ppm/°C, -40°C to 140°C.
- Low Loss Tangent – A typical value of .002 at 10 GHz.
- Low Coefficient of Thermal Expansion (X, Y, and Z Axis) – The vale goes 7, 7, and 23 ppm/°C, respectively.
Send us an email if you have any queries regarding these features.
Shelf Life of PCBTok’s TC350
One of the factors to consider before purchasing any laminates is their shelf life. In this section, we will talk about the life span of PCBTok’s TC350 laminate.
Generally, a TC350 laminate doesn’t have specific years for its shelf life. However, it can last longer if properly cared for and stored in a dry, cool, clean environment.
Due to their potential for oxidizing, we highly advise against storing these laminates for a prolonged period. However, if it is unavoidable, check the copper content to see if there’s any oxidation before using.
Moreover, if minimal oxidation has already occurred, we can provide you with the standard cleaning procedure. You can message us directly for more details about this.
Pros of PCBTok’s TC350
Choose PCBTok’s TC350 to enjoy the following advantages:
- It offers lower connection temperature and more dependability.
- It has extreme effectiveness at managing and eliminating heat.
- PCBTok’s TC350 provides more efficiency and better bandwidth for antennas and amplifiers.
- It is known to provide superior plated through-hole dependability compared to other laminates.
Send us a mail if you have any questions about the capabilities of this laminate. Any TC350-related queries you may have will be promptly addressed by us.
Producing First-Class and Remarkable TC350 is PCBTok's Forte
As a responsible producer and manufacturer of TC350 laminate, we strictly abide by the environmental safety laws and international standards to provide a high-quality product that can function to its full potential.
Additionally, we’ve been in this business for more than twelve (12) years, making us one of the world’s top sources of TC350.
PCBTok offers a wide array of great deals and selections for our TC350. We are doing this to ensure that we can satisfy all of your specifications and application requirements. We have a team of skilled personnel to work that out for you.
We will continually give you a thorough 8D report if your TC350 is facing any further problems to relieve your concerns about our services and products. Contact us immediately to learn more about how we can meet your needs.
TC350 Fabrication
In PCBTok, we value our consumers the most; we want to provide them with transparency. Hence, we want to share the components we use for TC350.
We only deploy about six (6) essential components to your laminate. In addition, all of these components are indeed made of high-quality materials.
It has the following components: copper foils, PTFE composite, ceramic filers, fiberglass fabrics, silicone chips, and aluminum sheets. All of these are crucial in determining the quality of the product.
These are made from top-notch raw materials to guarantee a premium TC350 output that can tolerate any operations and is suitable for various environmental conditions.
You can contact us if you’d like additional information on this.
As we value transparency in PCBTok, we want you to have an idea of how we specifically create your TC350 laminate by providing you with the process of it.
The creation process of a TC350 laminate is relatively easy; it just goes through twelve (12) phases. Each of those stages is crucial in determining the final quality.
It goes through proper storage, bonding, drilling, deburring, preparation of through-hole, surface preparation, copper plating, etching, and finally, resist strip.
Then, it will be subjected to solder masking phase, hot air leveling, electroless gold, and routing. All of these are performed in the making of your TC350.
If you have any questions about how the material was made, kindly mail us.
OEM & ODM TC350 Applications
One of the advantages of deploying a TC350 is its improved thermal operations, making it ideal for any environmental functions such as communications.
Due to TC350s capability to offer stability and tolerate extreme temperature conditions, they are highly deployed by most industrial application equipment.
Most military defense devices and equipment require exceptional bandwidth utilization in their antennas; hence, they use TC350, that’s good in this area.
Since TC350 is recognized for its exceptional heat dissipation and outstanding dependability during operations, they are commonly deployed in aerospace devices.
Another advantage of a TC350 is its enhanced bandwidth utilization and improved amplifier efficiency; thus, they are widely deployed in this field.
TC350 Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
TC350 PCB – The Ultimate FAQ Guide
The TC350 PCB is a great substrate for your next design project. Its high power density, high quality, and low cost make it a popular choice for many companies. However, there are several issues to consider before making a purchase. The Ultimate FAQ Guide will help you understand the process and make the best decision. It will answer any questions you may have and get you started right away.
The TC350 PCB is an excellent choice for power amplifiers. Its high thermal conductivity and low tangential and insertion losses make it ideal for this application. It also has low moisture absorption and is available in a variety of thicknesses. The material can also be custom copper clad or rolled copper foil. TC350 PCBs are suitable for high-power electronics and can meet a wide range of size and thermal requirements.
TC350 Plus laminates are well suited for RF and microwave applications. They are also available in a variety of thicknesses from 0.1 to 0.06 inches. They can also be used in aerospace and defense applications. However, they also have drawbacks and are more expensive than the TC350. So before you order TC350 PCBs, be sure to read the ultimate FAQ guide!
TC350 Plus PCB: A PTFE-based composite, TC350 Plus offers high thermal conductivity and excellent drilling performance. It also has low tangency and insertion loss, making it ideal for high-power RF designs. TC350 Plus laminates are also inexpensive to produce, making them ideal for use in power amplifiers and other components that require temperature phase stability.