Introducing Burn-Resistant TG150 from PCBTok

TG150 is a heat-resistant glass transition temperature of 150 ℃ (according to DSC), with low Z-axis expansion. It has excellent heat resistance and is appropriate for lead-free assembly, meeting IPC-4101B/124 specifications.

PCBTok is one of the most reliable TG150 manufacturers in China. In addition to providing customers with low prices, we also offer fast delivery services to ensure that your orders will be delivered as quickly as possible.

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PCBTok’s Premium Grade TG150

PCBTok’s TG150 has a high thermal delamination, making it the perfect choice for lead-free assembly. It also has excellent heat resistance, making it ideal for high temperature environments.

This board has a low Z-axis expansion, which makes it suitable for use in a wide variety of applications. Its IPC-4101B/124 specification is applicable as well as its dicy and no filler properties.

The PCBTok’s TG150 is an excellent choice for any application where a high temperature resistance is required.

PCBTok have been manufacturing PCBs for more than 12 years and have been working with TG150. We know how important it is for you to get your TG150 from a reliable supplier, so we’re here to help.

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TG150 By Materials

S1000H

Specially designed for the S1000H, lead-free compatible FR4.0 has excellent thermal reliability and low Z-axis CTE, which can make the device work with high performance and reliability.

KB-6165F

The TG150 with KB-6165F material is suitable for lead free electronic assembly processes where high reliability and repeatable performance are required, capable of withstanding lead free reflow cycles.

VT-441

The VT-441 with TG150 is a halogen-free, mid­Tg FR4. The VT-441 consists of phenolic cured systems which are highly reliable and thermally stable due to their high dielectric constant and volume resistivity.

Isola IS400

IS400 is a proprietary, temperature resistant resin system with a TG150. The formulation provides high epoxy resin content and excellent tie-strength. For applications that require high temperature or flexibility.

Rogers PCB

High-frequency boards of the Rogers TG150 PCB kind are made from raw materials manufactured with epoxy resin combined with TG150 makes it distinct from regular PCB boards.

Taconic PCB

Ceramic-filled Polytetrafluoroethylene and woven glass reinforced materials with TG150. Advantages of high temperature resistance, high mechanical strength and impact resistance.

TG150 Complete Introduction

TG150 PCBs are constructed from a unique kind of material that enables them to withstand hot conditions. The term “TG” frequently connotes the glass transition temperature, which describes the gradual reversible transformation of amorphous material under the application of greater than anticipated temperatures from a strong and “glassy” condition to a rubbery and viscous one.

While the TG frequently turns out to be lower than the melting point of the associated crystalline material state. A common kind of the glass transitional temperature material is a burn-resistant material that melts or distorts at a certain range of temperatures. A TG150 PCB is classified as medium TG material.

TG150 Complete Introduction
What is TG

What is TG?

The glass transition temperature (Tg) is the temperature at which a substance changes from a stiff solid that resembles glass to a more malleable, rubbery composite. On a piece of fancy equipment called a Differential Scanning Calorimeter (DSC), Tg is often measured.

When checking for Tg, you should heat up your sample and see how it responds at various temperatures. If it is a liquid below the Tg, heating it will cause it to start to thicken and finally solidify. If you cool anything down, the same phenomenon happens in reverse: the liquid changes back into a solid at its Tg and then returns to liquid form when it is still cooler.

Ordering Criteria for a TG150

To place an order for a TG150, you’ll need to convert your PCB design and schematics into the appropriate Gerber file format. Then, go to the official company website and send the Gerber file through the stipulated channel. This process is simple and straightforward, but if you have any questions about it, there’s always someone on hand to answer them!

Once you’ve sent in your data, you’ll receive help with immediate email replies, timely quotations and get the PCB products delivered to you in a decent time. You will never get unseemly issues with PCBTok; if any arise, simply lodge an inquiry and get it sorted out right away!

Ordering Criteria for a TG150

Top-Grade TG150 from PCBTok

Top-Grade TG150 from PCBTok
Top-Grade TG150 from PCBTok (1)

PCBTok is a global leader in the industry of PCB manufacturing. We are dedicated to providing our customers with high-quality products and services at competitive prices.

Our company has been operating since 2010, and we have successfully completed thousands of orders for clients around the world. Our core competency lies in our ability to provide quick turnaround times and reliable customer service.

The TG150 is a top-grade product. Your TG150 can be made by our company PCBTok. Our company has been producing high-quality products since 2010, and we have a very good reputation in the market. We are a reliable partner for our customers who place their trust in us.

TG150 Fabrication

TG150 and TG170 Which is Better

In comparing TG170 and TG150, we have to base our analysis on Tg, or the Glass Transition Temperature of each laminate. This is the temperature at which the laminate material loses its properties changing from a glassy state to a rubbery state.

As a general rule, the higher the Tg, the more stable the material is during the PCB manufacturing process and assembly. As well, the higher the Tg, the more expensive it will be. In conclusion, TG170 is better than TG150 since it has higher Tg values that make it more stable than TG150. TG170 is inevitably more expensive than TG150.

TG150's Anti-CAF Capability

The TG150’s anti-CAF feature prevents corrosion by maintaining an alkaline environment at all times within the PCB assembly, preventing the formation of conductive salts that could cause CAF failures.

CAF failures can occur when moisture enters the PCB assembly, causing corrosion of the electrical connections which leads to short circuits.

The TG150 is designed with a patented corrosion prevention process that delivers superior performance in moisture-sensitive environments over other products on the market today.

OEM & ODM TG150 Applications

Computers

Computer printed circuit board with tg150 is one of the best products from our manufacturing. It is very popular and high quality in the market.

Laptops

TG150 printed circuit boards for laptops are produced with state-of-the-art laser cutting and drilling machines, making them incredibly reliable.

ENIG PCB for Automotive Electronics

TG150 for automotive electronics is the most preferred material for making robust PCB for requirements of complex designs.

Consumer Electronics

The TG150 is made for the most demanding embedded applications. It is ideal for all kinds of domestic electronics, factory automation, etc.

Air Conditioners

Used in Air Conditioners to improve efficiency and reduce operation costs. Made from laminated plates of carbon, resin and fiberglass.

Medium TG Material TG150 from PCBTok
Medium TG Material TG150 from PCBTok

PCBTok’s Medium TG Material TG150 is our standard grade with a high accuracy level, which maintains excellent electrical and thermal conductivity. Call us now to avail!

TG150 Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
A/W
1mil Deviation of Master
A/W
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.

DHL

2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.

UPS

3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.

TNT

4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.

FedEx

5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

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    Gilles Garnier, Electronics Technician from Nebraska, U.S.A
  • “Both the quality of PCBTok’s items and their customer service are excellent. I considered a lot of businesses before choosing PCB Tok. Their ability to deliver on their promises and the caliber of their work most impressed me. Their services are outstanding, and their products are amazing. They have an extremely kind staff, and they quickly addressed my problems and gave me their opinions. I am happy with the advice they gave me since it helped my project be improved to a higher level.”

    Richard Francis Cottingham, Project Engineer from New York City, U.S.A
  • “I’m quite happy with the finished result that PCBTok gave us. I’ve previously collaborated with other PCB manufacturers, but our efforts did not provide the desired outcomes. I was forced to search for another business as a result. Our products are now more better and more effective thanks to your services. Because it was able to live up to their expectations, our engineers are pleased with their job as well. We are happy to have found PCBTok; I will never look at other businesses again.”

    Kenneth Erskine, Procurement Manager from Hammersmith, London, England
Low Z-CTE TG150

Low Z-CTE simply means that resin is restricted from moving in the x-y axis by the lower expansion rate of the glass laminate, therefore it must expand in the z. TG150 printed circuit boards has low z-CTE.

This is especially important for multilayer circuit boards because their layers are stacked on top of each other. When the board is heated, it expands evenly across all layers. If there were no restrictions, each layer would expand at a different rate, causing deformation and stress fractures.

In order to avoid this problem, it’s important to use materials like TG150 with low Z-CTE values when designing multilayer circuit boards.

Excellent Thermal Reliability of TG150

The TG150 is a high-performance, thermal grease that can withstand extreme temperatures. With a melting point of 150°C, it can be used for applications with high temperature fluctuations and high heat dissipation requirements.

The TG150 from PCBTok is a reliable product for heat-sensitive applications. It has excellent thermal conductivity, which means it will transfer heat quickly and efficiently without excessive temperature drop.

The TG150 can be used in high temperature environments and can withstand temperatures up to 150°C. It’s also highly resistant to corrosion, which makes it perfect for use in marine environments or other places where there are harsh chemicals present.

Low Halogen Filled TG150

The Low Halogen Filled TG150 material is a low-cost, high-reliability alternative to traditional FR4 dielectric. It is ideal for use in high-temperature applications, such as those involving thermal management or power delivery. Its resistance to corrosion and oxidation makes it an excellent choice for aerospace and automotive applications as well.

TG150 is a low-halogen filled epoxy resin with good flame retardant properties. It can be used as an alternative to FR-4 if you are looking for a lower cost option with similar properties. This material is also non-toxic and resistant to chemicals, making it suitable for use applications where there may be contact with liquids or gases that may cause corrosion or damage to metal parts.

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