Introducing Burn-Resistant TG150 from PCBTok
TG150 is a heat-resistant glass transition temperature of 150 ℃ (according to DSC), with low Z-axis expansion. It has excellent heat resistance and is appropriate for lead-free assembly, meeting IPC-4101B/124 specifications.
PCBTok is one of the most reliable TG150 manufacturers in China. In addition to providing customers with low prices, we also offer fast delivery services to ensure that your orders will be delivered as quickly as possible.
PCBTok’s Premium Grade TG150
PCBTok’s TG150 has a high thermal delamination, making it the perfect choice for lead-free assembly. It also has excellent heat resistance, making it ideal for high temperature environments.
This board has a low Z-axis expansion, which makes it suitable for use in a wide variety of applications. Its IPC-4101B/124 specification is applicable as well as its dicy and no filler properties.
The PCBTok’s TG150 is an excellent choice for any application where a high temperature resistance is required.
PCBTok have been manufacturing PCBs for more than 12 years and have been working with TG150. We know how important it is for you to get your TG150 from a reliable supplier, so we’re here to help.
TG150 By Materials
TG150 Complete Introduction
TG150 PCBs are constructed from a unique kind of material that enables them to withstand hot conditions. The term “TG” frequently connotes the glass transition temperature, which describes the gradual reversible transformation of amorphous material under the application of greater than anticipated temperatures from a strong and “glassy” condition to a rubbery and viscous one.
While the TG frequently turns out to be lower than the melting point of the associated crystalline material state. A common kind of the glass transitional temperature material is a burn-resistant material that melts or distorts at a certain range of temperatures. A TG150 PCB is classified as medium TG material.
What is TG?
The glass transition temperature (Tg) is the temperature at which a substance changes from a stiff solid that resembles glass to a more malleable, rubbery composite. On a piece of fancy equipment called a Differential Scanning Calorimeter (DSC), Tg is often measured.
When checking for Tg, you should heat up your sample and see how it responds at various temperatures. If it is a liquid below the Tg, heating it will cause it to start to thicken and finally solidify. If you cool anything down, the same phenomenon happens in reverse: the liquid changes back into a solid at its Tg and then returns to liquid form when it is still cooler.
Ordering Criteria for a TG150
To place an order for a TG150, you’ll need to convert your PCB design and schematics into the appropriate Gerber file format. Then, go to the official company website and send the Gerber file through the stipulated channel. This process is simple and straightforward, but if you have any questions about it, there’s always someone on hand to answer them!
Once you’ve sent in your data, you’ll receive help with immediate email replies, timely quotations and get the PCB products delivered to you in a decent time. You will never get unseemly issues with PCBTok; if any arise, simply lodge an inquiry and get it sorted out right away!
Top-Grade TG150 from PCBTok
PCBTok is a global leader in the industry of PCB manufacturing. We are dedicated to providing our customers with high-quality products and services at competitive prices.
Our company has been operating since 2010, and we have successfully completed thousands of orders for clients around the world. Our core competency lies in our ability to provide quick turnaround times and reliable customer service.
The TG150 is a top-grade product. Your TG150 can be made by our company PCBTok. Our company has been producing high-quality products since 2010, and we have a very good reputation in the market. We are a reliable partner for our customers who place their trust in us.
In comparing TG170 and TG150, we have to base our analysis on Tg, or the Glass Transition Temperature of each laminate. This is the temperature at which the laminate material loses its properties changing from a glassy state to a rubbery state.
As a general rule, the higher the Tg, the more stable the material is during the PCB manufacturing process and assembly. As well, the higher the Tg, the more expensive it will be. In conclusion, TG170 is better than TG150 since it has higher Tg values that make it more stable than TG150. TG170 is inevitably more expensive than TG150.
The TG150’s anti-CAF feature prevents corrosion by maintaining an alkaline environment at all times within the PCB assembly, preventing the formation of conductive salts that could cause CAF failures.
CAF failures can occur when moisture enters the PCB assembly, causing corrosion of the electrical connections which leads to short circuits.
The TG150 is designed with a patented corrosion prevention process that delivers superior performance in moisture-sensitive environments over other products on the market today.
OEM & ODM TG150 Applications
TG150 Production Details As Following Up
|1||Layer Count||1-20 layers||22-40 layer|
|2||Base Material||KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)|
|3||PCB Type||Rigid PCB/FPC/Flex-Rigid||Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.|
|4||Lamination type||Blind&buried via type||Mechanical blind&burried vias with less than 3 times laminating||Mechanical blind&burried vias with less than 2 times laminating|
|HDI PCB||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating|
|5||Finished Board Thickness||0.2-3.2mm||3.4-7mm|
|6||Minimum Core Thickness||0.15mm(6mil)||0.1mm(4mil)|
|7||Copper Thickness||Min. 1/2 OZ, Max. 4 OZ||Min. 1/3 OZ, Max. 10 OZ|
|9||Maximum Board Size||500*600mm(19”*23”)||1100*500mm(43”*19”)|
|10||Hole||Min laser drilling size||4mil||4mil|
|Max laser drilling size||6mil||6mil|
|Max aspect ratio for Hole plate||10:1（hole diameter＞8mil）||20:1|
|Max aspect ratio for laser via filling plating||0.9:1(Depth included copper thickness)||1:1(Depth included copper thickness)|
|Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
|0.8:1(drilling tool size≥10mil)||1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)|
|Min. depth of Mechanical depth-control(back drill)||8mil||8mil|
|Min gap between hole wall and
conductor (None blind and buried via PCB)
|Min gap between hole wall conductor (Blind and buried via PCB)||8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)||7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)|
|Min gab between hole wall conductor(Laser blind hole buried via PCB)||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）|
|Min space between laser holes and conductor||6mil||5mil|
|Min space between hole walls in different net||10mil||10mil|
|Min space between hole walls in the same net||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)|
|Min space bwteen NPTH hole walls||8mil||8mil|
|Hole location tolerance||±2mil||±2mil|
|Pressfit holes tolerance||±2mil||±2mil|
|Countersink depth tolerance||±6mil||±6mil|
|Countersink hole size tolerance||±6mil||±6mil|
|11||Pad(ring)||Min Pad size for laser drillings||10mil(for 4mil laser via),11mil(for 5mil laser via)||10mil(for 4mil laser via),11mil(for 5mil laser via)|
|Min Pad size for mechanical drillings||16mil(8mil drillings)||16mil(8mil drillings)|
|Min BGA pad size||HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold)||HASL:10mil, LF HASL:12mil, other surface technics are 7mi|
|Pad size tolerance(BGA)||±1.5mil(pad size≤10mil);±15%(pad size>10mil)||±1.2mil(pad size≤12mil);±10%(pad size≥12mil)|
|1OZ: 3/4mil||1OZ: 3/4mil|
|2OZ: 4/5.5mil||2OZ: 4/5mil|
|3OZ: 5/8mil||3OZ: 5/8mil|
|4OZ: 6/11mil||4OZ: 6/11mil|
|5OZ: 7/14mil||5OZ: 7/13.5mil|
|6OZ: 8/16mil||6OZ: 8/15mil|
|7OZ: 9/19mil||7OZ: 9/18mil|
|8OZ: 10/22mil||8OZ: 10/21mil|
|9OZ: 11/25mil||9OZ: 11/24mil|
|10OZ: 12/28mil||10OZ: 12/27mil|
|1OZ: 4.8/5mil||1OZ: 4.5/5mil|
|1.43OZ（negative ）:5/8||1.43OZ（negative ）:5/7|
|2OZ: 6/8mil||2OZ: 6/7mil|
|3OZ: 6/12mil||3OZ: 6/10mil|
|4OZ: 7.5/15mil||4OZ: 7.5/13mil|
|5OZ: 9/18mil||5OZ: 9/16mil|
|6OZ: 10/21mil||6OZ: 10/19mil|
|7OZ: 11/25mil||7OZ: 11/22mil|
|8OZ: 12/29mil||8OZ: 12/26mil|
|9OZ: 13/33mil||9OZ: 13/30mil|
|10OZ: 14/38mil||10OZ: 14/35mil|
|13||Dimension Tolerance||Hole Position||0.08 ( 3 mils)|
|Conductor Width(W)||20% Deviation of Master
|1mil Deviation of Master
|Outline Dimension||0.15 mm ( 6 mils)||0.10 mm ( 4 mils)|
|Conductors & Outline
( C – O )
|0.15 mm ( 6 mils)||0.13 mm ( 5 mils)|
|Warp and Twist||0.75%||0.50%|
|14||Solder Mask||Max drilling tool size for via filled with Soldermask (single side)||35.4mil||35.4mil|
|Soldermask color||Green, Black, Blue, Red, White, Yellow,Purple matte/glossy|
|Silkscreen color||White, Black,Blue,Yellow|
|Max hole size for via filled with Blue glue aluminium||197mil||197mil|
|Finish hole size for via filled with resin||4-25.4mil||4-25.4mil|
|Max aspect ratio for via filled with resin board||8:1||12:1|
|Min width of soldermask bridge||Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)|
|Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
|Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)|
|Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)|
|Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)|
|15||Surface Treatment||Lead free||Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge|
|Aspect ratio||10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)|
|Max finished size||HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″；|
|Min finished size||HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″；|
|PCB thickness||HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm|
|Max high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mil|
|16||V-Cutting||Panel Size||500mm X 622 mm ( max. )||500mm X 800 mm ( max. )|
|Board Thickness||0.50 mm (20mil) min.||0.30 mm (12mil) min.|
|Remain Thickness||1/3 board thickness||0.40 +/-0.10mm( 16+/-4 mil )|
|Tolerance||±0.13 mm(5mil)||±0.1 mm(4mil)|
|Groove Width||0.50 mm (20mil) max.||0.38 mm (15mil) max.|
|Groove to Groove||20 mm (787mil) min.||10 mm (394mil) min.|
|Groove to Trace||0.45 mm(18mil) min.||0.38 mm(15mil) min.|
|17||Slot||Slot size tol.L≥2W||PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil)||PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil)|
|NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil)||NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil)|
|18||Min Spacing from hole edge to hole edge||0.30-1.60 (Hole Diameter)||0.15mm(6mil)||0.10mm(4mil)|
|1.61-6.50 (Hole Diameter)||0.15mm(6mil)||0.13mm(5mil)|
|19||Min spacing between hole edge to circuitry pattern||PTH hole: 0.20mm(8mil)||PTH hole: 0.13mm(5mil)|
|NPTH hole: 0.18mm(7mil)||NPTH hole: 0.10mm(4mil)|
|20||Image transfer Registration tol||Circuit pattern vs.index hole||0.10(4mil)||0.08(3mil)|
|Circuit pattern vs.2nd drill hole||0.15(6mil)||0.10(4mil)|
|21||Registration tolerance of front/back image||0.075mm(3mil)||0.05mm(2mil)|
|22||Multilayers||Layer-layer misregistration||4layers:||0.15mm(6mil)max.||4layers:||0.10mm(4mil) max.|
|Min. Spacing from Hole Edge to Innerlayer Pattern||0.225mm(9mil)||0.15mm(6mil)|
|Min.Spacing from Outline to Innerlayer Pattern||0.38mm(15mil)||0.225mm(9mil)|
|Min. board thickness||4layers:0.30mm(12mil)||4layers:0.20mm(8mil)|
|Board thickness tolerance||4layers:+/-0.13mm(5mil)||4layers:+/-0.10mm(4mil)|
|8-12 layers:+/-0.20mm (8mil)||8-12 layers:+/-0.15mm (6mil)|
|26||Impedance control||±5ohm(＜50ohm), ±10%(≥50ohm)|
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
“It’s a delight to work with PCBTok. I found their website’s fascinating layout and professional-looking design to be incredibly useful during the purchasing process. After I paid for it, they swiftly shipped my order out, and the PCB component I needed arrived in excellent shape. I had a professional, simple, and enjoyable experience with PCBTok throughout, and I would absolutely use them again in the future. I appreciate it, PCBTok.”Gilles Garnier, Electronics Technician from Nebraska, U.S.A
“Both the quality of PCBTok’s items and their customer service are excellent. I considered a lot of businesses before choosing PCB Tok. Their ability to deliver on their promises and the caliber of their work most impressed me. Their services are outstanding, and their products are amazing. They have an extremely kind staff, and they quickly addressed my problems and gave me their opinions. I am happy with the advice they gave me since it helped my project be improved to a higher level.”Richard Francis Cottingham, Project Engineer from New York City, U.S.A
“I’m quite happy with the finished result that PCBTok gave us. I’ve previously collaborated with other PCB manufacturers, but our efforts did not provide the desired outcomes. I was forced to search for another business as a result. Our products are now more better and more effective thanks to your services. Because it was able to live up to their expectations, our engineers are pleased with their job as well. We are happy to have found PCBTok; I will never look at other businesses again.”Kenneth Erskine, Procurement Manager from Hammersmith, London, England
Low Z-CTE simply means that resin is restricted from moving in the x-y axis by the lower expansion rate of the glass laminate, therefore it must expand in the z. TG150 printed circuit boards has low z-CTE.
This is especially important for multilayer circuit boards because their layers are stacked on top of each other. When the board is heated, it expands evenly across all layers. If there were no restrictions, each layer would expand at a different rate, causing deformation and stress fractures.
In order to avoid this problem, it’s important to use materials like TG150 with low Z-CTE values when designing multilayer circuit boards.
The TG150 is a high-performance, thermal grease that can withstand extreme temperatures. With a melting point of 150°C, it can be used for applications with high temperature fluctuations and high heat dissipation requirements.
The TG150 from PCBTok is a reliable product for heat-sensitive applications. It has excellent thermal conductivity, which means it will transfer heat quickly and efficiently without excessive temperature drop.
The TG150 can be used in high temperature environments and can withstand temperatures up to 150°C. It’s also highly resistant to corrosion, which makes it perfect for use in marine environments or other places where there are harsh chemicals present.
The Low Halogen Filled TG150 material is a low-cost, high-reliability alternative to traditional FR4 dielectric. It is ideal for use in high-temperature applications, such as those involving thermal management or power delivery. Its resistance to corrosion and oxidation makes it an excellent choice for aerospace and automotive applications as well.
TG150 is a low-halogen filled epoxy resin with good flame retardant properties. It can be used as an alternative to FR-4 if you are looking for a lower cost option with similar properties. This material is also non-toxic and resistant to chemicals, making it suitable for use applications where there may be contact with liquids or gases that may cause corrosion or damage to metal parts.