Efficiently Produced TG170 by PCBTok

PCBs’ solid materials transform into a rubber-like substance at a high temperature for glass transition known as FR4 TG170.

PCBTok offers 7/24 sales, technical, and engineering support. In addition, we do not require a minimum order quantity for new purchases.

Further, we have over 500 employees working in our plant, and our boards comply with IPC Class 2 or 3. We also hold UL certification in the US and Canada.

Contact PCBTok right away to learn more about our newest current offers!

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Committed to Providing Superior TG170

We’ve established our reputation for over a decade by providing only the best quality of products and excellent service to our consumers across the globe.

During that period, we only produced premium quality TG170 products that can tolerate almost all desired purposes and applications.

Additionally, we thoroughly perform various tests and inspections to ensure that the quality and performance of our TG170 aren’t compromised.

We don’t tolerate mediocrity in PCBTok; we aim for perfection.

Please write us if you have any queries or worries regarding our services. Our knowledgeable staff will pleasantly and promptly attend to your inquiries.

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TG170 By Feature

S1000-2 PCB

The S1000-2 PCB that we particularly incorporate this material into possesses high resistance to heat, low water absorption, exceptional anti-CAF performance, and excellent through-hole reliability; thus, ideal for automotive electronics.


The IT180 PCB that we particularly integrate this material into is highly compatible with a lead-free assembly process; hence, it can be an ecological solution to your operations. It is multifunctional and can be deployed for different purposes.

Heavy Copper PCB

The Heavy Copper PCB that we particularly incorporate this material into has exceptional thermal endurance and current carrying capacity. Additionally, the particular substances utilized on it account for excellent mechanical properties.

Isola 370HR PCB

The Isola 370HR PCB that we particularly integrate this material into offers a reduced coefficient of thermal expansion (CTE) and outstanding thermal performance. Due to its countless benefits, it has surpassed the FR4 PCB capabilities.


The FR408HR PCB into which we particularly incorporate this material can be frequently found in aerospace and defense, industrial and instrumentation, and medical industry due to its improved z-axis expansion, lower loss, and thermal ability.


The High TG PCB that we particularly integrate this material into is among the popular preferred boards in the market because of its excellent resistance to moisture, heat, and chemicals. Moreover, it has better stability in extreme environments.

What is TG170 Material in PCB?

In general, a TG170 material is considered under the High TG category; it can handle approximately 170°C in temperature. Thus, it requires a laminate that has a higher temperature. However, it requires proper caution when conducting lamination.

If proper procedure isn’t performed during the lamination process, it could compromise the board’s quality, including softening, melting, and deforming.

Furthermore, a Higher TG point indicates superior PCB performance against moisture stress, heat resistance, and chemical resistance. Thus, providing better stability.

The production of boards for telecommunications equipment, computers, industrial instruments, and precision apparatus is dominated principally by the TG170 material.

Please notify us to grab our TG170 at a phenomenal rate!

What is TG170 Material in PCB?
Features of the TG170

Features of the TG170

Below are some of the notable features of a TG170 material:

  • Excellent Properties for Thermal Delamination – It can withstand extremely high temperatures due to its outstanding laminate bonds.
  • Ecological – Its assembly doesn’t require the presence of lead on it, thus, reducing the occurrence of environmental pollution.
  • Heat Resistance – In situations wherein there’s a need to subject the board’s material to extreme conditions, it will not possess any damage to it. However, it should not exceed its temperature limitation of 170°C.
  • Anti-CAF Properties – It assists in preventing harm that could have resulted from oxidation.

General Properties of TG170 PCB

All PCBs with TG 170 have specific characteristics that specify their operating circumstances. Thus, the significant features that you need to evaluate are listed below.

  • Physical and Mechanical Properties – It should have a peel strength of 1.25 to 1.30 kgf/cm, arc resistance of 125 sec, and flexural strength of 589 to 456 N/mm2.
  • Thermal Properties – It needs to have a TG value of 170°C, a flammability rate of V-O under UL-94, and a Low Coefficient Thermal Expansion at Z and Z/Y Axis.
  • Electrical Properties – It should possess a surface resistance value of 1.0×107, volume resistance of 1.0×109, dielectric breakdown of 70 kV, a dielectric constant of 4.5, a dielectric strength of 44 kV/mm, and loss tangent value of 0.018.
General Properties of TG170 PCB

Avail PCBTok's Excellent Quality TG170

Avail PCBTok's Excellent Quality TG170
Avail PCBTok's Excellent Quality TG170

PCBTok is a manufacturer of TG170 that has extensive experience and knowledge in the industry. We offer a wide array of services regardless of the complexity.

We are your optimal solution for your TG170 specifications; we have a good source of components that apply to various purposes and applications.

In addition, we do not deliver products that haven’t undergone thorough production and rigorous assessment; we want to ensure that only great items are served to our consumers. Moreover, we guarantee complete customer satisfaction.

Ultimately, we are capable of fulfilling your desired boards on time at an affordable rate without sacrificing the quality of the products.

Place your TG170 order today with PCBTok!

TG170 Fabrication

Necessary Materials to Produce TG170 PCB

In the production of PCBs, various materials are essential. There are a few particular materials to select to produce quality TG170 PCBs.

One of the critical elements included in its production is the N4000-6 and the N4000-11. Additionally, we specifically deploy the MCL-E-679 type of material on it.

Apart from the mentioned production components, we have FR406, FR408, IS410, and Isola 370HR, which are crucial to be integrated.

Finally, we include the incorporation of S1170 and S1000-2 into its construction process; it can significantly contribute to the overall performance.

Get the best deals on your TG170 by ordering from us!

Advantages of TG170

Several different applications need high temperatures to function correctly. We must take into consideration utilizing the TG170 in such operations.

Thus, we’d like to discuss other benefits you can enjoy in a TG170. One of its primary advantages is its enhanced stability which can suffice any operation.

Secondly, it has exceptional heat dissipation, hence, reducing the occurrence of heat burdens. Then, it has excellent insulation reliability.

Ultimately, it possesses outstanding processability; it can be simple and easy to produce due to its tolerance to the ideal temperature of construction.

Please don’t hesitate to communicate with us if you have any inquiries.

OEM & ODM TG170 Applications

Computer Applications

Nowadays, even in extreme environments, technological improvements put a lot of strain on computers; thus, it requires a material that can suffice it.

Communication Equipment

Almost all communication infrastructure is subjected to extreme conditions; incorporating this material will improve the equipment’s functionality.

Office Automation Equipment

This specific material can endure environmental conditions of 170°C, which will help resist the elevated temperature in working circumstances.

Industrial Technologies

Since this particular material has proven stable during the application, they are widely preferred in industrial technologies for this feature.

Medical Apparatus

One of the advantages of utilizing this specific material is its enhanced insulation, it is deployed in medical apparatus wherein it is essential.

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PCBTok | Qualified TG170 Chinese Manufacturer

Only the highest-grade raw materials are used to develop our TG170.

We are committed to giving our customers outstanding service and goods.

TG170 Production Details As Following Up

NO Item Technical Specification
Standard Advanced
1 Layer Count 1-20 layers 22-40 layer
2 Base Material KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
3 PCB Type Rigid PCB/FPC/Flex-Rigid Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.
4 Lamination type Blind&buried via type Mechanical blind&burried vias with less than 3 times laminating Mechanical blind&burried vias with less than 2 times laminating
HDI PCB 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating
5 Finished Board Thickness 0.2-3.2mm 3.4-7mm
6 Minimum Core Thickness 0.15mm(6mil) 0.1mm(4mil)
7 Copper Thickness Min. 1/2 OZ, Max. 4 OZ Min. 1/3 OZ, Max. 10 OZ
8 PTH Wall 20um(0.8mil) 25um(1mil)
9 Maximum Board Size 500*600mm(19”*23”) 1100*500mm(43”*19”)
10 Hole Min laser drilling size 4mil 4mil
Max laser drilling size 6mil 6mil
Max aspect ratio for Hole plate 10:1(hole diameter>8mil) 20:1
Max aspect ratio for laser via filling plating 0.9:1(Depth included copper thickness) 1:1(Depth included copper thickness)
Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
0.8:1(drilling tool size≥10mil) 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)
Min. depth of Mechanical depth-control(back drill) 8mil 8mil
Min gap between hole wall and
conductor (None blind and buried via PCB)
7mil(≤8L),9mil(10-14L),10mil(>14L) 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)
Min gap between hole wall conductor (Blind and buried via PCB) 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)
Min gab between hole wall conductor(Laser blind hole buried via PCB) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
Min space between laser holes and conductor 6mil 5mil
Min space between hole walls in different net 10mil 10mil
Min space between hole walls in the same net 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
Min space bwteen NPTH hole walls 8mil 8mil
Hole location tolerance ±2mil ±2mil
NPTH tolerance ±2mil ±2mil
Pressfit holes tolerance ±2mil ±2mil
Countersink depth tolerance ±6mil ±6mil
Countersink hole size tolerance ±6mil ±6mil
11 Pad(ring) Min Pad size for laser drillings 10mil(for 4mil laser via),11mil(for 5mil laser via) 10mil(for 4mil laser via),11mil(for 5mil laser via)
Min Pad size for mechanical drillings 16mil(8mil drillings) 16mil(8mil drillings)
Min BGA pad size HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) HASL:10mil, LF HASL:12mil, other surface technics are 7mi
Pad size tolerance(BGA) ±1.5mil(pad size≤10mil);±15%(pad size>10mil) ±1.2mil(pad size≤12mil);±10%(pad size≥12mil)
12 Width/Space Internal Layer 1/2OZ:3/3mil 1/2OZ:3/3mil
1OZ: 3/4mil 1OZ: 3/4mil
2OZ: 4/5.5mil 2OZ: 4/5mil
3OZ: 5/8mil 3OZ: 5/8mil
4OZ: 6/11mil 4OZ: 6/11mil
5OZ: 7/14mil 5OZ: 7/13.5mil
6OZ: 8/16mil 6OZ: 8/15mil
7OZ: 9/19mil 7OZ: 9/18mil
8OZ: 10/22mil 8OZ: 10/21mil
9OZ: 11/25mil 9OZ: 11/24mil
10OZ: 12/28mil 10OZ: 12/27mil
External Layer 1/3OZ:3.5/4mil 1/3OZ:3/3mil
1/2OZ:3.9/4.5mil 1/2OZ:3.5/3.5mil
1OZ: 4.8/5mil 1OZ: 4.5/5mil
1.43OZ(positive):4.5/7 1.43OZ(positive):4.5/6
1.43OZ(negative ):5/8 1.43OZ(negative ):5/7
2OZ: 6/8mil 2OZ: 6/7mil
3OZ: 6/12mil 3OZ: 6/10mil
4OZ: 7.5/15mil 4OZ: 7.5/13mil
5OZ: 9/18mil 5OZ: 9/16mil
6OZ: 10/21mil 6OZ: 10/19mil
7OZ: 11/25mil 7OZ: 11/22mil
8OZ: 12/29mil 8OZ: 12/26mil
9OZ: 13/33mil 9OZ: 13/30mil
10OZ: 14/38mil 10OZ: 14/35mil
13 Dimension Tolerance Hole Position 0.08 ( 3 mils)
Conductor Width(W) 20% Deviation of Master
1mil Deviation of Master
Outline Dimension 0.15 mm ( 6 mils) 0.10 mm ( 4 mils)
Conductors & Outline
( C – O )
0.15 mm ( 6 mils) 0.13 mm ( 5 mils)
Warp and Twist 0.75% 0.50%
14 Solder Mask Max drilling tool size for via filled with Soldermask (single side) 35.4mil 35.4mil
Soldermask color Green, Black, Blue, Red, White, Yellow,Purple matte/glossy
Silkscreen color White, Black,Blue,Yellow
Max hole size for via filled with Blue glue aluminium 197mil 197mil
Finish hole size for via filled with resin  4-25.4mil  4-25.4mil
Max aspect ratio for via filled with resin board 8:1 12:1
Min width of soldermask bridge Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)
15 Surface Treatment Lead free Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
Leaded Leaded HASL
Aspect ratio 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)
Max finished size HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″;
Min finished size HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″;
PCB thickness HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm
Max high to gold finger 1.5inch
Min space between gold fingers 6mil
Min block space to gold fingers 7.5mil
16 V-Cutting Panel Size 500mm X 622 mm  ( max. ) 500mm X 800 mm ( max. )
Board Thickness 0.50 mm (20mil) min. 0.30 mm (12mil) min.
Remain Thickness 1/3 board thickness 0.40 +/-0.10mm( 16+/-4 mil )
Tolerance ±0.13 mm(5mil) ±0.1 mm(4mil)
Groove Width 0.50 mm (20mil) max. 0.38 mm (15mil) max.
Groove to Groove 20 mm (787mil) min. 10 mm (394mil) min.
Groove to Trace 0.45 mm(18mil) min. 0.38 mm(15mil) min.
17 Slot Slot size tol.L≥2W PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil)
18 Min Spacing from hole edge to hole edge 0.30-1.60 (Hole Diameter) 0.15mm(6mil) 0.10mm(4mil)
1.61-6.50 (Hole Diameter) 0.15mm(6mil) 0.13mm(5mil)
19 Min spacing between hole edge to circuitry pattern PTH hole: 0.20mm(8mil) PTH hole: 0.13mm(5mil)
NPTH hole: 0.18mm(7mil) NPTH hole: 0.10mm(4mil)
20 Image transfer Registration tol Circuit pattern vs.index hole 0.10(4mil) 0.08(3mil)
Circuit pattern vs.2nd drill hole 0.15(6mil) 0.10(4mil)
21 Registration tolerance of front/back image 0.075mm(3mil) 0.05mm(2mil)
22 Multilayers Layer-layer misregistration 4layers: 0.15mm(6mil)max. 4layers: 0.10mm(4mil) max.
6layers: 0.20mm(8mil)max. 6layers: 0.13mm(5mil) max.
8layers: 0.25mm(10mil)max. 8layers: 0.15mm(6mil) max.
Min. Spacing from Hole Edge to Innerlayer Pattern 0.225mm(9mil) 0.15mm(6mil)
Min.Spacing from Outline to Innerlayer Pattern 0.38mm(15mil) 0.225mm(9mil)
Min. board thickness 4layers:0.30mm(12mil) 4layers:0.20mm(8mil)
6layers:0.60mm(24mil) 6layers:0.50mm(20mil)
8layers:1.0mm(40mil) 8layers:0.75mm(30mil)
Board thickness tolerance 4layers:+/-0.13mm(5mil) 4layers:+/-0.10mm(4mil)
6layers:+/-0.15mm(6mil) 6layers:+/-0.13mm(5mil)
8-12 layers:+/-0.20mm (8mil) 8-12 layers:+/-0.15mm (6mil)
23 Insulation Resistance 10KΩ~20MΩ(typical:5MΩ)
24 Conductivity <50Ω(typical:25Ω)
25 Test voltage 250V
26 Impedance control ±5ohm(<50ohm), ±10%(≥50ohm)

PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.

1. DHL

DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.


2. UPS

UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.


3. TNT

TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.


4. FedEx

FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.


5. Air, Sea/Air, and Sea

If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.

Note: if you need others, please contact your sales representative for shipping solutions.

You can use the following payment methods:

Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.

Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.

Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.

Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.

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  • “All of the services and products from PCBTok are exceptional; they are a good company of PCBs out there. I’ve tried almost every manufacturer; however, I have never experienced the flawless output I received from them. Apart from that, they are accommodating to their customers; attended to all of my concerns immediately without hesitation. Overall, I am extremely pleased with their performance showcased upon me. I highly advise trying them out for your PCB projects and designs.”

    Roger Massey, Process Engineer from Memphis, Tennessee
  • “After returning to my quotation, helping with my desired circuitry design, and through board delivery, my transaction with PCBTok went without a hitch. They are there for me right from the start of the procedure till I acquire and evaluate my goods. I was also quite pleased with the service they provided for me. Regarding my upcoming board projects, I’ll most surely go back to PCBTok. But for now, PCBTok, many thanks!”

    Stephen Carpenter, Project Engineer from Mesa, Arizona
  • “The crew at PCBTok is amiable; they quickly addressed my issues and gave me their opinions on the matter. I am thrilled with the advice they gave me because it helped my venture be improved significantly. Additionally, I am delighted with how they keep me informed about changes to my product; I had no concerns due to that activity. None of them are defective in terms of quality or function; PCBTok took good care of my items. I urge you to use PCBTok’s services and products because they are outstanding and first-rate.”

    Anthony Fritzgerald, Electronics Technologist from Aurora, Colorado
Difference Between FR4 TG150 PCB and FR4 TG170 PCB

In essence, you will be perplexed by the terms TG150 PCB and TG170 PCB if you are not engaged in the PCB manufacturing sector. Regarding FR4 materials, the standard TG is between 130°C and 140°C, while the moderate TG exceeds 150°C.

On the other hand, high TG can reach temperatures of 170°C or more, such as 180°C. In the manufacturing process, the PCB ought to be flame-resistant, but it is even more crucial to ensure the steadiness of the board composition (x, y, z).

Usually, a greater TG is preferable. Nevertheless, if the TG figure is too high, it will make extra machining complex and raise the production cost and assembly.

The operating temperature should be considered while utilizing 150 or 170 TG PCB material. The TG 150 material can be used for PCBs if the temperature is less than 130°C or 140°C; however, 170°C must be chosen if the operating temperature is around 150 °C.

Consult us immediately for advice if you are uncertain of the material to select.

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