Efficiently Produced TG170 by PCBTok
PCBs’ solid materials transform into a rubber-like substance at a high temperature for glass transition known as FR4 TG170.
PCBTok offers 7/24 sales, technical, and engineering support. In addition, we do not require a minimum order quantity for new purchases.
Further, we have over 500 employees working in our plant, and our boards comply with IPC Class 2 or 3. We also hold UL certification in the US and Canada.
Contact PCBTok right away to learn more about our newest current offers!
Committed to Providing Superior TG170
We’ve established our reputation for over a decade by providing only the best quality of products and excellent service to our consumers across the globe.
During that period, we only produced premium quality TG170 products that can tolerate almost all desired purposes and applications.
Additionally, we thoroughly perform various tests and inspections to ensure that the quality and performance of our TG170 aren’t compromised.
We don’t tolerate mediocrity in PCBTok; we aim for perfection.
Please write us if you have any queries or worries regarding our services. Our knowledgeable staff will pleasantly and promptly attend to your inquiries.
TG170 By Feature
What is TG170 Material in PCB?
In general, a TG170 material is considered under the High TG category; it can handle approximately 170°C in temperature. Thus, it requires a laminate that has a higher temperature. However, it requires proper caution when conducting lamination.
If proper procedure isn’t performed during the lamination process, it could compromise the board’s quality, including softening, melting, and deforming.
Furthermore, a Higher TG point indicates superior PCB performance against moisture stress, heat resistance, and chemical resistance. Thus, providing better stability.
The production of boards for telecommunications equipment, computers, industrial instruments, and precision apparatus is dominated principally by the TG170 material.
Please notify us to grab our TG170 at a phenomenal rate!
Features of the TG170
Below are some of the notable features of a TG170 material:
- Excellent Properties for Thermal Delamination – It can withstand extremely high temperatures due to its outstanding laminate bonds.
- Ecological – Its assembly doesn’t require the presence of lead on it, thus, reducing the occurrence of environmental pollution.
- Heat Resistance – In situations wherein there’s a need to subject the board’s material to extreme conditions, it will not possess any damage to it. However, it should not exceed its temperature limitation of 170°C.
- Anti-CAF Properties – It assists in preventing harm that could have resulted from oxidation.
General Properties of TG170 PCB
All PCBs with TG 170 have specific characteristics that specify their operating circumstances. Thus, the significant features that you need to evaluate are listed below.
- Physical and Mechanical Properties – It should have a peel strength of 1.25 to 1.30 kgf/cm, arc resistance of 125 sec, and flexural strength of 589 to 456 N/mm2.
- Thermal Properties – It needs to have a TG value of 170°C, a flammability rate of V-O under UL-94, and a Low Coefficient Thermal Expansion at Z and Z/Y Axis.
- Electrical Properties – It should possess a surface resistance value of 1.0×107, volume resistance of 1.0×109, dielectric breakdown of 70 kV, a dielectric constant of 4.5, a dielectric strength of 44 kV/mm, and loss tangent value of 0.018.
Avail PCBTok's Excellent Quality TG170
PCBTok is a manufacturer of TG170 that has extensive experience and knowledge in the industry. We offer a wide array of services regardless of the complexity.
We are your optimal solution for your TG170 specifications; we have a good source of components that apply to various purposes and applications.
In addition, we do not deliver products that haven’t undergone thorough production and rigorous assessment; we want to ensure that only great items are served to our consumers. Moreover, we guarantee complete customer satisfaction.
Ultimately, we are capable of fulfilling your desired boards on time at an affordable rate without sacrificing the quality of the products.
Place your TG170 order today with PCBTok!
In the production of PCBs, various materials are essential. There are a few particular materials to select to produce quality TG170 PCBs.
One of the critical elements included in its production is the N4000-6 and the N4000-11. Additionally, we specifically deploy the MCL-E-679 type of material on it.
Apart from the mentioned production components, we have FR406, FR408, IS410, and Isola 370HR, which are crucial to be integrated.
Finally, we include the incorporation of S1170 and S1000-2 into its construction process; it can significantly contribute to the overall performance.
Get the best deals on your TG170 by ordering from us!
Several different applications need high temperatures to function correctly. We must take into consideration utilizing the TG170 in such operations.
Thus, we’d like to discuss other benefits you can enjoy in a TG170. One of its primary advantages is its enhanced stability which can suffice any operation.
Secondly, it has exceptional heat dissipation, hence, reducing the occurrence of heat burdens. Then, it has excellent insulation reliability.
Ultimately, it possesses outstanding processability; it can be simple and easy to produce due to its tolerance to the ideal temperature of construction.
Please don’t hesitate to communicate with us if you have any inquiries.
OEM & ODM TG170 Applications
TG170 Production Details As Following Up
|1||Layer Count||1-20 layers||22-40 layer|
|2||Base Material||KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)|
|3||PCB Type||Rigid PCB/FPC/Flex-Rigid||Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.|
|4||Lamination type||Blind&buried via type||Mechanical blind&burried vias with less than 3 times laminating||Mechanical blind&burried vias with less than 2 times laminating|
|HDI PCB||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating|
|5||Finished Board Thickness||0.2-3.2mm||3.4-7mm|
|6||Minimum Core Thickness||0.15mm(6mil)||0.1mm(4mil)|
|7||Copper Thickness||Min. 1/2 OZ, Max. 4 OZ||Min. 1/3 OZ, Max. 10 OZ|
|9||Maximum Board Size||500*600mm(19”*23”)||1100*500mm(43”*19”)|
|10||Hole||Min laser drilling size||4mil||4mil|
|Max laser drilling size||6mil||6mil|
|Max aspect ratio for Hole plate||10:1（hole diameter＞8mil）||20:1|
|Max aspect ratio for laser via filling plating||0.9:1(Depth included copper thickness)||1:1(Depth included copper thickness)|
|Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
|0.8:1(drilling tool size≥10mil)||1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)|
|Min. depth of Mechanical depth-control(back drill)||8mil||8mil|
|Min gap between hole wall and
conductor (None blind and buried via PCB)
|Min gap between hole wall conductor (Blind and buried via PCB)||8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)||7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)|
|Min gab between hole wall conductor(Laser blind hole buried via PCB)||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）|
|Min space between laser holes and conductor||6mil||5mil|
|Min space between hole walls in different net||10mil||10mil|
|Min space between hole walls in the same net||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)|
|Min space bwteen NPTH hole walls||8mil||8mil|
|Hole location tolerance||±2mil||±2mil|
|Pressfit holes tolerance||±2mil||±2mil|
|Countersink depth tolerance||±6mil||±6mil|
|Countersink hole size tolerance||±6mil||±6mil|
|11||Pad(ring)||Min Pad size for laser drillings||10mil(for 4mil laser via),11mil(for 5mil laser via)||10mil(for 4mil laser via),11mil(for 5mil laser via)|
|Min Pad size for mechanical drillings||16mil(8mil drillings)||16mil(8mil drillings)|
|Min BGA pad size||HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold)||HASL:10mil, LF HASL:12mil, other surface technics are 7mi|
|Pad size tolerance(BGA)||±1.5mil(pad size≤10mil);±15%(pad size>10mil)||±1.2mil(pad size≤12mil);±10%(pad size≥12mil)|
|1OZ: 3/4mil||1OZ: 3/4mil|
|2OZ: 4/5.5mil||2OZ: 4/5mil|
|3OZ: 5/8mil||3OZ: 5/8mil|
|4OZ: 6/11mil||4OZ: 6/11mil|
|5OZ: 7/14mil||5OZ: 7/13.5mil|
|6OZ: 8/16mil||6OZ: 8/15mil|
|7OZ: 9/19mil||7OZ: 9/18mil|
|8OZ: 10/22mil||8OZ: 10/21mil|
|9OZ: 11/25mil||9OZ: 11/24mil|
|10OZ: 12/28mil||10OZ: 12/27mil|
|1OZ: 4.8/5mil||1OZ: 4.5/5mil|
|1.43OZ（negative ）:5/8||1.43OZ（negative ）:5/7|
|2OZ: 6/8mil||2OZ: 6/7mil|
|3OZ: 6/12mil||3OZ: 6/10mil|
|4OZ: 7.5/15mil||4OZ: 7.5/13mil|
|5OZ: 9/18mil||5OZ: 9/16mil|
|6OZ: 10/21mil||6OZ: 10/19mil|
|7OZ: 11/25mil||7OZ: 11/22mil|
|8OZ: 12/29mil||8OZ: 12/26mil|
|9OZ: 13/33mil||9OZ: 13/30mil|
|10OZ: 14/38mil||10OZ: 14/35mil|
|13||Dimension Tolerance||Hole Position||0.08 ( 3 mils)|
|Conductor Width(W)||20% Deviation of Master
|1mil Deviation of Master
|Outline Dimension||0.15 mm ( 6 mils)||0.10 mm ( 4 mils)|
|Conductors & Outline
( C – O )
|0.15 mm ( 6 mils)||0.13 mm ( 5 mils)|
|Warp and Twist||0.75%||0.50%|
|14||Solder Mask||Max drilling tool size for via filled with Soldermask (single side)||35.4mil||35.4mil|
|Soldermask color||Green, Black, Blue, Red, White, Yellow,Purple matte/glossy|
|Silkscreen color||White, Black,Blue,Yellow|
|Max hole size for via filled with Blue glue aluminium||197mil||197mil|
|Finish hole size for via filled with resin||4-25.4mil||4-25.4mil|
|Max aspect ratio for via filled with resin board||8:1||12:1|
|Min width of soldermask bridge||Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)|
|Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
|Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)|
|Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)|
|Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)|
|15||Surface Treatment||Lead free||Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge|
|Aspect ratio||10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)|
|Max finished size||HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″；|
|Min finished size||HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″；|
|PCB thickness||HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm|
|Max high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mil|
|16||V-Cutting||Panel Size||500mm X 622 mm ( max. )||500mm X 800 mm ( max. )|
|Board Thickness||0.50 mm (20mil) min.||0.30 mm (12mil) min.|
|Remain Thickness||1/3 board thickness||0.40 +/-0.10mm( 16+/-4 mil )|
|Tolerance||±0.13 mm(5mil)||±0.1 mm(4mil)|
|Groove Width||0.50 mm (20mil) max.||0.38 mm (15mil) max.|
|Groove to Groove||20 mm (787mil) min.||10 mm (394mil) min.|
|Groove to Trace||0.45 mm(18mil) min.||0.38 mm(15mil) min.|
|17||Slot||Slot size tol.L≥2W||PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil)||PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil)|
|NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil)||NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil)|
|18||Min Spacing from hole edge to hole edge||0.30-1.60 (Hole Diameter)||0.15mm(6mil)||0.10mm(4mil)|
|1.61-6.50 (Hole Diameter)||0.15mm(6mil)||0.13mm(5mil)|
|19||Min spacing between hole edge to circuitry pattern||PTH hole: 0.20mm(8mil)||PTH hole: 0.13mm(5mil)|
|NPTH hole: 0.18mm(7mil)||NPTH hole: 0.10mm(4mil)|
|20||Image transfer Registration tol||Circuit pattern vs.index hole||0.10(4mil)||0.08(3mil)|
|Circuit pattern vs.2nd drill hole||0.15(6mil)||0.10(4mil)|
|21||Registration tolerance of front/back image||0.075mm(3mil)||0.05mm(2mil)|
|22||Multilayers||Layer-layer misregistration||4layers:||0.15mm(6mil)max.||4layers:||0.10mm(4mil) max.|
|Min. Spacing from Hole Edge to Innerlayer Pattern||0.225mm(9mil)||0.15mm(6mil)|
|Min.Spacing from Outline to Innerlayer Pattern||0.38mm(15mil)||0.225mm(9mil)|
|Min. board thickness||4layers:0.30mm(12mil)||4layers:0.20mm(8mil)|
|Board thickness tolerance||4layers:+/-0.13mm(5mil)||4layers:+/-0.10mm(4mil)|
|8-12 layers:+/-0.20mm (8mil)||8-12 layers:+/-0.15mm (6mil)|
|26||Impedance control||±5ohm(＜50ohm), ±10%(≥50ohm)|
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
“All of the services and products from PCBTok are exceptional; they are a good company of PCBs out there. I’ve tried almost every manufacturer; however, I have never experienced the flawless output I received from them. Apart from that, they are accommodating to their customers; attended to all of my concerns immediately without hesitation. Overall, I am extremely pleased with their performance showcased upon me. I highly advise trying them out for your PCB projects and designs.”Roger Massey, Process Engineer from Memphis, Tennessee
“After returning to my quotation, helping with my desired circuitry design, and through board delivery, my transaction with PCBTok went without a hitch. They are there for me right from the start of the procedure till I acquire and evaluate my goods. I was also quite pleased with the service they provided for me. Regarding my upcoming board projects, I’ll most surely go back to PCBTok. But for now, PCBTok, many thanks!”Stephen Carpenter, Project Engineer from Mesa, Arizona
“The crew at PCBTok is amiable; they quickly addressed my issues and gave me their opinions on the matter. I am thrilled with the advice they gave me because it helped my venture be improved significantly. Additionally, I am delighted with how they keep me informed about changes to my product; I had no concerns due to that activity. None of them are defective in terms of quality or function; PCBTok took good care of my items. I urge you to use PCBTok’s services and products because they are outstanding and first-rate.”Anthony Fritzgerald, Electronics Technologist from Aurora, Colorado
In essence, you will be perplexed by the terms TG150 PCB and TG170 PCB if you are not engaged in the PCB manufacturing sector. Regarding FR4 materials, the standard TG is between 130°C and 140°C, while the moderate TG exceeds 150°C.
On the other hand, high TG can reach temperatures of 170°C or more, such as 180°C. In the manufacturing process, the PCB ought to be flame-resistant, but it is even more crucial to ensure the steadiness of the board composition (x, y, z).
Usually, a greater TG is preferable. Nevertheless, if the TG figure is too high, it will make extra machining complex and raise the production cost and assembly.
The operating temperature should be considered while utilizing 150 or 170 TG PCB material. The TG 150 material can be used for PCBs if the temperature is less than 130°C or 140°C; however, 170°C must be chosen if the operating temperature is around 150 °C.
Consult us immediately for advice if you are uncertain of the material to select.