Trustworthy USB Hub PCB by PCBTok
In able to link different devices to a host system, we can utilize a USB Hub PCB, which allows the freedom to convert a single Universal Serial Bus (USB) port into a multi-port system.
PCBTok delivers work-in-progress status weekly. Moreover, we allow third-party factory audits and inspections before establishing our business.
Also, depending on your purchases, we have versatile payment methods. Then, we offer 24/7 sales, engineering, and technical support, and all our boards are IPC Class 2 or 3.
Get the most delicate USB Hub PCB from PCBTok straight away!
Working to Provide USB Hub PCBs of the Highest Quality
Since we stepped foot in this industry, PCBTok has valued quality and customer service equally. We aim to serve our clients only with excellent USB Hub PCB.
Regarding production, we only utilize high-grade raw resources and sophisticated technologies in your products and deploy exceptionally talented engineers in the plant.
Apart from that, PCBTok strictly follows the international standard guidelines in constructing your orders; this ensures that it will perform efficiently during operations.
Please place your order with us today; take advantage of our superior USB Hub PCB!
In case there’s a need for us to put in extra effort to achieve your anticipated board objectives, we will comply gladly and with great enthusiasm.
USB Hub PCB By Number of Ports
The 2-Port PCBA that we particularly incorporate in this board is capable of supporting 5 Volts at 1.5A for each of its ports. In addition, it is frequently deployed for applications that require a faster charging system and data transfer.
The 3-Port PCBA that we particularly integrate into this board has a DC input of 5 Volts at 2A; however, its output current per port is only 500 mA. In addition, it has a transmission speed of 480 Mbps and is highly ideal for ethernet applications.
The 4-Port PCBA that we particularly incorporate in this board supplies a current of 900 mA for each downstream port. Additionally, it can withstand high-speed data transfer, which is ideal with USB 2.0/1.1, and has a transmission speed of 5 Gbps.
The 5-Port PCBA that we particularly integrate into this board has a power output of 5 Volts at 3A; it can be ideal for a charging system that supports fast charging. Additionally, it is compatible with mobile phones, tablets, and smartwatches.
The 7-Port PCBA that we particularly incorporate in this board supports 500 mA in each of its ports. Furthermore, it is customizable, has surge protection, and is RoHS compliant. It can support five (5) devices working simultaneously without issues.
The 8-Port PCBA that we particularly integrate into this board has an output current of 1.5A for each port. It supports fast data transfer and power charging and is usually applied on mobile, tablet, and computers. Moreover, it supports customization.
What is a USB Hub PCB?
An efficient circuitry for running USB ports is the USB Hub PCB. Typically, USB hubs are built into desktops so individuals can connect as many devices as necessary. In essence, it manages several USB Hubs’ upstream and downstream ports.
Various electronic devices linked to a multiport USB hub guarantee optimum data transfer. Once more, it significantly enhances the effectiveness of the connecting devices. Its versatility makes it useful for switches and other kitchen appliances.
In terms of working life, this particular board’s longevity is considerable. Aside from that, efficient temperature management and impedance control enable this PCB to be a prime candidate for high-frequency electronic applications.
Get in touch with us promptly to find out more about this board.

How Does the USB Hub PCB Work?
The superior features of USB Hub PCB make it possible to connect countless devices to a server using a solitary USB (Universal Serial Bus).
Additionally, USB Hubs often have sufficient downstream and upstream ports. Along upstream ports, data from the client system at various wavelengths are collected. Then, these signals will be transferred to a device linked to the downstream port.
It has functional parts like a transmitter, antenna, diode, and other things included in this particular board, regulating the data transfer from the server to the target port.
The USB port can transport data straight to the target location owing to the USB 3 Hub PCB. Lowering the signal strength in the USB interface reduces unnecessary energy usage.
Key Features of USB 3 Hub PCB
In the field of electronics, the USB 3 Hub PCB has resulted in a significant advancement. It provides fantastic features that vastly enhance the device’s functionality. Its most notable characteristics are as follows:
- Micro plugs of types A, B, and C are functional.
- It has a bandwidth of 5 Gbps.
- It can operate in extreme temperature conditions; thus, High TG PCB.
- Its charging system is sped up with this PCB; it guarantees reliable energy control.
- It enables signals to be sent from the port to the base computer.
- It is highly resistant to moisture and chemical purities.
- It has high dielectric strength and reduced relative permittivity.
- It takes advantage of point-to-point packet routing.

Grab PCBTok's High Performing USB Hub PCB


One of the factors to consider in choosing a reliable manufacturer is their experience in the industry; PCBTok has been satisfying customers’ PCB needs for over twelve years.
Thus, we are confident that we can provide you with the USB Hub PCB based on your desired specifications and purpose. We will produce it with complete professionalism.
Although this particular board is expensive to manufacture, we at PCBTok are constantly offering the finest deals to reduce the assembly cost of this product. However, we assure you that we will not compromise the quality of the USB Hub Printed Circuit Board.
All of our PCB products are strictly monitored by our skilled, experienced, and RoHS-certified technicians and engineers at our well-structured facility.
Obtain your top-notch quality USB Hub PCB with us today; we’ll be delighted to assist you!
USB Hub PCB Fabrication
The PCB for a USB Hub is made of a variety of dielectric materials with exceptional endurance. Its primary components are copper-clad, FR4, FR5, CEM-1, CEM-3, etc.
All of these materials provide adequate protection from chemical contaminants and thermal stresses. Also, it is well-insulated due to its dielectrics.
Due to this, it can withstand high current demands. Having said this, this high-current PCB maintains a constant pace of data transmission.
Additionally, FR4 composite epoxy resins continue to work in hot environments. Therefore, materials are essential for enhancing its performance.
Please email us if you have any inquiries about the materials!
The Powered USB hub PCB is a highly functional electrical circuit board. Even without needing an external power source, it can be powered efficiently and flawlessly.
In this article, we’ll discuss some of its considerable advantages. Firstly, it can power generate itself through the aid of an AC adapter connected to its hub.
Secondly, it has high connectivity since it can handle multiple devices in one server. Thirdly, it has exceptional functionality and durability.
Fourth, it has enhanced component management, capable of handling data transmissions at demanding devices. Ultimately, it can be easily produced and assembled.
Should you have any questions about this, don’t hesitate to speak with us.
OEM & ODM USB Hub PCB Applications
Due to the capability of this board to accommodate multiple connections, they are widely incorporated in computers and laptops.
Nowadays, many devices support fast-charging systems, and it now requires a board that can handle those connections; thus, it utilizes this board.
Since this particular board can transmit signals from the base computer to a port, it is frequently integrated into external keyboards.
One of the occurrences in printers and scanners is heat; thus, it necessitates a board that can tolerate high operating temperatures like this one.
Since external hard drives and flash drives are frequently used to transfer files from one device to another, a board with solid signal integrity, like this one, is vital.
USB Hub PCB Production Details As Following Up
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NO | Item | Technical Specification | ||||||
Standard | Advanced | |||||||
1 | Layer Count | 1-20 layers | 22-40 layer | |||||
2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
Max laser drilling size | 6mil | 6mil | ||||||
Max aspect ratio for Hole plate | 10:1(hole diameter>8mil) | 20:1 | ||||||
Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(>14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(>14L) | ||||||
Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | ||||||
Min space between laser holes and conductor | 6mil | 5mil | ||||||
Min space between hole walls in different net | 10mil | 10mil | ||||||
Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
Hole location tolerance | ±2mil | ±2mil | ||||||
NPTH tolerance | ±2mil | ±2mil | ||||||
Pressfit holes tolerance | ±2mil | ±2mil | ||||||
Countersink depth tolerance | ±6mil | ±6mil | ||||||
Countersink hole size tolerance | ±6mil | ±6mil | ||||||
11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
12 | Width/Space | Internal Layer | 1/2OZ:3/3mil | 1/2OZ:3/3mil | ||||
1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
External Layer | 1/3OZ:3.5/4mil | 1/3OZ:3/3mil | ||||||
1/2OZ:3.9/4.5mil | 1/2OZ:3.5/3.5mil | |||||||
1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
1.43OZ(positive):4.5/7 | 1.43OZ(positive):4.5/6 | |||||||
1.43OZ(negative ):5/8 | 1.43OZ(negative ):5/7 | |||||||
2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
||||||
Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
Warp and Twist | 0.75% | 0.50% | ||||||
14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
Silkscreen color | White, Black,Blue,Yellow | |||||||
Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
Base copper≤0.5 oz、Finish treatment not Immersion Tin : 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
Leaded | Leaded HASL | |||||||
Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
Max finished size | HASL Lead 22″*39″;HASL Lead free 22″*24″;Flash gold 24″*24″;Hard gold 24″*28″;ENIG 21″*27″;Flash gold(electroplated gold) 21″*48″;Immersion Tin 16″*21″;Immersion silver 16″*18″;OSP 24″*40″; | |||||||
Min finished size | HASL Lead 5″*6″;HASL Lead free 10″*10″;Flash gold 12″*16″;Hard gold 3″*3″;Flash gold(electroplated gold) 8″*10″;Immersion Tin 2″*4″;Immersion silver 2″*4″;OSP 2″*2″; | |||||||
PCB thickness | HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm | |||||||
Max high to gold finger | 1.5inch | |||||||
Min space between gold fingers | 6mil | |||||||
Min block space to gold fingers | 7.5mil | |||||||
16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
17 | Slot | Slot size tol.L≥2W | PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil) | PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil) | ||||
NPTH slot(mm) L+/-0.10 (4mil) W:+/-0.05(2mil) | NPTH slot(mm) L:+/-0.08 (3mil) W:+/-0.05(2mil) | |||||||
18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
24 | Conductivity | <50Ω(typical:25Ω) | ||||||
25 | Test voltage | 250V | ||||||
26 | Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
Related Products
In digital projects, USB 3.0 hub PCBs and USB 2.0 hub PCBs each provide unique advantages. However, due to its greater functionality, USB 3 hub PCB has gained more popularity in the PCB sector.
As a reference, a comparison between these two PCBs is provided below.
- Speed Control – USB 3.0 can tolerate 5 Gbps raw bandwidth in this category. While USB 2.0 can only take 480 Mbps raw bandwidth.
- Power Management – In this aspect, USB 3.0 reigns over USB 2.0 since it can suffice 900 mA in each port.
- Signal Routing – To deliver data from the host to the attached device, the USB 3 hub supports point-to-point packet routing; hence, it is possible to save system power. While the USB 2 hub only supports broadcast-to-all-points signal routing, which is not ideal and efficient for low power consumption.
- Data Buffering – The USB 3.0 hub supports this aspect, while USB 2.0 doesn’t.
- Cost – The USB 2.0 hub is inexpensive compared to the USB 3.0 hub; however, despite its price, it has countless benefits.