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Quality Excellence of PCBTok’s VT-901
We are committed to providing our customers with the highest quality VT-901 at all times. PCBTok, who has been serving customers in over 50 countries around the world, ensures every part of our production process meets or exceeds international standards.
- Free sample before completing large purchase of circuit boards
- All printed circuit boards meet IPC Class 2 or 3
- Deliver test pieces before making large transactions
- Engineering questions(EQ) will be sending within 1-2hours
Dependable and Reliable Fabricator of VT-901 l PCBTok
VT-901 is one of the best PCBs in the market today. It is a highly durable type of board that can withstand high temperatures, as well as cold temperatures. It has excellent thermal conductivity, which means that it will not break down due to heat damage or freezing cold temperatures.
The boards are also resistant to moisture, so they will not corrode if exposed to water or moisture for long periods of time. This makes them ideal for use in industrial settings where there may be some risk of exposure to moisture or other environmental factors that could cause damage to electronic components such as transistors or resistors.
The boards are also very lightweight, which makes them easy to transport from place to place without having to worry about damaging them during transit because they’re too heavy for their own good! The low weight means that you don’t have to worry about adding extra weight onto your shipment by shipping out more products than necessary.
PCBTok is one of the leading manufacturers, supplying the best quality VT-901 to our clients. We have been able to gain the trust of our clients through our high-quality products and services. PCBTok strives to provide the best products at affordable prices for all our customers.
VT-901 by Core Thickness
VT-901 with 0.05mm thickness with low moisture absorption, good acid and alkali resistance, excellent high frequency transmittance of wave boards and high precision.
The VT-901 manufactured by PCBTok with 1mm core thickness can be used in different applications such as high-speed data transmission, communications, power supply and control.
VT-901 manufactured by PCBTok with 1.5mm thickness of core is a very light PCB and has a high yield rate for small or complicated hardware designs for devices better performance and durability.
This board is specifically designed for multilayer PCBs that require both sides to be populated, making it ideal for high-density audio, telecommunication boards, etc.
2.5mm is the standard core thickness for a printed circuit board. Many manufacturers use thinner cores, or multiple layers of boards in order to reduce weight.
This product features 3mm copper core thickness that makes it ideal for grounding, wiring, and signal paths where high current density is required.
VT-901 By E-Glass (6)
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The VT-901 is manufactured with 7628 E-Glass, a high strength, lightweight glass matrix that provides excellent resistance to compression strength and flexural properties.
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Manufactured with 1506 E-Glass is a high strength PCB that is used for many structural applications and in situations where increased durability is required.
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VT-901 manufactured with 3313 E-Glass offers the highest level of mechanical strength and resistance to chemical attack with combination of high tensile and flexural modulus
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VT-901 is manufactured with 2113 E-Glass, a specially formulated fiber that has a high mechanical strength, high resistance to thermal shock and is corrosion resistant.
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Very light in weight, yet extremely strong and resistant to impact, making it an excellent choice for industrial and automotive applications in high temperature environments.
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High-performance fiber developed for structural applications and manufactured with 2116 E-Glass. The glass in the core of the fiber provides exceptional strength and stiffness
VT-901 PCB by Copper Thickness (6)
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VT-901 is manufactured using 1 oz Copper thickness provides excellent heat dissipation and electrical conductivity, which allows it to be used in various applications.
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Manufactured with 2 oz copper thickness is our thickest copper plating available in this size. It is engineered for high current, high voltage and high frequency applications
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Designed for extreme temperatures, the VT-901 is manufactured with 3 oz copper thickness. The PCB will not warp over time and ensures maximum durability.
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VT-901 circuit board manufactured with 4 oz copper thickness. Copper is a highly conductive metal that is used in trace routing paths, to connect components and power planes.
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Our VT-901 is manufactured using 6 oz copper thickness, which is the highest quality. This ensures optimal heat dissipation, electrical conductivity and durability.
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PCBTok’s VT-901 is made with 12 oz copper, and has a standard FR4 base. The quality of manufacturing can ensure that the product is in compliance with industry standards.
PCBTok’s VT-901 Meets NASA Requirements
NASA has strict standards for space equipment and components, but that doesn’t mean you can’t get the same quality of workmanship on your own projects. With PCBTok’s VT-901, you can be confident that your space equipment is built to last. It meets or exceeds every requirement set forth by NASA, meaning you’ll get a product that will last through even the toughest conditions.
PCBTok is an industry leader in the manufacturing of printed circuit boards that adhere to the stringent requirements of NASA. PCBTok’s VT-901 meets NASA requirements and has been verified by an ISO 17025 accredited laboratory.
VT-901 Fabricated to Perfection
VT-901 manufactured by PCBTok that specializes in producing high-quality steel products. We are committed to providing our customers with the best quality products and a service they can rely on. We will do whatever it takes to make sure our customers are satisfied with their purchase.
We take pride in our work and strive for perfection. We have the best fabrication team in the business, and we are ready to help you get your project done on time and on budget.
VT-901 for Chip Manufacturers
VT-901 is a circuit board for chip manufacturers, who are in need of high-quality circuit boards with a low price. VT-901 has been designed with the best quality materials and processes to ensure that you get the boards you need, no matter what kind of application they will be used in.
VT-901 is the ideal solution for chip manufacturers, who depend on the accuracy and precision of their machinery to produce high-quality chips.
By combining these features with our patented technology, we have created a system that is easy to use and maintain, while also providing you with maximum efficiency and flexibility.
VT-901 IPC Validation Listed
The IPC validation program is a comprehensive listing of products that have been tested for electrical safety in accordance with the requirements of ANSI/IPC-A-610, Requirements for Electrical Equipment for Use in Class I, II and III.
The VT-901 has been IPC validation listed, which means it’s now approved for use in electronic equipment that must adhere to the standards set by the IPC. This process ensures that our products meet all requirements for electrical insulation, thermal and mechanical stress regulation, and performance compatibility.
VT-901 Fabrication
VT-901 is a circuit board material that is used in the manufacturing of electronic devices. It is lightweight and flexible, making it ideal for use in consumer and commercial electronic devices. The material has an improved fracture toughness due to its unique composition.
The improved fracture toughness of VT-901 circuit board makes it ideal for use in consumer and industrial products.
VT-901 can be used for many applications, but is most commonly used for aircrafts and satellites. It provides improved fracture toughness compared to its predecessors
The VT-901 Low Z-Axis CTE of circuit board is a measure of how much the board shrinks along its z-axis (the axis perpendicular to the surface of the board). The smaller the number, the less it shrinks. This is important because when you’re trying to solder something onto a circuit board, it’s helpful if that thing doesn’t shrink away from you.
VT-901 is a low Z-axis coefficient of thermal expansion material for SMT testing and manufacturing applications. It provides high thermal conductivity, low creep and stress relaxation, good resistance to solder reflow temperatures, and excellent dielectric properties.
OEM & ODM VT-901 Applications
The VT-901 is a circuit board that is used to manufacture chips. It’s made of a durable and high-quality material that provides reliable performance, even under tough conditions.
The VT-901 circuit board is a small, lightweight circuit board that is used in aircraft and engine systems. The VT-901 is used to monitor and control the flow of fuel, air and oil to the engine.
For the power supply is a device that converts AC voltage into DC voltage to be used by the computer. Regulates the voltage and current to ensure that they are within safe levels.
This is the VT-901 circuit board for backplane. It’s designed to control the flow of data between network devices and servers over a fiber optic connection
VT-901 is a high quality PCB with low cost and high reliability. It is mainly used in military and burn-in board, such as jet engine control system, guidance system, navigation system, etc.
VT-901 Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
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- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
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| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
