PCBTok’s Expertly Developed Wireless PCB
PCBTok’s Wireless PCB has been widely recognized because of its capability to perform its purpose flawlessly; reaching its maximum potential in the industry.
- In the span of an hour or two, expect to receive engineering questions (EQ).
- In every order, we provide samples of soldering, micro-section, and COC report.
- Our sales, engineer, and technical experts are available day and night.
- We guarantee IPC Class 2 or 3 in your PCB orders.
- There’s a 24-hour return policy for every prototype PCB purchased.
Exceptionally Good Wireless PCB Products from PCBTok
Our highly-skilled and experienced engineers carefully observe the manufacturing process of your Wireless PCB; thus, you can guarantee a flawless output.
PCBTok always considers the view of its customers; hence, we are always doing our best to serve you a product that can last longer and serve its optimum performance.
We are continuously upgrading every necessary skill that our professionals must have in order to constantly provide you with a Wireless PCB that is worth it.
Your fulfillment towards our Wireless PCB challenges us to perform better always.
You can never go wrong by picking us as your Wireless PCB manufacturer; we have gratified thousands of clients worldwide with our nearly flawless PCB items and services.
Wireless PCB By Feature
Wireless PCB By Metal Coating (5)
Wireless PCB By Dielectric (5)
Wireless PCB Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Strength of PCBTok’s Wireless PCB
Due to the following features, Wireless PCB has become very practical in today’s world:
- It is convenient to use because it doesn’t require any wires or cables.
- Its versatility allows for simple upgrades whenever necessary.
- It can transmit signals farther away than infrared devices can.
- Due to its wireless capability, it doesn’t interfere with other devices.
- Despite all of its benefits, it has a reasonable price.
As a result of the greater benefits that PCBTok’s Wireless PCB can provide for your applications, it is used extensively by many individuals and has been integrated into a variety of devices.
Components Deployed in Wireless PCB
We use the following parts to build high-quality Wireless PCBs for you that can fulfill their intended uses.
Cypress Bluetooth Low Energy Microcontroller, Microcontroller Crystal, Bluetooth Chip Antenna, Ceramic Capacitors, P-Channel MOSFET, Ferrite Bead, Inductor, Resistor, Programming Connector, InvenSense 9-Axis Motion Sensor, and Texas Instruments Humidity Sensor.
All of these components involve specific models; thus, if you intend to outsource these elements yourself, you might want to contact us beforehand to get the correct guidelines for the particular model. If not, you can just send us a message right away.
Communication Range of Wireless PCB Contributing Factors
A Wireless PCB’s communication range may be influenced by the device itself, its surroundings, and a variety of other factors. The following are some of the variables that affect the range value:
- Power and Sensitivity – It will depend on the transmitter and receiver strength.
- Environment – In some cases, the weather may have an impact.
- Antennae – The coverage of the antennae might be weak due to its surrounding.
In general, when the Wireless PCB integrated Bluetooth technology, it is capable of connecting devices up to thirty (30) feet maximum; however, it may vary depending on the Bluetooth technology version.
PCBTok's Expertise: Producing High Grade Wireless PCBs
The Wireless PCB from PCBTok has undergone numerous tests and inspections to reach its maximum performance and fulfill its intended functions. We always ensure that our customers’ needs are met by offering them a quality product.
All of these are made possible by our expert staff who thoroughly watch the entire production process that your Wireless PCB undergoes.
We regularly evaluate the skills of the hands of our professionals handling your Wireless PCB because if they are unable to manage one themselves, they will not be able to give one to you. As a result, we are always improving their skills.
PCBTok cares for its consumers. However, we also value the expertise that our qualified staff members possess in order to consistently provide a high-quality product.
Wireless PCB Fabrication
The design of your Wireless PCB has a great impact on the overall performance; thus, it is essential to look out for these factors to consider when designing.
The usage of certified module, selection of Bluetooth device, separation of copper signal and sensitive parts, power supply, tools availability, and environment.
In selecting your module, it is necessary to choose the certified one regardless of its cost because it can save your time and skyrocket the production process.
As for the other factors to consider, you might want to reach out for in-depth knowledge to look out for concerning the mentioned factors. We are available to answer you 24/7.
Just ping us through our social media accounts or by pressing the inquiry button.
Since we value our customers, we will provide you full transparency by providing you with a brief overview of the production process of your Wireless PCB.
In manufacturing your Wireless PCB, it is not that hard. You can easily grasp the process without even having an in-depth explanation of each phase through their terms.
In the inspection phase, it will be sent out to the QC department which will be evaluated for a faultless QC report. If passed, the product is ready to be launched.
Simply get in touch with us if you want further details about this.
OEM & ODM Wireless PCB Applications
Wireless PCB Production Details As Following Up
|1||Layer Count||1-20 layers||22-40 layer|
|2||Base Material||KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)|
|3||PCB Type||Rigid PCB/FPC/Flex-Rigid||Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill.|
|4||Lamination type||Blind&buried via type||Mechanical blind&burried vias with less than 3 times laminating||Mechanical blind&burried vias with less than 2 times laminating|
|HDI PCB||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating||1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating|
|5||Finished Board Thickness||0.2-3.2mm||3.4-7mm|
|6||Minimum Core Thickness||0.15mm(6mil)||0.1mm(4mil)|
|7||Copper Thickness||Min. 1/2 OZ, Max. 4 OZ||Min. 1/3 OZ, Max. 10 OZ|
|9||Maximum Board Size||500*600mm(19”*23”)||1100*500mm(43”*19”)|
|10||Hole||Min laser drilling size||4mil||4mil|
|Max laser drilling size||6mil||6mil|
|Max aspect ratio for Hole plate||10:1（hole diameter＞8mil）||20:1|
|Max aspect ratio for laser via filling plating||0.9:1(Depth included copper thickness)||1:1(Depth included copper thickness)|
|Max aspect ratio for mechanical depth-
control drilling board(Blind hole drilling depth/blind hole size)
|0.8:1(drilling tool size≥10mil)||1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)|
|Min. depth of Mechanical depth-control(back drill)||8mil||8mil|
|Min gap between hole wall and
conductor (None blind and buried via PCB)
|Min gap between hole wall conductor (Blind and buried via PCB)||8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)||7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)|
|Min gab between hole wall conductor(Laser blind hole buried via PCB)||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）||7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）|
|Min space between laser holes and conductor||6mil||5mil|
|Min space between hole walls in different net||10mil||10mil|
|Min space between hole walls in the same net||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)||6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)|
|Min space bwteen NPTH hole walls||8mil||8mil|
|Hole location tolerance||±2mil||±2mil|
|Pressfit holes tolerance||±2mil||±2mil|
|Countersink depth tolerance||±6mil||±6mil|
|Countersink hole size tolerance||±6mil||±6mil|
|11||Pad(ring)||Min Pad size for laser drillings||10mil(for 4mil laser via),11mil(for 5mil laser via)||10mil(for 4mil laser via),11mil(for 5mil laser via)|
|Min Pad size for mechanical drillings||16mil(8mil drillings)||16mil(8mil drillings)|
|Min BGA pad size||HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold)||HASL:10mil, LF HASL:12mil, other surface technics are 7mi|
|Pad size tolerance(BGA)||±1.5mil(pad size≤10mil);±15%(pad size>10mil)||±1.2mil(pad size≤12mil);±10%(pad size≥12mil)|
|1OZ: 3/4mil||1OZ: 3/4mil|
|2OZ: 4/5.5mil||2OZ: 4/5mil|
|3OZ: 5/8mil||3OZ: 5/8mil|
|4OZ: 6/11mil||4OZ: 6/11mil|
|5OZ: 7/14mil||5OZ: 7/13.5mil|
|6OZ: 8/16mil||6OZ: 8/15mil|
|7OZ: 9/19mil||7OZ: 9/18mil|
|8OZ: 10/22mil||8OZ: 10/21mil|
|9OZ: 11/25mil||9OZ: 11/24mil|
|10OZ: 12/28mil||10OZ: 12/27mil|
|1OZ: 4.8/5mil||1OZ: 4.5/5mil|
|1.43OZ（negative ）:5/8||1.43OZ（negative ）:5/7|
|2OZ: 6/8mil||2OZ: 6/7mil|
|3OZ: 6/12mil||3OZ: 6/10mil|
|4OZ: 7.5/15mil||4OZ: 7.5/13mil|
|5OZ: 9/18mil||5OZ: 9/16mil|
|6OZ: 10/21mil||6OZ: 10/19mil|
|7OZ: 11/25mil||7OZ: 11/22mil|
|8OZ: 12/29mil||8OZ: 12/26mil|
|9OZ: 13/33mil||9OZ: 13/30mil|
|10OZ: 14/38mil||10OZ: 14/35mil|
|13||Dimension Tolerance||Hole Position||0.08 ( 3 mils)|
|Conductor Width(W)||20% Deviation of Master
|1mil Deviation of Master
|Outline Dimension||0.15 mm ( 6 mils)||0.10 mm ( 4 mils)|
|Conductors & Outline
( C – O )
|0.15 mm ( 6 mils)||0.13 mm ( 5 mils)|
|Warp and Twist||0.75%||0.50%|
|14||Solder Mask||Max drilling tool size for via filled with Soldermask (single side)||35.4mil||35.4mil|
|Soldermask color||Green, Black, Blue, Red, White, Yellow,Purple matte/glossy|
|Silkscreen color||White, Black,Blue,Yellow|
|Max hole size for via filled with Blue glue aluminium||197mil||197mil|
|Finish hole size for via filled with resin||4-25.4mil||4-25.4mil|
|Max aspect ratio for via filled with resin board||8:1||12:1|
|Min width of soldermask bridge||Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)|
|Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other
color,extremity 3.5mil) , 8mil( on copper area
|Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)|
|Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)|
|Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)|
|15||Surface Treatment||Lead free||Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge|
|Aspect ratio||10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)|
|Max finished size||HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″；|
|Min finished size||HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″；|
|PCB thickness||HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm|
|Max high to gold finger||1.5inch|
|Min space between gold fingers||6mil|
|Min block space to gold fingers||7.5mil|
|16||V-Cutting||Panel Size||500mm X 622 mm ( max. )||500mm X 800 mm ( max. )|
|Board Thickness||0.50 mm (20mil) min.||0.30 mm (12mil) min.|
|Remain Thickness||1/3 board thickness||0.40 +/-0.10mm( 16+/-4 mil )|
|Tolerance||±0.13 mm(5mil)||±0.1 mm(4mil)|
|Groove Width||0.50 mm (20mil) max.||0.38 mm (15mil) max.|
|Groove to Groove||20 mm (787mil) min.||10 mm (394mil) min.|
|Groove to Trace||0.45 mm(18mil) min.||0.38 mm(15mil) min.|
|17||Slot||Slot size tol.L≥2W||PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil)||PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil)|
|NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil)||NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil)|
|18||Min Spacing from hole edge to hole edge||0.30-1.60 (Hole Diameter)||0.15mm(6mil)||0.10mm(4mil)|
|1.61-6.50 (Hole Diameter)||0.15mm(6mil)||0.13mm(5mil)|
|19||Min spacing between hole edge to circuitry pattern||PTH hole: 0.20mm(8mil)||PTH hole: 0.13mm(5mil)|
|NPTH hole: 0.18mm(7mil)||NPTH hole: 0.10mm(4mil)|
|20||Image transfer Registration tol||Circuit pattern vs.index hole||0.10(4mil)||0.08(3mil)|
|Circuit pattern vs.2nd drill hole||0.15(6mil)||0.10(4mil)|
|21||Registration tolerance of front/back image||0.075mm(3mil)||0.05mm(2mil)|
|22||Multilayers||Layer-layer misregistration||4layers:||0.15mm(6mil)max.||4layers:||0.10mm(4mil) max.|
|Min. Spacing from Hole Edge to Innerlayer Pattern||0.225mm(9mil)||0.15mm(6mil)|
|Min.Spacing from Outline to Innerlayer Pattern||0.38mm(15mil)||0.225mm(9mil)|
|Min. board thickness||4layers:0.30mm(12mil)||4layers:0.20mm(8mil)|
|Board thickness tolerance||4layers:+/-0.13mm(5mil)||4layers:+/-0.10mm(4mil)|
|8-12 layers:+/-0.20mm (8mil)||8-12 layers:+/-0.15mm (6mil)|
|26||Impedance control||±5ohm(＜50ohm), ±10%(≥50ohm)|
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
“I chose PCBTok as my PCB maker, and that was the right choice. To support my claims about them, I had already made a number of orders from them before writing this review. They deliver high-quality goods on a consistent basis. They are flawlessly functioning, and I have never found any issues with them. I’ve been using the majority of them for a while now, and I’ve never had any problems with them when utilizing them. Due to this, I intended to keep making purchases from them. I strongly advise you to try their PCB goods and services because they are the greatest in this field!”Christopher Hardy, Owner of E-Products Shop from Peterborough, United Kingdom
“All throughout my journey with PCBTok, I never once experienced any issues with their communication and treatment towards me. They addressed all of my needs on time and assisted me until I received my 50 pieces Wireless PCB order from them. PCBTok is the ideal place to turn to if you’re still unsure about where to purchase your PCB necessities. They excel and are enthusiastic about what they do. I can assure you that trying their products and services is worth it.”Todd Patel, Process Engineer from Alabama, USA
“It was great working with PCBTok. They didn’t make the transaction with them difficult for me; instead, they made it simple for me to get my Wireless PCB. All of their knowledgeable staff is extremely courteous and committed to their job. They gave me a wonderful experience; therefore I can’t say anything else about them. Thank you to your dedicated employees! I intend to buy from this manufacturer again because they are such professionals!”Michael Taylor, Electrical Technologist from Vancouver, Canada
Wireless PCB: The Ultimate FAQ Guide
If you are curious about wireless PCBs, this Wireless PCBs: The Ultimate FAQ Guide is the perfect resource for you. Everything from basic terminology to the latest updates will be covered. There’s no need to go it alone; we’ll also cover some tips and tricks for beginners. We’ll also discuss how to get the most out of our PCBs and how to find the best supplier for your project.
Start by designing your wireless PCB. Most of us are not familiar with the various types of PCBs. If you have never layered a PCB before, here is an overview of the various component types. The two most common types of wires and components are solder paste layers and solder resist layers. They facilitate the flow of solder. As the name implies, the solder mask layer is a green protective layer that helps in the soldering of surface mount components.