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The Top-Notch Xbox PCB Manufacturer is PCBTok
We at PCBTok consistently work to enhance the functionality and performance of our Xbox PCB so that you may use only top-tier products in your applications.
- Twelve years as an expert PCB manufacturer.
- We provide a free sample piece before making a substantial purchase.
- We abide by the guidelines; we only use IPC Class 2 or 3 PCBs.
- Enough resources to fulfill your demands.
- Our professional team is accessible all the time to support your customized PCBs.
Absolutely Remarkable Xbox PCB by PCBTok
As one of the leading manufacturers in China, PCBTok always makes sure that your Xbox PCB is of its highest quality to guarantee that it will perform flawlessly.
We are a goal-driven company; our mission is to satisfy our consumers with our Xbox PCB products and service. Hence, we are always motivated to deliver only the finest.
In order to better serve our customers and meet their needs, PCBTok will continue to improve the quality of its goods.
All of these are made possible through the hands and minds of our expert team.
PCBTok wouldn’t be recognized worldwide for its remarkable Xbox PCB without the help of our professional team. Additionally, we highly appreciate the customers who were pleased with our products.
Xbox PCB By Feature
The Xbox One Controller PCB is among the most popular usage of this type of circuit board since this is the newly released controller in the gaming industry. Therefore, we at PCBTok carefully manufacture it.
The Xbox Switch PCB is another type of product that is a famous video game controller in the modern world; it has two individual units with an analog stick that you will attach to any smartphone to play a game.
The Xbox 360 Controller PCB is the primary console deployed in Microsoft Xbox 360; it can be a wired or wireless product. We can customize any type of controller depending on your specifications.
The Customized PCB is the perfect alternative to take if any of the mentioned controllers for the gaming console doesn’t suit your purpose, you have the freedom to design and incorporate components.
The Xbox 360 Slime Lite-On PCB is the main driver for the gaming console; it is not precisely the one that controls the game; instead, it is responsible for running the game loaded by the gamer of the 360.
The Prototype PCB is recommended for applications that require mass manufacturing; this will ensure that before producing the boards in bulk, you can check for any errors and flaws to reduce further repair costs.
Xbox PCB By Board Type (5)
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The Single-Sided PCB is the most affordable and popular type of board you can utilize if you’re planning to purchase in high volume. In addition, this type of board minimizes the probability of manufacturing issues.
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The Double-Sided PCB can be ideal for any intermediate level of circuit complexity since it offers more flexibility to its designers. Additionally, it has extra layers of copper that improve the board’s heat dissipation.
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The Multilayer PCB offers more durability; hence, it can be deployed in almost heavy applications set-up. If you’re seeking a more powerful board for your consoles, we highly recommend this type of board.
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The Rigid PCB is the most common type of board, not just for this particular product. This is frequently found in applications wherein the occurrences of moving and shaking are high such as for gaming consoles.
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The Rigid-Flex PCB offers more advantages than the rigid board type, including exceptional dynamic stability, enhanced circuit reliability, and versatility. They are frequently utilized in wearable devices and equipment.
Xbox PCB By Material (5)
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The Fiberglass Epoxy PCB is one of the most popular types of material deployed in this particular circuit board since it offers a high electrical insulator and versatility, is lightweight, and is reasonably priced.
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The FR4 PCB is the most popular type of material since it can provide various benefits to your applications, such as its compatibility with lead-free reflow technology since it is halogen-free and reasonably affordable.
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The Polyimide PCB is ideal for personal entertainment devices such as gaming consoles since it offers extraordinary electrical properties, exceptional chemical resistance, high flexibility, and a wide temperature range.
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The Fiberglass Epoxy Resin + Polyimide Resin PCB has the combined benefits of both these two materials. Hence, they can offer more to your applications.
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The Phenolic Paper Laminate PCB is the least popular type of material in this type of product; however, it offers good benefits. This includes better dimensional stability and excellent punch ability.
Xbox PCB Benefits
PCBTok can offer 24h online support for you. When you have any PCB-related questions, please feel free to get in touch.
PCBTok can build your PCB prototypes quickly. We also provide 24 hour production for quick-turn PCBs at our facility.
We often ship goods by international forwarders such as UPS, DHL, and FedEx. If they are urgent, we use priority express service.
PCBTok has passed ISO9001 and 14001, and also has USA and Canada UL certifications. We strictly follow IPC class 2 or class 3 standards for our products.
Perks of Utilizing PCBTok’s Xbox PCB
The PCBTok’s Xbox PCB has significant benefits for your application; this includes the following:
- Functionality – Since an Xbox PCB can operate multiple devices through a single board, they offer high functionality.
- Reliability – It provides outstanding dielectric strength and impedance control. Also, it has a High TG value. All of these help to make the board durable.
- Lifespan – Due to its exceptional dielectric properties and thermal management features, it is not prone to overheating. Thus, increasing its lifespan.
All of these mentioned pros are what you can enjoy for PCBTok’s Xbox PCB.
Designing Phase of Xbox PCB
If you plan to get your Xbox PCB designed by your trusted manufacturer; the following phases are what you’ll be experiencing:
- Approach – Tell your chosen manufacturer your specifications and purposes.
- Schematics – Strictly monitor this phase since this can affect the overall performance of your Xbox PCB.
- Designing – They will transfer your schematics into a PCB program layout.
- Generation – After approving the schematics and design, they will develop a Gerber file to form the bare board.
- Assembly – The integration of components will commence at this phase.
- Inspection – It should satisfy the established guidelines for Xbox PCB.
Considerations to Take Into Account Before Purchasing Xbox PCB
The following are the factors you might want to consider before ordering an Xbox PCB:
- Manufacturer – Check whether your chosen producer of your Xbox PCB offers standard-sized boards; this will make your purchases affordable.
- Schematic – Verify if they use up-to-date technologies in designing the schematics since it can determine the performance of the expected product.
- Designing – Choose a supplier that makes the process quick and efficient.
- Dimensions – We recommend going for the standard-size boards since customized sizes can add up to another expense.
- Final Checking – Ensure that your board’s design and layout are error-free
Kindly message us with any questions and concerns you may have.
Choose the Top-Rated Xbox PCB in the Industry from PCBTok
PCBTok has more than twelve years of experience in the industry; we have been entitled as one of the well-respected Xbox PCB manufacturers worldwide. We provide consistent, top-notch quality with high accuracy products at an affordable rate.
In addition, we always ensure that we are using reliable materials suitable for your demands and applications to avoid performance issues.
Our high-quality and reliable products are carefully manufactured in the hands of our skilled engineers and technicians. Additionally, we always ensure that our Xbox PCB products undergo various tests before shipping them to your addresses.
If you’re still wondering about the right producer to manufacture your Xbox PCBs, then look no further as PCBTok can produce a suitable product for your needs. Please send your inquiry today; we will be more than happy to assist you.
Xbox PCB Fabrication
One of the ways to optimize the trace of your Xbox PCB is by applying a surface finish. Hence, we will share with you the recommended polish for your board.
In PCBTok, we offer several choices for surface treatment. This includes HASL (Lead-Free), ENEPIG, Immersion Silver and Tin, ENIG, OSP, etc.
Among all of the mentioned polishes, we strongly advise selecting ENIG. This is the most widely used finish for an Xbox PCB due to its wide array of benefits.
Apart from the ENIG finish, some consumers also prefer using HASL and ENEPIG finish. However, you can still choose other finishes depending on your purpose.
Kindly message us to know the most suitable finish for your applications.
Since PCBTok values its consumers’ quality and feelings, we strictly conduct quality testing to ensure the Xbox PCBs can reach their optimum performance.
We perform manual and automatic tests: In-Circuit Testing, Visual Testing, X-Ray Inspection, Functional Testing, and Automated Optical Inspection.
If the Xbox PCB didn’t encounter any issues while we conducted the said testing and inspections, we would subject it to another evaluation to guarantee 100% quality.
In the evaluation phase, we perform a visual inspection, physical inspection, component testing, and integrated circuit inspections. This will solidify its reliability.
If you want an in-depth understanding of the tests, message us.
OEM & ODM Xbox PCB Applications
The Xbox PCB’s high functionality makes it capable of multitasking, and they are widely deployed in most consumer electronics devices.
One of the most widespread uses of an Xbox PCB is for gaming consoles since it offers a smooth controlling facility that provides the best gaming experience.
Since Xbox PCB offers fast and smooth facility performance and exceptional durability and reliability, they are widely deployed in aerospace controllers.
One of the benefits of any PCBTok PCB product is its waterproof capability; an Xbox PCB isn’t an exemption. Hence, they are widely used in wearable devices.
Since Xbox PCB can power simulation games, it is ideal for medical games that can be used for sparking creative thinking for healthcare individuals.
Xbox PCB Production Details As Following Up
- Production Facility
- PCB Capabilities
- Shipping Methods
- Payment Methods
- Send Us Inquiry
| NO | Item | Technical Specification | ||||||
| Standard | Advanced | |||||||
| 1 | Layer Count | 1-20 layers | 22-40 layer | |||||
| 2 | Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers400、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) | ||||||
| 3 | PCB Type | Rigid PCB/FPC/Flex-Rigid | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. | |||||
| 4 | Lamination type | Blind&buried via type | Mechanical blind&burried vias with less than 3 times laminating | Mechanical blind&burried vias with less than 2 times laminating | ||||
| HDI PCB | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | ||||||
| 5 | Finished Board Thickness | 0.2-3.2mm | 3.4-7mm | |||||
| 6 | Minimum Core Thickness | 0.15mm(6mil) | 0.1mm(4mil) | |||||
| 7 | Copper Thickness | Min. 1/2 OZ, Max. 4 OZ | Min. 1/3 OZ, Max. 10 OZ | |||||
| 8 | PTH Wall | 20um(0.8mil) | 25um(1mil) | |||||
| 9 | Maximum Board Size | 500*600mm(19”*23”) | 1100*500mm(43”*19”) | |||||
| 10 | Hole | Min laser drilling size | 4mil | 4mil | ||||
| Max laser drilling size | 6mil | 6mil | ||||||
| Max aspect ratio for Hole plate | 10:1（hole diameter＞8mil） | 20:1 | ||||||
| Max aspect ratio for laser via filling plating | 0.9:1(Depth included copper thickness) | 1:1(Depth included copper thickness) | ||||||
| Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size) |
0.8:1(drilling tool size≥10mil) | 1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil) | ||||||
| Min. depth of Mechanical depth-control(back drill) | 8mil | 8mil | ||||||
| Min gap between hole wall and conductor (None blind and buried via PCB) |
7mil(≤8L),9mil(10-14L),10mil(＞14L) | 5.5mil(≤8L),6.5mil(10-14L),7mil(＞14L) | ||||||
| Min gap between hole wall conductor (Blind and buried via PCB) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | ||||||
| Min gab between hole wall conductor(Laser blind hole buried via PCB) | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | ||||||
| Min space between laser holes and conductor | 6mil | 5mil | ||||||
| Min space between hole walls in different net | 10mil | 10mil | ||||||
| Min space between hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | ||||||
| Min space bwteen NPTH hole walls | 8mil | 8mil | ||||||
| Hole location tolerance | ±2mil | ±2mil | ||||||
| NPTH tolerance | ±2mil | ±2mil | ||||||
| Pressfit holes tolerance | ±2mil | ±2mil | ||||||
| Countersink depth tolerance | ±6mil | ±6mil | ||||||
| Countersink hole size tolerance | ±6mil | ±6mil | ||||||
| 11 | Pad(ring) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via) | 10mil(for 4mil laser via),11mil(for 5mil laser via) | ||||
| Min Pad size for mechanical drillings | 16mil(8mil drillings) | 16mil(8mil drillings) | ||||||
| Min BGA pad size | HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold) | HASL:10mil, LF HASL:12mil, other surface technics are 7mi | ||||||
| Pad size tolerance(BGA) | ±1.5mil(pad size≤10mil);±15%(pad size>10mil) | ±1.2mil(pad size≤12mil);±10%(pad size≥12mil) | ||||||
| 12 | Width/Space | Internal Layer | 1/2OZ：3/3mil | 1/2OZ：3/3mil | ||||
| 1OZ: 3/4mil | 1OZ: 3/4mil | |||||||
| 2OZ: 4/5.5mil | 2OZ: 4/5mil | |||||||
| 3OZ: 5/8mil | 3OZ: 5/8mil | |||||||
| 4OZ: 6/11mil | 4OZ: 6/11mil | |||||||
| 5OZ: 7/14mil | 5OZ: 7/13.5mil | |||||||
| 6OZ: 8/16mil | 6OZ: 8/15mil | |||||||
| 7OZ: 9/19mil | 7OZ: 9/18mil | |||||||
| 8OZ: 10/22mil | 8OZ: 10/21mil | |||||||
| 9OZ: 11/25mil | 9OZ: 11/24mil | |||||||
| 10OZ: 12/28mil | 10OZ: 12/27mil | |||||||
| External Layer | 1/3OZ：3.5/4mil | 1/3OZ：3/3mil | ||||||
| 1/2OZ：3.9/4.5mil | 1/2OZ：3.5/3.5mil | |||||||
| 1OZ: 4.8/5mil | 1OZ: 4.5/5mil | |||||||
| 1.43OZ（positive）:4.5/7 | 1.43OZ（positive）:4.5/6 | |||||||
| 1.43OZ（negative ）:5/8 | 1.43OZ（negative ）:5/7 | |||||||
| 2OZ: 6/8mil | 2OZ: 6/7mil | |||||||
| 3OZ: 6/12mil | 3OZ: 6/10mil | |||||||
| 4OZ: 7.5/15mil | 4OZ: 7.5/13mil | |||||||
| 5OZ: 9/18mil | 5OZ: 9/16mil | |||||||
| 6OZ: 10/21mil | 6OZ: 10/19mil | |||||||
| 7OZ: 11/25mil | 7OZ: 11/22mil | |||||||
| 8OZ: 12/29mil | 8OZ: 12/26mil | |||||||
| 9OZ: 13/33mil | 9OZ: 13/30mil | |||||||
| 10OZ: 14/38mil | 10OZ: 14/35mil | |||||||
| 13 | Dimension Tolerance | Hole Position | 0.08 ( 3 mils) | |||||
| Conductor Width(W) | 20% Deviation of Master A/W |
1mil Deviation of Master A/W |
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| Outline Dimension | 0.15 mm ( 6 mils) | 0.10 mm ( 4 mils) | ||||||
| Conductors & Outline ( C – O ) |
0.15 mm ( 6 mils) | 0.13 mm ( 5 mils) | ||||||
| Warp and Twist | 0.75% | 0.50% | ||||||
| 14 | Solder Mask | Max drilling tool size for via filled with Soldermask (single side) | 35.4mil | 35.4mil | ||||
| Soldermask color | Green, Black, Blue, Red, White, Yellow,Purple matte/glossy | |||||||
| Silkscreen color | White, Black,Blue,Yellow | |||||||
| Max hole size for via filled with Blue glue aluminium | 197mil | 197mil | ||||||
| Finish hole size for via filled with resin | 4-25.4mil | 4-25.4mil | ||||||
| Max aspect ratio for via filled with resin board | 8:1 | 12:1 | ||||||
| Min width of soldermask bridge | Base copper≤0.5 oz、Immersion Tin： 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area) | |||||||
| Base copper≤0.5 oz、Finish treatment not Immersion Tin ： 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area |
||||||||
| Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area) | ||||||||
| Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area) | ||||||||
| Base copper 2 oz-4 oz: 6mil, 8mil( on copper area) | ||||||||
| 15 | Surface Treatment | Lead free | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | |||||
| Leaded | Leaded HASL | |||||||
| Aspect ratio | 10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) | |||||||
| Max finished size | HASL Lead 22″*39″；HASL Lead free 22″*24″；Flash gold 24″*24″；Hard gold 24″*28″；ENIG 21″*27″；Flash gold(electroplated gold) 21″*48″；Immersion Tin 16″*21″；Immersion silver 16″*18″；OSP 24″*40″； | |||||||
| Min finished size | HASL Lead 5″*6″；HASL Lead free 10″*10″；Flash gold 12″*16″；Hard gold 3″*3″；Flash gold(electroplated gold) 8″*10″；Immersion Tin 2″*4″；Immersion silver 2″*4″；OSP 2″*2″； | |||||||
| PCB thickness | HASL Lead 0.6-4.0mm；HASL Lead free 0.6-4.0mm；Flash gold 1.0-3.2mm；Hard gold 0.1-5.0mm；ENIG 0.2-7.0mm；Flash gold(electroplated gold) 0.15-5.0mm；Immersion Tin 0.4-5.0mm；Immersion silver 0.4-5.0mm；OSP 0.2-6.0mm | |||||||
| Max high to gold finger | 1.5inch | |||||||
| Min space between gold fingers | 6mil | |||||||
| Min block space to gold fingers | 7.5mil | |||||||
| 16 | V-Cutting | Panel Size | 500mm X 622 mm ( max. ) | 500mm X 800 mm ( max. ) | ||||
| Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. | ||||||
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm( 16+/-4 mil ) | ||||||
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) | ||||||
| Groove Width | 0.50 mm (20mil) max. | 0.38 mm (15mil) max. | ||||||
| Groove to Groove | 20 mm (787mil) min. | 10 mm (394mil) min. | ||||||
| Groove to Trace | 0.45 mm(18mil) min. | 0.38 mm(15mil) min. | ||||||
| 17 | Slot | Slot size tol.L≥2W | PTH Slot: L：+/-0.13(5mil) W：+/-0.08(3mil) | PTH Slot: L：+/-0.10(4mil) W：+/-0.05(2mil) | ||||
| NPTH slot(mm) L+/-0.10 (4mil) W：+/-0.05(2mil) | NPTH slot(mm) L：+/-0.08 (3mil) W：+/-0.05(2mil) | |||||||
| 18 | Min Spacing from hole edge to hole edge | 0.30-1.60 (Hole Diameter) | 0.15mm(6mil) | 0.10mm(4mil) | ||||
| 1.61-6.50 (Hole Diameter) | 0.15mm(6mil) | 0.13mm(5mil) | ||||||
| 19 | Min spacing between hole edge to circuitry pattern | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) | |||||
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) | |||||||
| 20 | Image transfer Registration tol | Circuit pattern vs.index hole | 0.10(4mil) | 0.08(3mil) | ||||
| Circuit pattern vs.2nd drill hole | 0.15(6mil) | 0.10(4mil) | ||||||
| 21 | Registration tolerance of front/back image | 0.075mm(3mil) | 0.05mm(2mil) | |||||
| 22 | Multilayers | Layer-layer misregistration | 4layers: | 0.15mm(6mil)max. | 4layers: | 0.10mm(4mil) max. | ||
| 6layers: | 0.20mm(8mil)max. | 6layers: | 0.13mm(5mil) max. | |||||
| 8layers: | 0.25mm(10mil)max. | 8layers: | 0.15mm(6mil) max. | |||||
| Min. Spacing from Hole Edge to Innerlayer Pattern | 0.225mm(9mil) | 0.15mm(6mil) | ||||||
| Min.Spacing from Outline to Innerlayer Pattern | 0.38mm(15mil) | 0.225mm(9mil) | ||||||
| Min. board thickness | 4layers:0.30mm(12mil) | 4layers:0.20mm(8mil) | ||||||
| 6layers:0.60mm(24mil) | 6layers:0.50mm(20mil) | |||||||
| 8layers:1.0mm(40mil) | 8layers:0.75mm(30mil) | |||||||
| Board thickness tolerance | 4layers:+/-0.13mm(5mil) | 4layers:+/-0.10mm(4mil) | ||||||
| 6layers:+/-0.15mm(6mil) | 6layers:+/-0.13mm(5mil) | |||||||
| 8-12 layers:+/-0.20mm (8mil) | 8-12 layers:+/-0.15mm (6mil) | |||||||
| 23 | Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | ||||||
| 24 | Conductivity | <50Ω(typical:25Ω) | ||||||
| 25 | Test voltage | 250V | ||||||
| 26 | Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) | ||||||
PCBTok offers flexible shipping methods for our customers, you may choose from one of the methods below.
1. DHL
DHL offers international express services in over 220 countries.
DHL partners with PCBTok and offers very competitive rates to customers of PCBTok.
It normally takes 3-7 business days for the package to be delivered around the world.
2. UPS
UPS gets the facts and figures about the world’s largest package delivery company and one of the leading global providers of specialized transportation and logistics services.
It normally takes 3-7 business days to deliver a package to most of the addresses in the world.
3. TNT
TNT has 56,000 employees in 61 countries.
It takes 4-9 business days to deliver the packages to the hands
of our customers.
4. FedEx
FedEx offers delivery solutions for customers around the world.
It takes 4-7 business days to deliver the packages to the hands
of our customers.
5. Air, Sea/Air, and Sea
If your order is of large volume with PCBTok, you can also choose
to ship via air, sea/air combined, and sea when necessary.
Please contact your sales representative for shipping solutions.
Note: if you need others, please contact your sales representative for shipping solutions.
You can use the following payment methods:
Telegraphic Transfer(TT): A telegraphic transfer (TT) is an electronic method of transferring funds utilized primarily for overseas wire transactions. It’s very convenient to transfer.
Bank/Wire transfer: To pay by wire transfer using your bank account, you need to visit your nearest bank branch with the wire transfer information. Your payment will be completed 3-5 business days after you have finished the money transfer.
Paypal: Pay easily, fast and secure with PayPal. many other credit and debit cards via PayPal.
Credit Card: You can pay with a credit card: Visa, Visa Electron, MasterCard, Maestro.
